Patents Assigned to Samtec, Inc.
  • Patent number: 12100908
    Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: September 24, 2024
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck, Jignesh H. Shah, Chadrick P. Faith, Randall E. Musser, Jean Karlo Williams Barnet, Norman S. McMorrow
  • Patent number: 12100647
    Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: September 24, 2024
    Assignee: SAMTEC, INC.
    Inventors: Alan D. Nolet, Andrew Haynes Liotta, Troy Benton Holland, Thomas Jacob Hammann, Heidi Bates, Daniel Goia, Vishwas Vinayak Hardikar, Ajeet Kumar, Daniel Long, Nicole McGraw, Lauren Savawn Moen, Adam Owens
  • Patent number: 12087989
    Abstract: Radio frequency (RF) waveguides and related interconnect members are disclosed. The interconnect members can have a smaller footprint than WR15 flanges. Further, the interconnect members can be configured to mate with complementary interconnects without undergoing substantial relative rotation.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: September 10, 2024
    Assignee: SAMTEC, INC.
    Inventors: Marc Epitaux, Shashi Chuganey, Kelly Garrison, Thomas Albert Hall, III, Cindy Lee Diegel, James Alexander Moss, Francisco Noyola, Yasuo Sasaki, Scott Mcmorrow
  • Patent number: 12055771
    Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a textured surface that scatters or absorbs some of the light received from the first surface to attenuate the light exiting the optical block through the second surface.
    Type: Grant
    Filed: March 16, 2023
    Date of Patent: August 6, 2024
    Assignee: SAMTEC, INC.
    Inventors: Jignesh H. Shah, William J. Kozlovsky, David A. Langsam, Raymond J. Lee, R. Brad Bettman, Eric Jean Zbinden
  • Patent number: 12051881
    Abstract: Modular block type of board connector having two different types of RF connectors and an optical cable with an optical connector. A RF connector with built-in impedance tuning and automatic biasing.
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: July 30, 2024
    Assignee: SAMTEC, INC.
    Inventors: Clarence L. Clyatt, III, John A Mongold, Jonathan E. Buck, Andrew Woodson, Jason Ruzzi
  • Patent number: 12021324
    Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: June 25, 2024
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck, Jignesh H. Shah, Chadrick P. Faith, Randall E. Musser, Jean Karlo Williams Barnet, Norman S. McMorrow
  • Patent number: 12009225
    Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a vacuum force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: June 11, 2024
    Assignee: SAMTEC, INC.
    Inventors: Alan Nolet, Daniel Goia, Vishwas Hardikar, Ajeet Kumar, Daniel Long, Andrew Liotta
  • Patent number: 11923640
    Abstract: An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: March 5, 2024
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck
  • Publication number: 20240061193
    Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.
    Type: Application
    Filed: October 20, 2023
    Publication date: February 22, 2024
    Applicant: Samtec, Inc.
    Inventors: Eric J. ZBINDEN, Thomas A. HALL, III
  • Patent number: 11883057
    Abstract: A surgical instrument for use during a surgical procedure includes an instrument body, an ultrasonic transducer assembly extending along a longitudinal axis, a power cord, and a transducer slip joint. The ultrasonic transducer assembly is rotatably mounted within the instrument body about the longitudinal axis and defines a first outer profile. The power cord projects from the instrument body to provide electrical power to the ultrasonic transducer assembly for operating an acoustic waveguide. The transducer slip joint is positioned between the power cord and the ultrasonic transducer assembly and electrically and mechanically connects the power cord to the ultrasonic transducer assembly. The ultrasonic transducer assembly selectively rotates relative to the power cord for inhibiting the power cord from winding upon rotation of the ultrasonic transducer assembly. The transducer slip joint also defines a second outer profile that fits within the first outer profile of the ultrasonic transducer assembly.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: January 30, 2024
    Assignees: Cilag GmbH International, SAMTEC Inc.
    Inventors: Eric Roberson, James E. Borgelt, Douglas E. McCartin
  • Patent number: 11846816
    Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: December 19, 2023
    Assignee: SAMTEC, INC.
    Inventor: Eric Zbinden
  • Patent number: 11828908
    Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: November 28, 2023
    Assignee: SAMTEC, INC.
    Inventors: Eric J. Zbinden, Thomas A. Hall, III
  • Patent number: D1024967
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: April 30, 2024
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Patent number: D1028904
    Type: Grant
    Filed: August 23, 2022
    Date of Patent: May 28, 2024
    Assignee: SAMTEC, INC.
    Inventors: Chadrick Paul Faith, Gary Ellsworth Biddle, Randall Eugene Musser, Jonathan Earl Buck
  • Patent number: D1039500
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: August 20, 2024
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Patent number: D1040766
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: September 3, 2024
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Patent number: D1041426
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: September 10, 2024
    Assignee: SAMTEC, INC.
    Inventors: Jonathan E. Buck, John A. Mongold
  • Patent number: D1043588
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: September 24, 2024
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Patent number: D1045804
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: October 8, 2024
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Patent number: D1049052
    Type: Grant
    Filed: May 25, 2023
    Date of Patent: October 29, 2024
    Assignee: SAMTEC, INC.
    Inventors: Chadrick Paul Faith, Dale Schmelz