Patents Assigned to Samtec, Inc.
  • Interconnect system having retention features
    Patent number: 11196195
    Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: December 7, 2021
    Assignee: SAMTEC, INC.
    Inventors: R. Brad Bettman, Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, Edwin Loy
  • Transceiver assembly array with fixed heatsink and floating transceivers
    Patent number: 11177614
    Abstract: A cage assembly includes a cage including a top wall and a bottom wall and an electrical receptacle positioned between the top wall and the bottom wall such that the electrical receptacle floats within the cage in opposite directions between the top wall and the bottom wall.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: November 16, 2021
    Assignee: SAMTEC, INC.
    Inventors: Keith R. Guetig, Thomas A. Hall, III, Andrew R. Collingwood, John L. Nightingale, Eric J. Zbinden
  • Anti-backout latch for interconnect system
    Patent number: 11171432
    Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: November 9, 2021
    Assignee: SAMTEC, INC.
    Inventors: Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
  • Direct-attach connector
    Patent number: 11146002
    Abstract: A cable assembly includes a contact ribbon made of a single stamping and including pairs of first and second signal contacts and includes a cable including pairs of first and second center conductors connected to corresponding pairs of first and second signal contacts. The contact ribbon includes a ground plane, a first row of ground contacts extending from the ground plane in a row along a first side of the ground plane such that a first line extending through the first row of ground contacts does not intersect with any signal contacts, and a second row of ground contacts extending from the ground plane in a row along a second side of the ground plane such that a second line extending through the second row of ground contacts does not intersect with any signal contacts.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: October 12, 2021
    Assignee: SAMTEC, INC.
    Inventors: Travis S. Ellis, Norman S. McMorrow, Keith R. Guetig
  • Overmolded lead frame providing contact support and impedance matching properties
    Patent number: 11139619
    Abstract: An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: October 5, 2021
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck
  • Overmolded lead frame providing contact support and impedance matching properties
    Patent number: 11139620
    Abstract: An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: October 5, 2021
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck
  • Optical transceiver with versatile positioning
    Patent number: 11125956
    Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: September 21, 2021
    Assignee: SAMTEC, INC.
    Inventor: Eric Zbinden
  • Method for creating through-connected vias and conductors on a substrate
    Patent number: 11107702
    Abstract: A method to reduce the number and type of processing steps to achieve conductive lines in the planes of a substrate concurrently interconnecting conductor through the substrate, by forming structures in the planes of a substrate. These structures may include interconnect lines, bond pads, and other structures, and improve the performance of subsequent unique processing while simultaneously reducing the manufacturing complexity to reduce time and cost. These structures are formed by selective etching using chemical mechanical polishing, and then completed using a single fill step with a conductive material.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: August 31, 2021
    Assignee: SAMTEC, INC.
    Inventors: Fred Koelling, Alan D. Nolet, Daniel Long
  • Cage with an attached heatsink
    Patent number: 11089716
    Abstract: A transceiver assembly includes a cage and a heatsink. The cage includes first and second spaced apart walls and a third wall that spans the first and second walls. The third wall defines an opening, and the third wall includes two spring arms that each extend into the opening. The heatsink includes a heatsink body including a first surface and a protrusion that extends from the first surface of the heatsink body and a pair of spring-arm receivers positioned on the first surface of the heatsink body. Each of the pair of spring-arm engagement portions is configured to engage with a corresponding one of the two spring arms of the cage when the heatsink is attached to the cage.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: August 10, 2021
    Assignee: SAMTEC, INC.
    Inventors: Thomas A. Hall, III, Kevin R. Meredith
  • Printed circuit board having commoned ground plane
    Patent number: 11081822
    Abstract: An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: August 3, 2021
    Assignee: Samtec, Inc.
    Inventor: Jonathan E. Buck
  • Method and apparatus for terminating an electrical cable to an integrated circuit
    Patent number: 11071201
    Abstract: An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: July 20, 2021
    Assignee: SAMTEC, INC.
    Inventor: James Dunlop
  • Transceiver receptacle with EMI cage and bezel clips that provide high shielding effectiveness
    Patent number: 11056838
    Abstract: A receptacle includes a cage, a bezel opening in the cage, and at least one bezel clip mounted adjacent to the bezel opening. The at least one bezel clip includes first bezel fingers and second bezel fingers. The first bezel fingers are located along an inner surface of the cage. The second bezel fingers include outer fingers located along an outer surface of the cage and inner fingers located along the inner surface of the cage. The inner and outer fingers of the second bezel fingers are defined by the second bezel fingers passing through a through hole in the cage.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: July 6, 2021
    Assignee: SAMTEC, INC.
    Inventor: Gary E. Biddle
  • Compression-mounted electrical connector
    Patent number: 10985479
    Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: April 20, 2021
    Assignee: SAMTEC, INC.
    Inventors: Jonathan Earl Buck, Keith Guetig
  • Interconnect module for both panel and mid board mounting
    Patent number: 10892585
    Abstract: An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: January 12, 2021
    Assignee: SAMTEC, INC.
    Inventors: Jignesh Shah, Jean Karlo Williams Barnett, Eric Zbinden
  • Electrical connector
    Patent number: D924169
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: July 6, 2021
    Assignee: SAMTEC, INC.
    Inventors: Jonathan E. Buck, John A. Mongold
  • Electrical connector
    Patent number: D924170
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: July 6, 2021
    Assignee: SAMTEC, INC.
    Inventors: Jean Karlo Williams Barnett, Jignesh H. Shah, Eric Zbinden
  • Contact
    Patent number: D926144
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: July 27, 2021
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Contact
    Patent number: D926705
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: August 3, 2021
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Connector
    Patent number: D934813
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: November 2, 2021
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Connector
    Patent number: D940663
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: January 11, 2022
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck