Patents Assigned to Samtec, Inc.
  • Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
    Patent number: 11372178
    Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: June 28, 2022
    Assignee: SAMTEC, INC.
    Inventors: Eric J. Zbinden, Thomas A. Hall, III
  • Electrical connector having latch
    Patent number: 11289850
    Abstract: A first electrical connector includes a first latch that is configured to releasably engage a second latch of a second electrical connector when the first and second electrical connectors are mated to each other. The first latch can include an attachment portion that attaches to the connector housing of the first electrical connector, and an engagement portion that is movable with respect to the attachment portion between an engaged position and a disengaged position.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: March 29, 2022
    Assignee: SAMTEC, INC.
    Inventor: Chadrick Paul Faith
  • Filling materials and methods of filling through holes of a substrate
    Patent number: 11251109
    Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: February 15, 2022
    Assignee: SAMTEC, INC.
    Inventors: Tim Mobley, Roupen Leon Keusseyan
  • Interconnect system having retention features
    Patent number: 11196195
    Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: December 7, 2021
    Assignee: SAMTEC, INC.
    Inventors: R. Brad Bettman, Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, Edwin Loy
  • Transceiver assembly array with fixed heatsink and floating transceivers
    Patent number: 11177614
    Abstract: A cage assembly includes a cage including a top wall and a bottom wall and an electrical receptacle positioned between the top wall and the bottom wall such that the electrical receptacle floats within the cage in opposite directions between the top wall and the bottom wall.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: November 16, 2021
    Assignee: SAMTEC, INC.
    Inventors: Keith R. Guetig, Thomas A. Hall, III, Andrew R. Collingwood, John L. Nightingale, Eric J. Zbinden
  • Anti-backout latch for interconnect system
    Patent number: 11171432
    Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: November 9, 2021
    Assignee: SAMTEC, INC.
    Inventors: Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
  • Direct-attach connector
    Patent number: 11146002
    Abstract: A cable assembly includes a contact ribbon made of a single stamping and including pairs of first and second signal contacts and includes a cable including pairs of first and second center conductors connected to corresponding pairs of first and second signal contacts. The contact ribbon includes a ground plane, a first row of ground contacts extending from the ground plane in a row along a first side of the ground plane such that a first line extending through the first row of ground contacts does not intersect with any signal contacts, and a second row of ground contacts extending from the ground plane in a row along a second side of the ground plane such that a second line extending through the second row of ground contacts does not intersect with any signal contacts.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: October 12, 2021
    Assignee: SAMTEC, INC.
    Inventors: Travis S. Ellis, Norman S. McMorrow, Keith R. Guetig
  • Overmolded lead frame providing contact support and impedance matching properties
    Patent number: 11139620
    Abstract: An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: October 5, 2021
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck
  • Connector
    Patent number: D934813
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: November 2, 2021
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Connector
    Patent number: D940663
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: January 11, 2022
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Connector
    Patent number: D941252
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: January 18, 2022
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Electrical connector
    Patent number: D941779
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: January 25, 2022
    Assignee: SAMTEC, INC.
    Inventors: Jonathan E. Buck, John A. Mongold
  • Contact wafer
    Patent number: D941780
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: January 25, 2022
    Assignee: SAMTEC, INC.
    Inventors: Jonathan E. Buck, John A. Mongold
  • Connector
    Patent number: D949798
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: April 26, 2022
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Connector
    Patent number: D950498
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: May 3, 2022
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Connector
    Patent number: D950499
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: May 3, 2022
    Assignee: SAMTEC, INC
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Connector
    Patent number: D950500
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: May 3, 2022
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Connector
    Patent number: D950502
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: May 3, 2022
    Assignee: SAMTEC, INC
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Connector
    Patent number: D951202
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: May 10, 2022
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Connector
    Patent number: D951875
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: May 17, 2022
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck