Abstract: Apparatuses, systems, methods, and computer program products are disclosed for a multicore on-die memory controller. An integrated circuit device includes an array of non-volatile memory cells and a microcontroller unit. A microcontroller unit includes a plurality of processing units. Different processing units perform different categories of tasks in parallel for an array of non-volatile memory cells.

Abstract: A circuit includes selected sense circuits configured to be connected to selected bit lines and unselected sense circuits configured to be connected to unselected bit lines during a sense operation. When the sense circuit is connected to the unselected bit line during the sense operation, the sense circuit is locked out in order to reduce current consumption. However, noise from the locked out sense circuit may be transmitted to the sense circuits connected to the selected bit lines through adjacent bit line coupling. In order to reduce the effect of the noise, charge transfer from the sense node may be blocked from passing to the unselected bit lines. Or, charge may be drained from the sense node, thereby preventing the charge from passing to the unselected bit lines.

Abstract: Techniques for fast programming and read operations for memory cells. A first set of bit lines is connected to a first set of NAND strings and is interleaved with a second set of bit lines connected to a second set of NAND strings. The first set of NAND strings can be programmed by driving a voltage on the first set of bit lines while floating a voltage on the second set of bit lines, to reduce an inter-bit line capacitance and provide a relatively high access speed and a relatively low storage density (e.g., bits per memory cell). The second set of NAND strings can be programmed by concurrently driving a voltage on the first and second sets of bit lines, to provide a relatively low access speed and a relatively high storage density.

Abstract: An apparatus includes a programming circuit configured to deliver a series of program loops to a memory cell. The apparatus further includes a sensing circuit configured to sense an electrical characteristic of the memory cell for a sensing time during each program loop. The apparatus also includes an alteration circuit configured to alter the sensing time of a subsequent program loop in response to a programming condition.

Abstract: An apparatus includes a storage controller, a non-volatile memory die comprising a set of memory elements and a memory die controller associated with the non-volatile memory die. The memory die controller is configured to identify a portion of the non-volatile memory die for mapping logical addresses, read a header of a sub-portion of the identified portion, for a logical address, map a physical address corresponding to the logical address of the sub-portion to a physical-to-logical mapping and transmit the physical-to-logical mapping to the storage controller.

Abstract: Apparatus and method for performing wear leveling are disclosed. An ordered list of references to each of a set of memory blocks is stored. A set of memory blocks in the ordered list is sequentially allocating. The allocated set of memory blocks in the ordered list are erased in the sequence in which they were allocated.

Abstract: Techniques for reducing read disturb of memory cells in a two-tier stack having a lower tier and an upper tier separated by an interface. In a read operation, the channels of NAND strings are discharged before reading the selected memory cells. The discharge involves ramping up the word line voltages and grounding the ends of the NAND strings. To increase the discharge, a ramp up rate may be greater for the selected word line and for dummy memory cells adjacent to the interface, compared to the ramp up rate for the unselected word lines. In an option, the greater ramp up rate is also used for the word lines between the selected word line and the interface. In another option, the greater ramp up rate is used for the word lines in the same tier as the selected word line.

Abstract: Over a period of operation, non-volatile memory can develop a residual resistance that is impractical to remove. For example, in a NAND string of memory cells, trapped charge may build up in a region between the bit lines and drain side select gates, so that even when all the devices of a NAND string are in an “on” state, the NAND string will not conduct. This effect will skew both hard bit data determinations, indicating the data state of a selected memory cell, and soft bit data determinations which may correlate to the reliability of the hard bit data. Techniques are described to factor in such excessive residual resistance when determining the soft bit data.

Abstract: An input signal is split onto a first data path and a second data path. Values of the input signal above a threshold voltage level are propagated on the second data path and not on the first data path. The propagation of the signal from the input signal terminal through the first data path or the second data path is selectively controlled using two reference bias voltages generated based on a level of the signal.

Abstract: Techniques for reducing read disturb of memory cells. A discharge process reduces a channel gradient in a NAND string by using a two-step ramp up of adjacent word lines of the selected word line. The voltages of the adjacent word lines can be provided at an intermediate level while the selected word line voltage is spiked up to a read pass voltage and then decreased. The voltages of the adjacent word lines can then be increased from the intermediate level to a read pass voltage and maintained at that level during the sensing of the memory cells. The voltage of the selected word line is decreased from a read pass voltage to a positive control gate read voltage at the end of the discharge process.

Abstract: A sequencer circuit is configured to generate control signals for on-die memory control circuitry. The control signals may include memory operation pulses for implementing operations on selected non-volatile memory cells embodied within the same die as the sequencer (and other on-die memory control circuitry). The timing, configuration, and/or duration of the memory control signals are defined in configuration data, which can be modified after the design and/or fabrication of the die and/or on-die memory circuitry. As such, the timing, configuration, and/or duration of the memory control signals generated by the sequencer may be manipulated after the design and/or fabrication of the die, sequencer, and other on-die memory control circuitry.

