Patents Assigned to Senju Metal Industry Co., Ltd.
  • ROSIN-MODIFIED PRODUCT, FLUX COMPOSITION, LIQUID FLUX, FLUX CORED SOLDER AND SOLDER PASTE
    Publication number: 20210101232
    Abstract: A rosin-modified product being a reactant of a rosin or a rosin derivative and an alkanolamine represented by a following Formula (1) NH3-n—(R—OH)n(n?3); or??(1) being produced by a reaction of a rosin or a rosin derivative, an organic acid and an alkanolamine.
    Type: Application
    Filed: September 11, 2020
    Publication date: April 8, 2021
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventor: Toshio Mizowaki
  • Solder alloy, solder paste, and solder joint
    Patent number: 10967464
    Abstract: A solder alloy having an alloy composition consisting of, in mass %, Ag: 1% to 4%, Cu: 0.5% to 0.8%, Bi: more than 4.8% and 5.5% or less. Sb: more than 1.5% and 5.5% or less, Ni: 0.01% or more and less than 0.1%, Co: more than 0.001% and 0.1% or less, the balance being Sn. The alloy composition satisfies the following three relationships: 0.020%?Ni+Co?0.105%; 9.1%?Sb+Bi?10.4%; and 4.05×10?3?(Ni+Co)/(Bi+Sb)?1.00×10?2, where Ni, Co, Bi, and Sb each represent a content (mass %) thereof in the solder alloy.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: April 6, 2021
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Naoko Izumita, Shunsaku Yoshikawa, Yoshie Tachibana
  • Soldered joint and method for forming soldered joint
    Patent number: 10968932
    Abstract: A solder joint in which an electronic component with a back metal is bonded to a substrate by a solder alloy. The solder alloy includes: a solder alloy layer having an alloy composition consisting of, in mass %: Ag: 2 to 4%, Cu: 0.6 to 2%, Sb: 9.0 to 12%, Ni: 0.005 to 1%, optionally Co: 0.2% or less and Fe: 0.1% or less, with the balance being Sn; an Sn—Sb intermetallic compound phase; a back metal-side intermetallic compound layer formed at an interface between the back metal and the solder alloy; and a substrate-side intermetallic compound layer formed at an interface between the substrate and the solder alloy. The solder alloy layer exists at least one of between the Sn—Sb intermetallic compound phase and the back metal-side intermetallic compound layer, and between the Sn—Sb intermetallic compound phase and the substrate-side intermetallic compound layer.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: April 6, 2021
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Minoru Ueshima, Yoshie Tachibana
  • Fluid discharge device
    Patent number: 10932372
    Abstract: In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: February 23, 2021
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Hideki Nakamura, Takashi Nauchi, Toshihiko Mutsuji, Ryoichi Suzuki
  • FLUX AND SOLDER PASTE
    Publication number: 20210031311
    Abstract: It is an object of the present invention to provide a flux containing flux components homogeneously dispersed without precipitation of aggregates in addition to having an appropriate balance between fluidity and shape retention property, and a solder paste. A flux comprising 0.5 to 3.5 mass % of a sorbitol-type thixotropic agent selected from the group consisting of dibenzylidene sorbitol, bis(4-methylbenzylidene)sorbitol and a combination thereof, and 2 to 350 mass ppm of a sorbitol-type additive selected from the group consisting of sorbitol, monobenzylidene sorbitol, mono(4-methylbenzylidene)sorbitol and a combination thereof, and a glycol ether-type solvent.
    Type: Application
    Filed: October 11, 2018
    Publication date: February 4, 2021
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyoshi KAWASAKI, Masato SHIRATORI, Ko INABA, Hiroaki KAWAMATA, Kazuhiro MINEGISHI
  • Jet solder level confirmation jig and method of handling the same
    Patent number: 10894294
    Abstract: Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: January 19, 2021
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Ryoichi Suzuki, Yasuji Kawashima, Shigeo Komine, Takashi Sugihara, Hiroyuki Inoue
  • Cu core ball, solder joint, solder paste and formed solder
    Patent number: 10888959
    Abstract: The Cu core ball contains a Cu ball and a solder layer for covering a surface of the Cu ball. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 or more to 1.0 ppm by mass or lower, P in an amount of 0 or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% or higher and 99.9995% by mass or lower, and sphericity which is 0.95 or higher. The solder layer includes Ag in an amount of more than 0 to 4.0% by mass or less, Cu in an amount of more than 0 to 3.0% by mass or less, and remainder of Sn.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: January 12, 2021
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyoshi Kawasaki, Shigeki Kondoh, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi, Daisuke Soma
  • Soldering material
    Patent number: 10888957
    Abstract: The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150° C. with a temperature of 25° C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: January 12, 2021
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyoshi Kawasaki, Tomoaki Nishino, Takahiro Roppongi, Isamu Sato, Yuji Kawamata
  • SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN FLUX-CORED SOLDER AND SOLDER JOINT
    Publication number: 20210001431
    Abstract: A solder alloy includes an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. A solder paste includes a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. A solder ball includes a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn.
