Abstract: A substrate processing method includes a liquid film forming step of forming a liquid film, a liquid film heat retaining step of keeping the liquid film warm, a gas phase layer forming step of forming a gas phase layer which holds the processing liquid on a center portion of the liquid film, an opening forming step of forming an opening in the center portion of the liquid film by excluding the processing liquid held by the gas phase layer, a substrate rotating step of rotating the substrate around a rotation axis, and an opening expanding step of expanding the opening, while a state in which the gas phase layer is formed on an inner circumferential edge of the liquid film is maintained, by moving the irradiation region toward a circumferential edge portion of the substrate while the liquid film heat retaining step and the substrate rotating step are performed.

Abstract: It is an object of the present invention to reduce the amount of data used in an apparatus, a system, and a method for performing a substrate processing. In order to achieve this object, a substrate processing apparatus includes one or more processing units each for performing a processing on a substrate and one or more arithmetic processing parts. One or more arithmetic processing parts generate a flow recipe defining a flow of a series of processings for a substrate by combining two or more processing recipes among a plurality of processing recipes each defining a processing condition relating to a processing to be performed on a substrate in the one or more processing units. The plurality of processing recipes include a plurality of liquid processing recipes each defining a condition of a processing to be performed on a substrate by using a processing liquid.

Abstract: The inventive substrate treatment method includes: an organic solvent supplying step of supplying an organic solvent having a smaller surface tension than a rinse liquid to the upper surface of a substrate so that rinse liquid adhering to the upper surface of the substrate is replaced with the organic solvent; a higher temperature maintaining step of maintaining the upper surface of the substrate at a predetermined temperature higher than the boiling point of the organic solvent to thereby form a gas film of the organic solvent on the entire upper surface of the substrate including the gap of the minute pattern and to form a liquid film of the organic solvent on the gas film, the higher temperature maintaining step being performed after the organic solvent supplying step is started; and an organic solvent removing step of removing the organic solvent liquid film from the upper surface of the substrate.

Abstract: A shift amount detecting chart is formed on web paper, and the shift amount detecting chart is photographed by an image pickup unit. An image processor calculates shift amounts smaller than a maximum shift amount in absolute values as correction values based on a variation trace of density peak positions from image data corresponding to the shift amount detecting chart photographed by the image pickup unit. A controller corrects printing timing with these correction values. Consequently, even when temporal variations occur to the shift amounts within a predetermined length, since the correction values are calculated based on the shift amounts smaller than the maximum shift amount in absolute values, an excessive correction can be prevented, thereby to improve printing quality.

Abstract: A substrate processing apparatus includes a substrate processor and a substrate transporter. The substrate processor includes an upper holding device and a lower holding device configured to be capable of holding a substrate. In the substrate processor, the lower holding device is provided below the upper holding device. Therefore, a height position at which a substrate can be held by the upper holding device is different from a height position at which the substrate can be held by the lower holding device. The substrate transporter has first and second hands that hold a substrate. The second hand is located farther downwardly than the first hand. A substrate is received from or transferred to the upper holding device by the first hand. A substrate is received from or transferred to the lower holding device by the second hand.

Abstract: A cleaner comes into contact with a lower-surface center region of a substrate held by a first holder, so that the lower-surface center region is cleaned. The cleaner comes into contact with a lower-surface outer region of the substrate rotated by a second holder, so that the lower-surface outer region of the substrate is cleaned. During cleaning of the lower-surface center region, the second holder is rotated about a vertical axis while not holding the substrate. Alternatively, during cleaning of the lower-surface center region, the gas injector arranged between the cleaner and the second holder injects gas toward the substrate from a first height spaced apart from the substrate by a predetermined distance. Further, during drying of the lower-surface center region, the gas injector injects gas toward the substrate from a second height closer to the substrate than the first height.

Abstract: The disclosure relates to a method for etching a molybdenum feature, comprising the steps of: a) oxidizing a thickness portion of the molybdenum feature using a thermal oxidation process to form a thermal molybdenum oxide layer, and b) dissolving the thermal molybdenum oxide layer using a wet chemistry.

