Abstract: A method for building an image determination model that determines whether a print image is a good image or a failure image includes a step of determining whether the print image is a high-density image or a low-density image; a step of generating teaching data by combining pseudo-failure data with to-be-combined image data, based on a result of the determination; and a step of performing machine learning. Regarding the combining of the pseudo-failure data, for a print image determined to be the high-density image, low-density pseudo-failure data is combined with to-be-combined image data, and for a print image determined to be the low-density image, high-density pseudo-failure data is combined with to-be-combined image data.
Abstract: A base material processing apparatus includes a transport mechanism, a mark detector, and a calculating unit. The transport mechanism transports an elongated strip-shaped base material in a longitudinal direction thereof along a predetermined transport path. The mark detector acquires a detection result by detecting a mark continuously at a detecting position on the transport path. The mark is applied previously to an end of the base material in a width direction thereof. The calculating unit calculates a transport speed of the base material, the amount of positional deviation of the base material in a transport direction, and tension on the base material applied in the transport direction on the basis of the detection result and information about the mark applied previously to the base material.
Abstract: It is provided a technique capable of noninvasively and quantitatively evaluating the state of cultured three-dimensional cell-based structure. A method of evaluating a three-dimensional cell-based structure according to the present invention comprises: performing tomography of the cultured three-dimensional cell-based structure (step S103); generating stereoscopic data indicating the three-dimensional shape of the three-dimensional cell-based structure based on image data acquired by the tomography (step S104); and counting the number of structures isolated from each other in the three-dimensional cell-based structure based on the stereoscopic data (step S105).
December 5, 2017
Date of Patent:
June 28, 2022
SCREEN HOLDINGS CO., LTD., NATIONAL UNIVERSITY CORPORATION TOTTORI UNIVERSITY
Abstract: A frame includes a ring-shaped body part locatable to surround the periphery of an organ, and at least one tube clamp part mounted on the body part. Each tube clamp part includes a tube holder that holds a tube. The tube clamp part is mounted so as to be movable in the circumferential direction of the body part. Thus, a tube connected to the organ can be fixed at an appropriate position to the tube clamp part. This stabilizes the relative positions of the organ and the tube. Accordingly, it is possible to reduce the probability of the organ becoming damaged due to a strain on the organ.
Abstract: A substrate processing apparatus includes a substrate holding portion which holds a substrate W. The substrate holding portion includes two movable holding pins and two fixed holding pins which sandwich the substrate. The substrate processing apparatus includes two support pins which support the substrate W held by the substrate holding portion from below. Each of the support pins has an inner portion which overlaps the substrate held by the substrate holding portion in a vertical direction. An upper end of the support pin is on a side below an overlapping portion of the substrate which overlaps the inner portion in the vertical direction.
Abstract: The printing medium M after color printing is performed on the front surface M1 (recording surface) by the color printing unit 32 can be conveyed while the front surface M1 and the back surface M2 of the printing medium M are inverted twice by the only rollers 471 to 478 (rotary bodies) in contact with the back surface M2 (non-recording surface) of the printing medium M (inverting conveying part 47). In this way, without providing air turn bars, a time to convey the printing medium M from the color printing unit 32 to the white printing unit 33 can be secured while the printing medium M is firmly supported by the rollers 471 to 478 in contact with the back surface M2 of the printing medium M.
Abstract: In a forward movement, an article is conveyed to a printing device via a transfer position while being kept mounted in a first holder for printing by the printing device. The article is returned to the transfer position together with the first holder after printing. An article to be printed after the above article is mounted into a second holder in parallel with at least a part of the forward movement, the printing and a return movement. This is capable of printing on the articles in a short throughput time also when the articles are those having a three-dimensional shape such as bottles and in-vehicle components.
