Abstract: A method is provided that includes forming a transistor by forming a gate dielectric layer above a substrate, forming a spacer dielectric layer above the gate dielectric layer, and forming a gate adjacent the gate dielectric layer and above the spacer dielectric layer.

Abstract: A non-volatile memory system is provided that includes a plurality of NAND strings of non-volatile storage elements, each non-volatile storage element including a control gate, a tunneling layer, a floating gate, and a blocking layer including a ferroelectric material. The tunneling layer is disposed between the control gate and the floating gate, and the floating gate is disposed between the tunneling layer and the blocking layer.

Abstract: A data storage device includes a write cache, a non-volatile memory and a controller coupled to the write cache and to the non-volatile memory. The controller is configured to, responsive to receiving a plurality of flush commands, write all data from the write cache to the non-volatile memory while executing fewer than all of the plurality of flush commands.

Abstract: An apparatus is provided that includes a plurality of memory cells, a programming circuit configured to apply a plurality of programming pulses to the memory cells, and a scanning circuit configured to repeatedly switch between performing an n-state bitscan after each programming pulse until first predetermined criteria are satisfied, and performing an m-state bitscan after each programming pulse until second predetermined criteria are satisfied, where m>n, and n>0.

Abstract: Technology is described herein for performing multiplication using non-volatile memory cells. A multiplicand may be stored a node that includes multiple non-volatile memory cells. A multiplicand is stored a node that includes multiple non-volatile memory cells. Each memory cell in the node is connected to the same bit line, in one aspect. A multiply voltage may be applied to each memory cell in the node. Each memory cell in the node responds to the multiply voltage by passing a memory cell current to a bit line. The multiply voltage(s) are simultaneously applied to each memory cell in the node, such that the memory cell current of each memory cell flows in the bit line. The magnitude of the bit line current represents a product of the multiplier and the multiplicand. Vector/vector multiplication may be performed using “n” nodes of memory cells connected to the same bit line.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for accessing non-volatile memory. An apparatus includes one or more memory die. A memory die includes an array of non-volatile memory cells, a set of ports, and an on-die controller. The set of ports includes a first port and a second port. The first port includes a first plurality of electrical contacts and the second port includes a second plurality of electrical contacts. The on-die controller communicates via the set of ports to receive command and address information and to transfer data for a data operation on the array of non-volatile memory cells. The on-die controller uses the first port and the second port in a first mode and uses the first port without the second port in a second mode. The second mode provides compatibility with an interface of a legacy type of memory die.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for accessing non-volatile memory. An apparatus includes one or more memory die. A memory die includes an array of non-volatile memory cells, a set of ports, and an on-die controller. A set of ports includes a first port and a second port. A first port includes a first plurality of electrical contacts and a second port includes a second plurality of electrical contacts. An on-die controller communicates via a set of ports to receive command and address information and to transfer data for data operations on an array of non-volatile memory cells. An on-die controller uses a first port to receive command and address information and to transfer data. An on-die controller uses a second port to transfer data but not to receive command and address information.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for queueing commands for storage operations. An apparatus includes a command queue configured to queue storage commands received at a storage device and a controller for the storage device. A controller is configured to receive a storage command on a first port of a storage device. A controller is configured to queue a received storage command as an entry in a command queue. An entry in a command queue indicates a type of a received storage command. A controller is configured to service a received storage command from a command queue on a second port of a storage device based on a type of the received storage command indicated by an entry in the command queue associated with the received storage command.

Abstract: A bad block of memory cells is quickly detected and removed from further programming during concurrent multi-block program operations, to minimize a threshold voltage upshift in a good block. A difference in program speeds between the blocks can be quickly detected by detecting when the memory cells in each block pass a verify test, such as a verify test of a lowest programmed data state. If a first block passes the verify test at a reference program loop, a determination is made as to whether a second block passes the verify test within a specified number of additional program loops. If the second block meets this criterion, the program operation can continue for both blocks. However, if the second block does not meet this criterion, the program operation is terminated for the second block by isolating it from subsequent program and verify signals.

Abstract: Technology is described herein for performing multiplication using non-volatile memory cells. A multiplicand may be stored a node that includes multiple non-volatile memory cells. Each memory cell in a node may be programmed to one of two physical states, with each non-volatile memory cell storing a different bit of the multiplicand. Multiplication may be performed by applying a multiply voltage to the node of memory cells and processing memory cell currents from the memory cells in the node. The memory cell current from each memory cell in the node is multiplied by a different power of two. The multiplied signals are summed to generate a “result signal,’ which represents a product of the multiplier and a multiplicand stored in the node. If desired, “binary memory cells” may be used to perform multiplication. Vector/vector and vector/matrix multiplication may also be performed.

