Abstract: A circuit includes a program controller configured to perform a program operation with interleaved program-verify loops to program memory cells in a same block. During each program-verify loop, a control gate line voltage supply circuit first supplies a program pulse to a first cell of the block and then, before verifying the first cell, supplies a program pulse to a second cell of the block. After the program pulses are sent, the control gate line supply circuit consecutively supplies verify pulses to the first cell and the second cell such that a delay is introduced between the respective program and verify stages of the first and second cells. Additionally, a constant voltage bias on common control gate lines of the first and second memory cells is applied during the consecutive verify stages. Further, an order of verify pulses may be applied in a reverse order during a verify stage.

Abstract: Detecting a word line leakage in a non-volatile memory array. Various methods include: in a first step, enabling a M-bit “coarse” digital-to-analog converter (DAC) logic of an N-bit analog-to-digital converter (ADC) to, according to a clock signal of the coarse DAC, compare a reference voltage and a biased input voltage of a load current of the memory array, wherein the reference voltage is dependent upon the voltage level at which the input voltage becomes non-linear, and, in a second step, if the input voltage is greater than or equal to the reference voltage, enabling a P-bit “fine” ramp digital-to-analog converter (DAC) logic of the ADC to enable drawing a second current from the load current to ramp down the input voltage and to begin a counter and conduct leakage detection with the ADC when the input voltage is in the range between a first voltage and a second voltage.

Abstract: A method and system for executing a dynamic 1-tier scan on a memory array are provided. The memory array includes a plurality of memory cells organized into a plurality of sub-groups. The dynamic 1-tier scan includes executing an program loop in which cells of a first sub-group are counted to determine whether a numeric threshold is met, and, if the numeric threshold is met with respect to the first sub group, at least one additional program loop is executed in which cells of a second sub-group are counted to determine whether the numeric threshold is met with respect to the second sub-group.

Abstract: A non-volatile memory system and corresponding method of operation are provided. The system includes non-volatile memory cells, each retaining a threshold voltage within a threshold window. The non-volatile memory cells include multi-bit cells each configured to store a plurality of bits of data with the threshold window partitioned into bands each having a band width. The bands include a lowest band denoting an erased state and increasing bands. A control circuit programs a first set of the data into the multi-bit cells in a single-bit mode using first target states being one of the erased state and a tight intermediate state having a distribution of the threshold voltage no wider than the band width of one of the increasing bands. The control circuit also programs a second set of the data into the multi-bit cells in a multi-bit mode with each of the multi-bit cells storing the plurality of bits.

Abstract: A method is provided that includes forming a memory cell that includes a memory element coupled in series with an isolation element. The isolation element includes a vertical thin-film transistor and a threshold selector device.

Abstract: A non-volatile semiconductor memory device includes an electrically data rewritable non-volatile semiconductor memory cell and a write circuit for writing data in the memory cell, the write circuit writing a data in the memory cells by supplying a write voltage Vpgm and a write control voltage VBL to the memory cell, continuing the writing of the data in the memory cell by changing the value of the write control voltage VBL in response to an advent of a first write state of the memory cell and inhibiting any operation of writing a data to the memory cell by further changing the value of the write control voltage VBL to Vdd in response to an advent of a second write state of the memory cell.

Abstract: A source side programming method and system are provided. A bad trigger block, of a plurality of blocks of a memory array, may be detected by determining a threshold voltage distribution of a drain side select gate of a block and determining whether the distribution is abnormal. If the distribution is abnormal, the block is a bad trigger block which may cause a failure in another block. IF the block is a bad trigger block, source side programming is performed on at least one word line of the bad trigger block by applying a non-zero voltage to at least one source side word line of the bad trigger block via a source side line.

Abstract: Techniques are described for programming memory cells with reduced widening of the threshold voltage distributions. Bit line voltages are adjusted during verify tests for memory cells assigned to the upper data state in a pair of adjacent data states which are concurrently verified. An elevated bit line voltage is applied and then stepped up in successive program loops. A lower, fixed bit line voltage is used for verifying the lower data state in the pair of adjacent data states. In one option, the step size increases progressively over the program loops. In another option, the minimum level of the elevated bit line voltage is lower for higher data states. In another option, the minimum level of the elevated bit line voltage is set as a function of data states, program-erase cycles and/or temperature.

Abstract: Techniques are provided to reduce neighbor word line interference and charge loss in a multi-pass program operation. In one implementation, the first pass of a multi-pass program operation uses one or more program pulses without performing associated verify tests. The memory cells may be programmed to different intermediate threshold voltage (Vth) distributions in the first program pass. Different bit line voltages can be used to obtain the different intermediate Vth distributions when the single program pulse is applied. In other cases, multiple program pulses are applied without performing verify tests. The intermediate Vth distributions can be provided for the memory cells assigned to the higher data states but not the lower data states, or for memory cells assigned to both the higher and lower data states.

Abstract: Techniques for reducing neighbor word line interference (NWI) of memory cells which are formed in a two-tier stack having a lower tier and an upper tier separated by an interface. In one approach, an upward word line programming order is used for a top portion of the top tier, and a downward word line programming order is used for a bottom portion of the top tier and for the bottom tier. Additionally, for memory cells which receive NWI from both adjacent word lines, options include programming fewer bits per cell, performing multi-pass programming and/or use lower verify voltages. Options also include increasing a control gate length of the memory cells and increasing a height of a dielectric region adjacent to the memory cells.