Abstract: A substrate processing apparatus includes: a spin base rotatable in a horizontal plane about a centered rotary axis; a holder to hold a substrate above the spin base; a lower surface processing unit to discharge a processing liquid toward a lower surface of the substrate held by the holder. The holder includes: a plurality of first abutting members that abut the substrate from a position obliquely below said substrate and that hold the substrate in a horizontal posture in a position spaced from an upper surface of said spin base; a plurality of second abutting members that abut the substrate from a position lateral to said substrate and that hold said substrate in a horizontal posture in a position spaced from the upper surface of said spin base.
Abstract: In a substrate processing apparatus, a transport robot which transports a substrate between an indexer part and a substrate processing part is installed in a substrate transport part. The transport fan filter unit is provided in an upper part of the substrate transport part. An exhaust port is provided in the substrate transport part. The circulation piping allows the exhaust port of the substrate transport part and the transport fan filter unit to communicate with each other. The exhaust pipe is connected to the circulation piping. The inert gas supply part supplies an inert gas to the circulation piping. The circulation fan filter unit is disposed downstream of a connecting portion of the circulation piping with the exhaust pipe to be parallel to a flow path of the circulation piping.
Abstract: From a stage of preheating by a halogen lamp to irradiation with a flash by a flash lamp, a radiation thermometer is used for measuring the temperature of a back surface of a semiconductor wafer. A increased temperature ?T is determined by which the back surface of the semiconductor wafer is increased in temperature from the preheating temperature by irradiation with a flash. The specific heat of the semiconductor wafer has a known value. Further, the increased temperature ?T is proportionate to the magnitude of energy applied to a front surface of the semiconductor wafer by irradiation with a flash. Thus, a front surface attained temperature of the semiconductor wafer can be determined using the increased temperature ?T of the back surface of the semiconductor wafer during irradiation with a flash.
Abstract: A method of estimating the congestion degree and the number of people with high accuracy and at a low cost, without requiring a surveillance camera, is provided. Provided are a congestion degree estimating step of estimating a congestion degree based on sensor information (such as acceleration information) of a portable terminal device, an average congestion degree calculating step of calculating an average congestion degree for each mesh (reference range) set in advance, based on the congestion degree estimated in the congestion degree estimating step for a plurality of portable terminal devices, and an estimated number-of-people calculating step of calculating an estimated number of people for each mesh by multiplying the average congestion degree calculated in the average congestion degree calculating step by a base number of people (maximum number of accommodated people) determined in advance for each mesh.
Abstract: A light diffusion plate made of quartz and provided with a plurality of grooves each having an inclined surface is placed on an upper chamber window so as to be in opposed relation to a central portion of a semiconductor wafer. Flashes of light emitted from flash lamps and passing by the side of the light diffusion plate impinge upon a peripheral portion of the semiconductor wafer. On the other hand, flashes of light emitted from the flash lamps and entering the light diffusion plate are refracted by the inclined surfaces of the plurality of grooves. Part of the light entering the light diffusion plate is diffused toward the peripheral portion of the semiconductor wafer. As a result, this increases the amount of light impinging upon the peripheral portion of the semiconductor wafer, and decreases the amount of light impinging upon the central portion of the semiconductor wafer. Thus, the in-plane uniformity of an illuminance distribution on the semiconductor wafer is increased.
Abstract: Definition is calculated for each pixel in a plurality of captured images while changing a focal position. For each coordinates, an image reference value indicating the number of a to-be-referenced captured image is determined. Then, a luminance value is calculated for each coordinates on the basis of the image reference value and the definition. At this time, the luminance value in the captured image indicated by the image reference value of peripheral coordinates is reflected in the luminance value in the captured image indicated by the image reference value of each coordinates. The calculated luminance values are combined to generate an omnifocal image. Accordingly, a smooth omnifocal image is generated. The image reference values themselves are not changed. This prevents unnecessary luminance values of pixels existing in captured images that ought not to be referenced from appearing in the omnifocal image.
