Abstract: Provided is a flux, flux residue of which keeps a predetermined viscosity during reflow and after a reflow step without hindering wettability of a solder alloy, the flux being compatible with an underfill in an underfill hardening step. The flux contains a thermosetting resin, a hardening agent, an organic acid and a solvent in which the flux contains 3% or more by mass to 8% or less by mass of the resin, 1% or more by mass to 5% or less by mass of the hardening agent to remain within a limit of an additive amount of the resin, 5% or more by mass to 15% or less by mass of the organic acid and a remainder of the solvent.

Abstract: A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste exhibits high joint strength at room temperature and at high temperatures, excels in terms of temporal stability, exhibits minimal void formation, and can form highly cohesive joints. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: a powdered intermetallic compound that comprises copper and tin and has metal barrier layers covering the surfaces thereof and a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.

Abstract: A method for soldering a surface-mount component onto a circuit board. The melting of die-bonding solder material is prevented by using a mounting solder material when soldering a surface-mount component formed using the die-bonding solder material onto a printed circuit board. The surface-mount component, formed using (Sn—Sb)-based solder material having high melting point, the (Sn—Sb)-based solder material containing Cu but not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material or (Sn—Ag—Cu—Bi—In)-based solder material as the mounting solder material and with the solder material being applied on the terminal portion. Since solidus temperature of the die-bonding solder material is 243 degrees C. and liquidus temperature of the mounting solder material is about 215 through 220 degrees C.

Abstract: Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.

Abstract: Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball (1) contains a Cu ball (2) made of Cu or a Cu alloy and a solder layer (3) which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (2). The solder layer (3) contains not less than 0.1% through not more than 3.0% of Cu and the remainder is composed of Sn and impurities.

Abstract: A method of printing solder paste on a substrate through minute apertures in a mask member, in which the solder paste is supplied to the apertures of the mask member under less than atmospheric pressure and has a viscosity so that the solder paste is filled in the apertures under atmospheric pressure. It is preferable that the solder paste has a viscosity of 50 through 150 Pa·s and a thixotropic ratio of 0.3 through 0.5. Further, the solder paste is obtained by mixing a flux containing solvent having a boiling point such that volatilization thereof is suppressed under the less than atmospheric pressure and solder powders. It is preferable that in the flux, the solvent having the boiling point of 240° C. or more is used and the solvent is octanediol.

Abstract: To provide a sliding member which has hardness that is suitable for the circumstance, to which heavy load is applied, and which is excellent in abrasion resistance property. The sliding member contains a sliding layer for slidably supporting a body to be slid, shot blasting being performed on a surface of the sliding layer, and a sliding surface formed on a surface of the sliding layer, the sliding surface having an uneven configuration with arithmetic mean roughness (Ra) of 1.0 ?m through 2.5 ?m, 10-point average roughness (Rz) of 5.0 ?m through 10.0 ?m, and surface hardness (Hv) of 220 through 250.

Abstract: The invention enables quick evacuation of a chamber to a specified target degree of vacuum while increasing selectivity of evacuation conditions. A vacuum-processing device contains a chamber 40 that enables a workpiece to be soldered in a vacuum environment, an operating part 20 that sets a condition for evacuating the chamber 40, a pump 23 that evacuates the chamber 40, and a control portion 61 that calculates the amount of decrease in the degree of vacuum when evacuating the chamber 40 using a predetermined pump output, sets the calculated value as a reference value and switches an evacuation property from the evacuation property including a lower pump output to the evacuation property including a higher pump output when the calculated amount of decrease in degree of vacuum in real time has become smaller than the reference value.

Abstract: The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material. The surface-mount component formed using (Sn—Sb)-based solder material having high melting point as the solder material for die pad, the (Sn—Sb)-based solder material containing Cu not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material as the mounting solder material with the solder material being applied on the terminal portion. The melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.