Abstract: Techniques for reducing read disturb of memory cells in a two-tier stack having a lower tier and an upper tier separated by an interface. In a read operation, the channels of NAND strings are discharged before reading the selected memory cells. A discharge period is set based on a position of the selected word line in a stack or block of memory cells. The discharge period is longer when the selected word line is in the lower tier than in the upper tier. Additionally, the discharge period is longer when the selected word line is at a top of the lower tier than at a bottom of the lower tier. Other options to increase the discharge include increasing a ramp up rate and a peak level of the word line voltages during the discharge period as a function of the position of the selected word line.

Abstract: In a memory system having a storage controller and a plurality of distinct sets of non-volatile memory devices, each respective channel controller of a plurality of channel controllers, each channel controller corresponding to a distinct set of the plurality of distinct sets of non-volatile memory devices, determines a backlog of the respective channel controller in accordance with pending commands in one or more command queues, receives power credits allocated by the storage controller, based at least in part on the backlog of the respective channel controller, and while executing commands in the one or more command queues, limits execution of said commands in accordance with the received power credits. For example, limiting execution includes deferring execution of a respective command in accordance with a determination that executing the respective command would require power credits in excess of power credits available in the respective channel controller.

Abstract: Techniques for reducing read disturb of memory cells in a two-tier stack having a lower tier and an upper tier separated by an interface. In a read operation, the channels of NAND strings are discharged before reading the selected memory cells. A discharge period is set based on a position of the selected word line in a stack or block of memory cells. The discharge period is longer when the selected word line is in the lower tier than in the upper tier. Additionally, the discharge period is longer when the selected word line is at a top of the lower tier than at a bottom of the lower tier. Other options to increase the discharge include increasing a ramp up rate and a peak level of the word line voltages during the discharge period as a function of the position of the selected word line.

Abstract: A storage system with several integrated components and method for use therewith are provided. In one embodiment, a storage system comprising: a plurality of non-volatile memory devices; a controller in communication with the plurality of non-volatile memory devices; a plurality of data buffers in communication with the controller and configured to store data sent between the controller and an input/output bus; and a command and address buffer configured to store commands and addresses sent from a host, wherein the command and address buffer is further configured to synchronize data flow into and out of the plurality of data buffer; wherein at least three of the above components are integrated with each other.

Abstract: An electronic system may include a controller that measures a plurality of temperatures of the electronic system. Each of the plurality of temperatures may be indicated by one of a plurality of temperature voltages, each of which is generated across the same voltage-generation circuit. The controller and the voltage-generation circuit may be located on a component of the system, such as an integrated circuit, and external temperature sensors may provide their respective temperature signals to an input circuit located on the component. The controller may switch between activating and deactivating a temperature sensor located on the component and the input circuit to generate the plurality of temperature voltages across the voltage-generation circuit at different time intervals.

Abstract: Techniques are provided for pre-charging NAND strings during a programming operation. The NAND strings are in a block that is divided into vertical sub-blocks. During a pre-charge phase of a programming operation, an overdrive voltage is applied to some memory cells and a bypass voltage is applied to other memory cells. The overdrive voltage allows the channel of an unselected NAND string to adequately charge during the pre-charge phase. Adequate charging of the channel helps the channel voltage to boost to a sufficient level to inhibit programming of an unselected memory cell during a program phase. Thus, program disturb is prevented, or at least reduced. The technique allows, for example, programming of memory cells in a middle vertical sub-block without causing program disturb of memory cells that are not to receive programming.

Abstract: Techniques are disclosed for reducing an injection type of program disturb in a memory device. In one aspect, a discharge operation is performed at the start of a program loop. This operation discharges residue electrons from the channel region on the source side of the selected word line, WLn, to the channel region on the drain side of WLn. As a result, in a subsequent channel pre-charge operation, the residue electrons can be more easily removed from the channel. The discharge operation involves applying a voltage pulse to WLn and a first set of drain-side word lines which is adjacent to WLn. The remaining unselected word lines may be held at ground during the voltage pulse.

Abstract: Techniques are provided for optimizing a program operation in a memory device to compensate for program speed variations due to block oxide thinning. In one approach, during a program operation, a program voltage which indicates program speed is acquired from sub-blocks with the highest and lowest program speeds. An initial program voltage for intermediate sub-blocks can be determined based on the acquired program voltages and the positions of the intermediate sub-blocks. The technique can accommodate a loss of one or both acquired program voltages if the programming is interrupted. In another approach, a program voltage which indicates program speed is acquired from one sub-block, and for a later-programmed sub-block, an appropriate offset is located from a table and summed with the acquired program voltage to determine an optimum initial program voltage.

Abstract: Techniques are described for detecting a short circuit between a word line and a source line in a memory device, and to a method for recovering from such a short circuit. In one aspect, the short circuit is detected in a program operation when a selected word line completes programming after an unusually low number of program loops. A further check is performed to confirm that there is a short circuit. The short circuited word line is then erased and a recovery read is performed for previously-programmed word lines. In another aspect, a short circuit is detected in a read operation.

Abstract: Techniques are disclosed for reducing an injection type of read disturb in a memory device. During a program loop, when NAND strings in a selected sub-block are programmed, a pre-verify voltage pulse is applied to a selected word line and to a select gate transistor to discharge the drain-side channel in NAND strings of unselected sub-blocks. The duration of the pulse can vary for the different unselected sub-blocks and can be based on a sub-block programming order. In another aspect, the duration is higher for initial program loops in a program operation, when lower data states are being verified, and then decreases to a lower level for subsequent program loops when higher data states are being verified.