Abstract: Disclosed is a printing apparatus in which web paper is transported to a printing face contact roller in a swirling form while a direction thereof is turned by first to fourth turning rollers. Heating units are arranged so as to face a printing face of the web paper between the two first and second turning rollers, between the two third and fourth turning rollers, and between the fourth turning roller and the printing face contact roller individually. Such arrangement can achieve a compact drying mechanism. The heating units each directly heat inks on the printing face, and thus do not overheat the web paper. Moreover, the heating units are not directed upward. This avoids contact of the web paper to a front side face of each of the heating units when the web paper slackens.

Abstract: Disclosed are a substrate treating apparatus and a substrate transporting method. A first treating block includes a developing-treatment layer and an interface layer arranged in an up-down direction. Accordingly, the interface layer is couplable with the indexer block. Moreover, a substrate transport mechanism of the indexer block transports a substrate from one of buffer units located at a predetermined height position in a substrate buffer to another of the buffer units located at a different height position in the substrate buffer. Accordingly, the interface layer is accessible to the buffer unit located at a height position corresponding to the interface layer. Thus, the interface layer can be made compact. Moreover, the interface layer is located in the upper part or the lower part of the developing-treatment layer, leading to reduction in footprint.

Abstract: A printing system, including a printing apparatus that sends a print paper after printing to a post-processing machine and a web buffer that temporarily holds a print paper after printing, is provided with: a required print time calculation unit that calculates a required print time for each job; an increase and decrease amount calculation unit that calculates an increase and decrease amount of a consumption amount of the buffer per set for each job on the basis of a difference between a minimum processing time required for a process in a post-processing machine and the required print time; a predicted value calculation unit that obtains a predicted value of the consumption amount of the web buffer by accumulating increase and decrease amounts; and a conveyance control unit that controls a conveyance speed of print paper on the basis of the predicted value.

Abstract: A preceding wafer is transported from a chamber of a heat treatment apparatus after processing on the preceding wafer is completed. A temperature within the chamber at a time when the preceding wafer is transported from the chamber is defined as a transportation temperature, and a difference between a measurement temperature within the chamber measured after the preceding wafer is transported from the chamber and the transportation temperature is calculated as a decreasing temperature. The calculated decreasing temperature and a predetermined threshold value are compared with each other. When the decreasing temperature is larger than the threshold value, dummy processing of preheating an in-chamber structure such as a susceptor by light irradiation from halogen lamps and flash lamps is executed. In contrast, when the decreasing temperature is equal to or smaller than the threshold value, the dummy processing is not executed but processing on a subsequent substrate is started.

Abstract: A lower-surface center region of a substrate held by a first holder is cleaned by a cleaner. A lower-surface outer region of the substrate rotated by a second holder is cleaned by the cleaner. A mobile base provided with the second holder and the cleaner is moved in a horizontal plane such that a reference position of the first holder coincides with a center axis of the second holder in a plan view when the substrate is received and transferred between the first holder and the second holder, and is moved in the horizontal plane such that the cleaner overlaps with the lower-surface center region of the substrate held by the first holder and a center axis of the cleaner coincides with a first portion different from a center of the substrate in the plan view when the lower-surface center region is cleaned.

Abstract: A lower-surface brush includes a base portion, a first cleaning portion and a second cleaning portion. The first cleaning portion is provided on an upper surface of the base portion to project upwardly from the upper surface of the base portion and extend in one direction through a geometric center of the base portion in a plan view. The second cleaning portion is provided on the upper surface of the base portion to project upwardly from the upper surface of the base portion and extend along an outer edge of the base portion. Alternatively, one or a plurality of pairs of second cleaning portions may be provided on the upper surface of the base portion to project upwardly from the upper surface of the base portion and be opposite to each other with the first cleaning portion interposed therebetween.