Abstract: A soldering apparatus including a flux-applying device having a nut that is fitted into the soldering apparatus and the flux-applying device can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each apparatus or device is used for a long time are adhered. The nut screws on to the screw shaft having a predetermined length. The nut is provided with at least one non-meshing part that does not mesh with the screw shaft and is formed parallel to a movement direction thereof. The non-meshing part extends from a forward end of the nut to a rear end thereof along whole length of the nut.

Abstract: A pattern formed on a silicon wafer is fine so that solder bumps formed on the silicon wafer are also fine and hence, when a failure occurs, the failure cannot be corrected so that an entire silicon wafer as a workpiece is discarded. Provided is a correction method where, on solder bumps formed on the silicon wafer, a mask in which holes are formed with the same pattern as the solder bumps is placed so as to cover the solder bumps and, thereafter, molten solder is caused to come into contact with the solder bumps through the mask thus filling hole portions of the mask with the molten solder.

Abstract: Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-4% of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.

Abstract: Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-4% of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.

Abstract: A flux for a resin flux cored solder contains 30% or more by mass but 80% or less by mass rosin ester and 5% or more by mass but 15% or less by mass activator. The total content ratio of base materials including the rosin ester is preferably equal to or more than 85% by mass but equal to or less than 95% by mass.

Abstract: A cleaning flux contains as a solvent 60-98% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine. An addition amount of the alkylene oxide-resorcinol copolymer is within a range of 0-98% by weight and the addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-98% by weight. The cleaning flux further includes one or both of an organic acid and a halogen compound. The addition amount of the organic acid is within the range of 0-18% by weight and the addition amount of the halogen compound is within the range of 0-4% by weight.

Abstract: A soldering apparatus which can keep an interior of a chamber at a specified vacuum pressure and can perform soldering in the chamber, the vacuum pressure of which is optimally adjusted, is provided with a chamber (40) in which a work (1) is solderable under vacuum environment, an operation part (21) that inputs and sets vacuum pressure in the chamber (40), a pump (23) that performs vacuum drawing on the interior of the chamber (40), a pressure sensor (24) that detects pressure in the chamber (40), and a control portion (61) that adjusts the set vacuum pressure in the chamber (40) based on a pressure detection signal (S24) output from the pressure sensor (24), and keeps the set vacuum pressure for a predetermined period of time, as shown in FIG. 4.

Abstract: A soldering apparatus as a conveyance apparatus includes a substrate loading portion to load a substrate on the soldering apparatus, an intermittent feeding unit to intermittently feed the substrate loaded on the soldering apparatus, a substrate discharge portion to discharge the intermittently fed substrate to the outside of the soldering apparatus and a controller to control conveyance of the substrate. The substrate loading portion includes a first conveyance path to convey the substrate, a first sensor provided in the vicinity of a substrate loading inlet of the substrate loading portion, and a second sensor arranged in a downstream side of the first sensor along the substrate conveyance direction. The intermittent feeding unit includes a second conveyance path for conveying the substrate, and a third sensor placed in the vicinity of an upstream end of the intermittent feeding unit along the substrate conveyance direction.

Abstract: A solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1 to 0.8%; Ag: 0 to 0.3%; Cu: 0 to 0.7%; P: 0.001 to 0.1%, with the balance being Sn. A total amount of Ag and Bi is from 0.3 to 0.8% in the alloy composition.

Abstract: Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.

Abstract: Provided is a solder material which enables a growth of an oxide film to be inhibited. A solder ball which is a solder material is composed of a solder layer and a covering layer covering the solder layer. The solder layer is spherical and is composed of a metal material containing an alloy including Sn content of 40% and more. Otherwise the solder layer is composed of a metal material including Sn content of 100%. In the covering layer, a SnO film is formed outside the solder layer, and a SnO2 film is formed outside the SnO film. A thickness of the covering layer is preferably more than 0 nm and equal to or less than 4.5 nm. Additionally, a yellow chromaticity of the solder ball is preferably equal to or less than 5.7.