Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.
Type:
Grant
Filed:
January 13, 2023
Date of Patent:
September 24, 2024
Assignee:
SAMTEC, INC.
Inventors:
John A. Mongold, Jonathan E. Buck, Jignesh H. Shah, Chadrick P. Faith, Randall E. Musser, Jean Karlo Williams Barnet, Norman S. McMorrow
Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.
Type:
Grant
Filed:
September 30, 2020
Date of Patent:
September 24, 2024
Assignee:
SAMTEC, INC.
Inventors:
Alan D. Nolet, Andrew Haynes Liotta, Troy Benton Holland, Thomas Jacob Hammann, Heidi Bates, Daniel Goia, Vishwas Vinayak Hardikar, Ajeet Kumar, Daniel Long, Nicole McGraw, Lauren Savawn Moen, Adam Owens
Abstract: Radio frequency (RF) waveguides and related interconnect members are disclosed. The interconnect members can have a smaller footprint than WR15 flanges. Further, the interconnect members can be configured to mate with complementary interconnects without undergoing substantial relative rotation.
Type:
Grant
Filed:
May 14, 2020
Date of Patent:
September 10, 2024
Assignee:
SAMTEC, INC.
Inventors:
Marc Epitaux, Shashi Chuganey, Kelly Garrison, Thomas Albert Hall, III, Cindy Lee Diegel, James Alexander Moss, Francisco Noyola, Yasuo Sasaki, Scott Mcmorrow
Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a textured surface that scatters or absorbs some of the light received from the first surface to attenuate the light exiting the optical block through the second surface.
Type:
Grant
Filed:
March 16, 2023
Date of Patent:
August 6, 2024
Assignee:
SAMTEC, INC.
Inventors:
Jignesh H. Shah, William J. Kozlovsky, David A. Langsam, Raymond J. Lee, R. Brad Bettman, Eric Jean Zbinden
Abstract: Modular block type of board connector having two different types of RF connectors and an optical cable with an optical connector. A RF connector with built-in impedance tuning and automatic biasing.
Type:
Grant
Filed:
March 8, 2022
Date of Patent:
July 30, 2024
Assignee:
SAMTEC, INC.
Inventors:
Clarence L. Clyatt, III, John A Mongold, Jonathan E. Buck, Andrew Woodson, Jason Ruzzi
Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.
Type:
Grant
Filed:
January 13, 2023
Date of Patent:
June 25, 2024
Assignee:
SAMTEC, INC.
Inventors:
John A. Mongold, Jonathan E. Buck, Jignesh H. Shah, Chadrick P. Faith, Randall E. Musser, Jean Karlo Williams Barnet, Norman S. McMorrow
Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a vacuum force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.
Type:
Grant
Filed:
March 29, 2019
Date of Patent:
June 11, 2024
Assignee:
SAMTEC, INC.
Inventors:
Alan Nolet, Daniel Goia, Vishwas Hardikar, Ajeet Kumar, Daniel Long, Andrew Liotta
Abstract: An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.
Abstract: A surgical instrument for use during a surgical procedure includes an instrument body, an ultrasonic transducer assembly extending along a longitudinal axis, a power cord, and a transducer slip joint. The ultrasonic transducer assembly is rotatably mounted within the instrument body about the longitudinal axis and defines a first outer profile. The power cord projects from the instrument body to provide electrical power to the ultrasonic transducer assembly for operating an acoustic waveguide. The transducer slip joint is positioned between the power cord and the ultrasonic transducer assembly and electrically and mechanically connects the power cord to the ultrasonic transducer assembly. The ultrasonic transducer assembly selectively rotates relative to the power cord for inhibiting the power cord from winding upon rotation of the ultrasonic transducer assembly. The transducer slip joint also defines a second outer profile that fits within the first outer profile of the ultrasonic transducer assembly.
Type:
Grant
Filed:
January 13, 2022
Date of Patent:
January 30, 2024
Assignees:
Cilag GmbH International, SAMTEC Inc.
Inventors:
Eric Roberson, James E. Borgelt, Douglas E. McCartin
Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.
Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.