Abstract: A substrate treatment method is provided, including: holding a substrate on a substrate holding unit; rotating the substrate holding unit to rotate the substrate; raising a cup member surrounding an outer periphery of the substrate holding unit to locate an upper end of the cup member in an upper end position higher than an upper surface of the substrate held on the substrate holding unit; discharging a treatment liquid from a discharge port of a nozzle located lower than the upper end position to an end portion of the upper surface of the substrate held on the substrate holding unit; an imaging process, acquiring captured images of an imaging region by a camera, wherein the imaging region contains the treatment liquid discharged from the discharge port and is seen from an imaging position above the substrate; and determining a discharge state of the treatment liquid based on the captured images.
Abstract: A web drying apparatus, comprises: a blow-drying part which has two blower units arranged on both sides of web which is transferred in a transfer direction, and injects gas onto the web passing through a dry path between the two blower units; a housing which has a sidewall provided with an opening facing the dry path from the transfer direction, through which the web passes in the transfer direction through the opening, and houses the blow-drying part; an exhaust part which is disposed between the sidewall and the blow-drying part in the housing and exhausts gas from the inside of the housing to the outside of the housing; and a rectifying member which is disposed between the blow-drying part and the exhaust part in the housing and faces the web being transferred in the transfer direction.
Abstract: A silicon semiconductor wafer is transported into a chamber, and preheating of the semiconductor wafer is started in a nitrogen atmosphere by irradiation with light from halogen lamps. When the temperature of the semiconductor wafer reaches a predetermined switching temperature in the course of the preheating, oxygen gas is supplied into the chamber to change the atmosphere within the chamber from the nitrogen atmosphere to an oxygen atmosphere. Thereafter, a front surface of the semiconductor wafer is heated for an extremely short time period by flash irradiation. Oxidation is suppressed when the temperature of the semiconductor wafer is relatively low below the switching temperature, and is caused after the temperature of the semiconductor wafer becomes relatively high. As a result, a dense, thin oxide film having good properties with fewer defects at an interface with a silicon base layer is formed on the front surface of the semiconductor wafer.
Abstract: A substrate processing device is provided. A chamber has a side wall part and a top wall part and contains a substrate holding part. A first gas supply part is disposed in the top wall part and supplies a first gas toward a side on which the substrate holding part is positioned. A second gas supply part is contained in the chamber and supplies a second gas to an inside of the chamber. A control unit controls the first and second gas supply part. The second gas is a gas different from oxygen and an allotrope of oxygen. The second gas supply part has an air feeding port part which is positioned on an upward side of a holding position of a substrate by the substrate holding part in a vertical direction and is positioned on an outward side of the substrate holding part in a horizontal direction.
Abstract: A substrate carrier apparatus includes a hand, an advancing/retracting mechanism, an elevation mechanism, a movement mechanism, and a detector. The advancing/retracting mechanism moves the hand in a forward and backward direction to cause the hand to enter and be retracted from a substrate container. The elevation mechanism elevates the hand so that the hand lifts a substrate from below. The movement mechanism moves the hand to a position facing the substrate container. The detector detects a position of the substrate in the forward and backward direction in an entry state where the advancing/retracting mechanism causes the hand to enter the substrate container, moves integrally with the hand, and is disposed at a position adjacent to the substrate in a measurement direction intersecting with the forward and backward direction.
Abstract: The ink I is circulated along the circulation channel We at the low-speed flow rate Vl lower than that during the execution of the print mode when the print mode is stopped (Steps S107, S110). By circulatingly supplying the ink I to the discharge heads H in this way, the deterioration of the ink I can be also suppressed while the drying of the ink I is suppressed.
Abstract: The inventive substrate treatment method includes: an organic solvent supplying step of supplying an organic solvent having a smaller surface tension than a rinse liquid to the upper surface of a substrate so that rinse liquid adhering to the upper surface of the substrate is replaced with the organic solvent; a higher temperature maintaining step of maintaining the upper surface of the substrate at a predetermined temperature higher than the boiling point of the organic solvent to thereby form a gas film of the organic solvent on the entire upper surface of the substrate including the gap of the minute pattern and to form a liquid film of the organic solvent on the gas film, the higher temperature maintaining step being performed after the organic solvent supplying step is started; and an organic solvent removing step of removing the organic solvent liquid film from the upper surface of the substrate.