Abstract: Apparatuses and techniques are provided for accurately reading memory cells by compensating for lateral charge diffusion between adjacent memory cells. A selected memory cell is read with a compensation which is based on classifying the threshold voltages of adjacent memory cells into bins. In one aspect, the compensation is based on the level of the current control gate voltage of the selected word line. In another aspect, the classifying of the threshold voltages of the adjacent memory cells can be a function of temperature. In another aspect, a memory cell can be read with compensation after a previous read operation without compensation results in an uncorrectable error. In another aspect, the classifying uses more bins for a selected edge word line.

Abstract: Apparatuses, systems, and methods are disclosed for concurrently programming non-volatile storage cells, such as those of an SLC NAND array. The non-volatile storage cells may be arranged into a first block comprising a first string of storage cells that intersects with a first word line at a first storage cell, a second block comprising a second string of storage cells that intersects with a second word line at a second storage cell, a bit line electrically connectable to the first string and the second string, and controller configured to apply a programming pulse, at an elevated voltage, to the first word line and second word line to concurrently program the first and second storage cells.

Abstract: Apparatuses and techniques are described for reducing an injection type of program disturb in a memory device. A voltage on a selected word line is increased in a first step from an initial level such as 0 V to an intermediate, pass level such as Vpass, and in a second step from Vpass to a peak program level of Vpgm. A voltage on an adjacent unselected word line can be increased from the initial level to Vpass and then temporarily increased to an elevated level of Vpass_el during the second step increase on the selected word line. This helps reduce the magnitude of a channel gradient between the selected word line and the adjacent word line. The increase to Vpass_el may be implemented for program loops in the later part of a program operation, when Vpgm and the risk of program disturb is relatively high.

Abstract: A circuit includes a program controller configured to perform a program operation with interleaved program-verify loops to program memory cells in a same block. During each program-verify loop, a control gate line voltage supply circuit first supplies a program pulse to a first cell of the block and then, before verifying the first cell, supplies a program pulse to a second cell of the block. After the program pulses are sent, the control gate line supply circuit consecutively supplies verify pulses to the first cell and the second cell such that a delay is introduced between the respective program and verify stages of the first and second cells. Additionally, a constant voltage bias on common control gate lines of the first and second memory cells is applied during the consecutive verify stages. Further, an order of verify pulses may be applied in a reverse order during a verify stage.

Abstract: A memory system includes a sense system configured to control parasitic noise sources by increasing selected bit line or channel voltages during sense stages. The increase may be tied to a triggering threshold voltage level. That is, while performing a memory operation, the sense system may increase the selected bit line voltage level dependent on a reference voltage level or memory state associated with a sense stage being above the triggering threshold level.

Abstract: A program circuit may two-dimensionally program data into cells by applying different selected bit line or channel voltages to different bit lines or channels located in different bit line zones of a block during a program operation. The block may be further separated or divided into word line zones. The program circuit may adjust the different bit line or channel voltages as it programs in different word line zones of the block. In accordance with the two-dimensional programming, the program circuit may perform single-pulse program-only SLC program operations.

Abstract: Apparatuses and techniques are described for programming memory cells with a narrow threshold voltage (Vth) distribution in a memory device. In a first program pass of a multi-pass program operation, pass voltages of the word lines adjacent to a selected word line are adjusted to increase electron injection in a portion of a charge-trapping layer between the selected word line and an adjacent source side unselected word line. In a second, final program pass of the multi-pass program operation, the pass voltages are adjusted to reduce electron injection in the portion of the charge-trapping layer between the selected word line and the adjacent source side unselected word line.

Abstract: A memory system or flash card may include a mechanism for memory cell measurement and analysis that independently measures/predicts memory wear/endurance, data retention (DR), read disturb, and/or remaining margin. These effects may be independently quantified by analyzing the state distributions of the individual voltage levels of the cells. In particular, a histogram of cell voltage distributions of the memory cells can be analyzed to identify signatures for certain effects (e.g. wear, DR, read disturb, margin, etc.). Those measurements may be used for block cycling, data loss prediction, or adjustments to memory parameters. Pre-emptive action at the appropriate time based on the measurements may lead to improved memory management and data management. That action may include calculating the remaining useful life of data stored in memory, cycling blocks, predicting data loss, trade-off or dynamic adjustments of memory parameters.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for an on-die capacitor. A memory chip comprises an array of memory cells. A capacitor is electrically coupled to an array of memory cells. A capacitor receives at least a portion of discharged electricity from an operation for an array of memory cells. A capacitor supplies electricity back to an array of memory cells during a subsequent operation for an array of memory cells.

Abstract: Techniques for fast programming and read operations for memory cells. A first set of bit lines is connected to a first set of NAND strings and is interleaved with a second set of bit lines connected to a second set of NAND strings. The first set of NAND strings can be programmed by driving a voltage on the first set of bit lines while floating a voltage on the second set of bit lines, to reduce an inter-bit line capacitance and provide a relatively high access speed and a relatively low storage density (e.g., bits per memory cell). The second set of NAND strings can be programmed by concurrently driving a voltage on the first and second sets of bit lines, to provide a relatively low access speed and a relatively high storage density.