Abstract: The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 ?m or more to 1000 ?m or lower.

Abstract: A solder scattering is prevented at the time of reflow and the oxide films formed on the surfaces of solder or electrodes are thoroughly removed. The soldering method according to the present invention contains the steps of: applying solder paste to the electrode on a printed circuit board and mounting an electronic part on the solder paste, volatilizing the residue-free flux contained in the solder paste by heating the printed circuit board in a chamber set to be a vacuum state and approximately 180 degree C. at the time of pre-heating (interval A), removing oxide films formed on the electrode and the like by heating the printed circuit board in the chamber set to be a formic acid atmospheric state and the temperature of approximately 200 degree C. at the time of reducing (interval B), and melting solder powder contained in the solder paste by heating the printed circuit board in the chamber set to be a vacuum state and the temperature of 250 degree C. at the time of main heating (interval C).

Abstract: A defect may occur in which as the amount of fluid discharged by a fluid discharge device decreases, a mask is not filled with the fluid even when the fluid is discharged. In order to fill a workpiece with the fluid, it is necessary to replace air in the workpiece corresponding to a discharge part with the fluid. The air in the workpiece is removed in advance, thereby filling the workpiece with the discharged fluid. A fluid discharge device in which, at one end of a discharge head, a suction port for sucking air in the mask on the workpiece, and a fluid discharge device having a discharge nozzle formed thereon for discharging the fluid are formed is used.

Abstract: A solder alloy having an alloy composition consisting of, in mass %, Ag: 1% to 4%, Cu: 0.5% to 0.8%, Bi: more than 4.8% and 5.5% or less. Sb: more than 1.5% and 5.5% or less, Ni: 0.01% or more and less than 0.1%, Co: more than 0.001% and 0.1% or less, the balance being Sn. The alloy composition satisfies the following three relationships: 0.020%?Ni+Co?0.105%; 9.1%?Sb+Bi?10.4%; and 4.05×10?3?(Ni+Co)/(Bi+Sb)?1.00×10?2, where Ni, Co, Bi, and Sb each represent a content (mass %) thereof in the solder alloy.

Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

Abstract: Provided is a flux that is able to suppress any solder bridges even when it is applied to the narrow pitched electrodes such that the bridge occurs when using the past flux. The flux is characterized by containing 15% by mass or more and 35% by mass or less of polyoxyalkylene ethylenediamine, 2% by mass or more and 15% by mass or less of an organic acid, 10% by mass or more and 30% by mass or less of a base material, 3% by mass or more and 30% by mass or less of an amine and 20% by mass or more and 40% by mass or less of a solvent.

Abstract: A solder material capable of suppressing the occurrence of electromigration is provided. The solder material is core ball 1A which comprises spherical core 2A composed of Cu or a Cu alloy, and solder layer 3A coating core 2A, and wherein solder layer 3A has: a Cu content of 0.1 mass % or more and 3.0 mass % or less, a Bi content of 0.5 mass % or more and 5.0 mass % or less, a Ag content of 0 mass % or more and 4.5 mass % or less, and a Ni content of 0 mass % or more and 0.1 mass % or less, with Sn being the balance.

Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

Abstract: A metal sintered bonding body bonds a substrate and a die. In the metal sintered bonding body, at least a center part and corner part of a rectangular region where the metal sintered bonding body faces the die have a low-porosity region whose porosity is lower than an average porosity of the rectangular region. The low-porosity region is located within a strip-shaped region whose central lines are diagonal lines of the rectangular region.

Abstract: A solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1% or more and less than 2.0%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.20%, Ge: 0.006 to 0.09%, and Co: 0.003% or more and less than 0.05%, and optionally Fe: 0.005 to 0.015% and P: 0.1% or less, with the balance being Sn.

Abstract: An object of the present invention is to provide a flux which does not precipitate a crystal and can improve solder wettability. A flux comprising 0.4 to 10.0 mass % of ditolylguanidine and 1.0 to 10.0 mass % of an organic acid, and not comprising diphenylguanidine as an amine compound.

Abstract: An object of the present invention is to provide a resin flux cored solder, or a flux coated solder, for which scattering of flux and solder in using the solder is suppressed, and a flux to be contained therein. A flux for a resin flux cored solder comprising a rosin resin, an activator, and at least one selected from an acrylic polymer and a vinyl ether polymer, which has a weight average molecular weight of 8000 to 100000, in an amount of 0.1 to 3 mass-% based on the total mass of the flux.

Abstract: A solder alloy for joining a Cu pipe and/or a Fe pipe has an alloy composition comprising in mass %: Sb: 5.0% to 15.0%; Cu: 0.5% to 8.0%; Ni: 0.025% to 0.7%; and Co: 0.025% to 0.3%, with a balance being Sn. The alloy composition satisfies the relationship of 0.07?Co/Ni?6, where Co and Ni represent contents of Co and Ni in mass %, respectively.

Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

Abstract: A sliding member having a supporting layer composed of an iron-based metallic material and a sliding layer formed on a surface of the supporting layer and composed of a copper-based metallic material. The surface of the supporting layer and the sliding layer have non-flat surfaces. A sliding surface having a non-flat surface is formed on the surface of the sliding layer. The sliding layer is formed on the roughened surface of the supporting layer by thermal spraying. The surface of the sliding layer is then subjected to a shot blasting treatment to form the sliding surface which has an uneven surface having an arithmetic average roughness (Ra) of more than 0 ?m and 2.0 ?m or less, a ten-point average roughness (Rz) of more than 0 ?m and 7.5 ?m or less and a surface hardness (Hv) of 150-250, and which slidably supports an object to be slid.

Abstract: To provide a container and a package configured to prevent a deformation of housed metal. According to one aspect of the present invention, there is provided the container. This container includes a cylindrical container body, a lid, and a flat plate-shaped inner plug. The cylindrical container body with a bottom has a sidewall and a bottom wall. The lid has a flat plate portion and a side portion. The flat plate portion covers an opening of the container body. The side portion covers at least a part of an outer peripheral surface of the container body. The flat plate-shaped inner plug is located inside the lid. The container body includes a thread ridge on the outer peripheral surface. The side portion of the lid has a screw groove with two or more threads on its inner peripheral surface. The lid is configured to be screwed with the container body by screwing the screw groove with the thread ridge. A plurality of lock portions are disposed on an outer periphery of the lid.

Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

Abstract: A core material including a core and a solder plating layer of a (Sn—Bi)-based solder alloy made of Sn and Bi on a surface of the core. Bi in the solder plating layer is distributed in the solder plating layer at a concentration ratio in a predetermined range of, for example, 91.7% to 106.7%. Bi in the solder plating layer is homogeneous, and thus, a Bi concentration ratio is in a predetermined range over the entire solder plating layer including an inner circumference side and an outer circumference side in the solder plating layer.

Abstract: A Cu core ball and a method of manufacturing such a Cu core ball. Purity of the Cu internal ball is at least 99.9% and not greater than 99.995%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is at least 0.95. A solder plating film coated on the Cu ball is of Sn solder or a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is not more than 5 ppb and that of Th is not more than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is not more than 0./0200 cph/cm2. An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 ?m.