Abstract: Disclosed is a substrate treating system and a substrate transporting method. For instance, it is assumed that an indexer block, a first treating block, and a second treating block are arranged in this order. In this case, for transporting a substrate treated in the second treating block to an indexer block, the substrate is necessarily sent through the first treating block without any treatment in the first treating block. However, the first treating block and the second treating block are both connected to the indexer block. Therefore, transportation of the substrate is performable directly from the second treating block to the indexer block without through the first treating block. Therefore, reduction in throughput is suppressible.

Abstract: A data processing method includes: acquiring time series data; acquiring evaluation values; performing classification; and performing extraction. In the acquiring of the time series data, a plurality of time series data acquired by a substrate processing device are acquired. In the acquiring of the evaluation values, the evaluation values of the plurality of time series data are acquired. In the performing of classification, each of the plurality of time series data is classified into one of a plurality of classifications based on the evaluation value. In the performing of extraction, the time series data corresponding to one of the plurality of classifications is extracted as extracted time series data.

Abstract: Disclosed is a substrate treating apparatus for performing a predetermined treatment on a substrate. The apparatus includes: a holding mechanism including a plurality of support pins configured to rotate between a holding position and a delivery position, a first magnetic part configured to rotate the support pins individually between the holding position and the delivery position by switching surrounding magnetic poles, and a second magnetic part configured to rotate the support pins individually to the holding position by constantly applying a magnetic field to the first magnetic part; and a switching mechanism configured to apply no magnetic field of a third magnetic part to the first magnetic part normally and apply a magnetic field of the third magnetic part to the first magnetic part to rotate the support pins individually to the delivery position only when the substrate is delivered.

Abstract: To provide an adjusting method for a printing apparatus, and the printing apparatus, capable of appropriately adjusting drive voltages of heads even when printing conditions are changed, this invention can appropriately acquire adjusted voltages of the heads even when printing conditions are changed. That is, according to this invention, a construction is configured to change an adjustable range of head drive voltages with a printing mode. This invention acquires the adjustable range corresponding to the printing mode set by referring to a table T1. Consequently, the adjusted voltages of the heads can be determined within the adjustable range suited to each printing mode.

Abstract: An organ preservation system includes an organ container, an organ holder, a liquid supply tube, a drainage tube, and a pressure regulator. The organ container has a closed organ preservation space. The organ holder holds an organ in the organ preservation space. The liquid supply tube supplies a liquid to the organ. The drainage tube drains the liquid from the organ. The pressure regulator regulates air pressure in the organ preservation space. The organ container includes first to third connectors providing communication between the organ preservation space and an exterior space. The first, second, and third connectors are detachably connected to a liquid supply tube, a drainage tube, and a suction tube, respectively. When the organ is preserved ex vivo while being perfused with the liquid, the organ can be connected with ease to the tubes, and this ensures hermetical sealing of the space where the organ is preserved.

Abstract: A substrate processing apparatus 100 includes a processing unit, a reservoir 31, a processing liquid pipe 32, a pump 34, a filter 35, a first flow rate section 36, a first return pipe 51, a first adjustment valve 52, a second return pipe 41, a branch supply pipe 16, a second flow rate section 42, and a controller. The first flow rate section 36 is placed in the processing liquid pipe 32 and measures a flow rate or pressure of the processing liquid flowing through the processing liquid pipe 32. The first adjustment valve 52 is placed in the first return pipe 51 and adjusts a flow rate of the processing liquid flowing through the first return pipe 51. The controller controls an opening degree of the first adjustment valve 52 based on the flow rate or the pressure of the processing liquid measured by the first flow rate section 36.

Abstract: A liquid film of a processing liquid containing at least one of sulfuric acid, a sulfate, peroxosulfuric acid, and a peroxosulfate, or a processing liquid containing hydrogen peroxide is formed on a substrate. A plasma is radiated to the liquid film. Thereby, a substrate processing method in which substrate processing using an oxidizing power of the processing liquid can be efficiently performed is provided.