Abstract: A storage device with a memory may include improved endurance and programming speed by modifying the programming states of the memory blocks. For example, the blocks may be three bit memory blocks, but a dynamic reassignment of verify levels and read margins can result in the block acting like a two bit memory block. Memory blocks may be designed for a certain number of bits per cell (i.e. number of states) and the programming is based on that number. However, single level cell (SLC) programming is still possible in addition to programming according to the number of bits per cell that the memory is designed for. Multiple SLC programming steps can be used to modify the number of states for certain memory cells by the memory controller.

Abstract: A non-volatile memory system comprises a memory structure and a control circuit connected to the memory structure. The control circuit includes a programmable and reprogrammable hybrid microcontroller having a state machine and one or more processors. The state machine is configured to generate a first set of execution signals in response to a request to perform memory operations on non-volatile memory cells in the memory system. The first set of execution signals have a format configured to interface with one or more circuits coupled to the non-volatile memory cells. The hybrid microcontroller has an interface that translates the first set of execution signals to instruction identifiers. The one or more processors execute instructions identified by the instruction identifiers to generate a second set of execution signals. The second set of execution signals are provided to the one or more circuits to perform the memory operations on the non-volatile memory cells.

Abstract: Disclosed includes a memory device and a method of operating the memory device. A voltage is applied to a word line coupled to first memory transistors of a first plurality of strings of transistors and second memory transistors of a second plurality of strings of transistors. A current flow through one or more of the first plurality of strings of transistors is enabled, while applying the voltage to the word line. A current flow through the second plurality of strings of transistors is disabled by floating source terminals and drain terminals of the second memory transistors, while enabling the current flow through the one or more of the first plurality of strings of transistors.

Abstract: Systems and methods for die crack detection are disclosed. In one exemplary embodiment, a die includes a first conductive segment, an intermediate conductive segment, and a second conductive segment. The crack detection ring substantially surrounds the die according to a serpentine path having a plurality of legs, wherein each leg intersects the first conductive segment at a first intersection, an intermediate conductive segment at an intermediate intersection and a second conductive segment at a second intersection, wherein the intermediate intersection is horizontally offset from at least the first intersection and the second intersection.

Abstract: Apparatuses, systems, and methods are presented for column replacement. An input register, which includes a set of input divisions, may receive write data for a memory array. An output register, which includes a set of normal output divisions and a set of replacement output divisions, may output write data to an array. A column replacement circuit may selectively couple input divisions to output divisions. A column replacement circuit may couple normal output divisions for functional columns of an array to corresponding input divisions. A column replacement circuit may couple replacement output divisions for functional columns of an array to input divisions selected by the column replacement circuit, which may be corresponding input divisions or other input divisions.

Abstract: Disclosed herein is related to a system and a method of adjusting a programming pulse for programming memory cells. In one aspect, the system includes a controller that iteratively applies a programming pulse to the memory cells during programming loops. The programming pulse has progressively increasing magnitudes to program different subsets of the memory cells to corresponding target states. The controller determines that a programming loop to program a subset of the memory cells targeted to have a corresponding target state of the target states is performed. The controller counts a number of memory cells of the subset that have not reached the target state. The controller determines a magnitude for a programming pulse to be applied for a subsequent programming loop based on the counted number, and applies, during the subsequent programming loop, the programming pulse with the determined magnitude.

Abstract: Techniques are described for reducing an injection type of program disturb in a memory device. A charge isolation region is created in a channel of a NAND string on the source side of the selected word line, WLn, and spaced apart from WLn by one or more other word lines, when the program voltage is increased to a program voltage (Vpgm). The isolation region is created by applying 0 V or other low voltage to an isolation word line. The isolation region is maintained for a first portion of a time period in which Vpgm is applied. The charge isolation region can be modified based on factors associated with a risk of program disturb including the magnitude of Vpgm, the position of WLn in a set of word lines and an ambient temperature.

Abstract: Apparatuses, systems, and methods are disclosed for skip inconsistency correction. A skip circuit is configured to skip memory units for read operations and write operations of a memory array, based on a record of memory units identified as faulty. A skip inconsistency detection circuit is configured to detect a skip inconsistency in read data from a memory array. A correction circuit is configured to correct a skip inconsistency and output corrected read data.

Abstract: A duty cycle correction circuit includes an AND/OR logic circuit that reduces duty cycle distortion in a pair of input signals. The AND/OR logic circuit includes a first push-pull circuit configured to generate a first output signal in response to receipt of a first pair of delayed input signals, and a second push-pull circuit configured to generate a second output signal in response to receipt of a second pair of delayed input signals. The first and second push-pull circuits may have matching beta ratios. Additionally, a latch is coupled to output nodes of the first and second push-pull circuits. The latch is configured to maintain magnitude levels at the output nodes during delay offset periods of the first and second pairs of delayed input signals.