    Type: Application
    Filed: December 21, 2018
    Publication date: January 7, 2021
    Applicant: SENJU METAL INDUSTRY Co., Ltd.
    Inventors: Takahiro YOKOYAMA, Kanta DEI, Takahiro MATSUFUJI, Hikaru NOMURA, Shunsaku YOSHIKAWA
  • SOLDER PASTE
    Publication number: 20200398382
    Abstract: The present invention provides a solder paste that suppresses generation of voids and has excellent reliability. A solder paste contains Sn-based powder, SnSb-based alloy powder with Sn and 10 mass % or more of Sb, and flux, wherein a liquidus temperature of the SnSb-based alloy powder is higher than a liquidus temperature of the Sn-based powder, and a content ratio of the Sn-based powder and the SnSb-based alloy powder is 75:25 to 95:5. Preferably, the content ratio of the Sn-based powder to the SnSb-based alloy powder is 80:20 to 90:10.
    Type: Application
    Filed: April 9, 2019
    Publication date: December 24, 2020
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takeshi SAKAMOTO, Yoshie TACHIBANA, Shunsuke KOGA
  • RESIN COMPOSITION FOR SOLDERING, RESIN FLUX CORED SOLDER, FLUX COATED SOLDER, AND LIQUID FLUX
    Publication number: 20200391329
    Abstract: Provided are a resin composition for soldering with not only improved wetting and spreading properties and but also excellent reliability and processability, a resin flux cored solder and a flux coated solder using this resin composition for soldering, and a liquid flux.
    Type: Application
    Filed: January 15, 2019
    Publication date: December 17, 2020
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Motohiro ONITSUKA, Yoko KURASAWA, Hiroyoshi KAWASAKI
  • SOLDERING ALLOY AND SOLDER JOINT
    Publication number: 20200384577
    Abstract: The present invention provides a solder alloy and a solder joint which have high tensile strength, can suppress elution of Ni, and can suppress generation of voids at a bonded interface. A solder alloy includes an alloy composition constituted from Ag: 1 to 4%, Cu: 0.1 to 1.0%, 0.005 to 0.09%, Co: 0.0025 to 0.1%, P: 0.001 to 0.015% by mass % and a balance Sn, wherein the alloy composition fulfills the following formula (1): 0.00020<(Ni/Co)·(1/Ag)·P<0.025 (1), wherein Ni, P, Ag and Co represent contents (mass %) of the alloy composition respectively.
    Type: Application
    Filed: June 28, 2019
    Publication date: December 10, 2020
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takeshi SAKAMOTO, Shunsuke KOGA, Toshihiko TAGUCHI
  • Flux and solder paste
    Patent number: 10857630
    Abstract: Provided are a flux having improved wetting and spreading properties and capable of suppressing the occurrence of dewetting and a solder paste using this flux. The flux includes a total amount of 0.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: December 8, 2020
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Yoshinori Takagi, Hiroyoshi Kawasaki, Takahiro Nishizaki
  • SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN FLUX-CORED SOLDER AND SOLDER JOINT
    Publication number: 20200376608
    Abstract: The present invention provides a solder alloy, a solder paste, a solder ball, a resin flux-cored solder and a solder joint, both of which has the low-melting point to suppress the occurrence of the fusion failure, improves the ductility and the shear strength, and has excellent heat-cycle resistance. The solder alloy comprises an alloy composition composed of 35 to 68 mass % of Bi, 0.1 to 2.0 mass % of Sb, 0.01 to 0.10 mass % of Ni, and a balance of Sn. The alloy composition may contain at least one of Co, Ti, Al and Mn in total amount of 0.1 mass % or less. The solder alloy may be suitably used for a solder paste, a solder ball, a resin flux-cored solder and a solder joint.
    Type: Application
    Filed: February 22, 2019
    Publication date: December 3, 2020
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takahiro YOKOYAMA, Takahiro MATSUFUJI, Hikaru NOMURA, Shunsaku YOSHIKAWA
  • METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART
    Publication number: 20200381136
    Abstract: A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 ?m or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 ?m or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.
    Type: Application
    Filed: July 24, 2018
    Publication date: December 3, 2020
    Applicants: SENJU METAL INDUSTRY CO., LTD., OSAKA UNIVERSITY
    Inventors: Jinting JIU, Minoru UESHIMA, Katsuaki SUGANUMA, Wanli LI
  • SOLDER ALLOY
    Publication number: 20200376606
    Abstract: A solder alloy has an alloy composition including, in mass %, 0.8% to 10% of Cu and Sn. The solder alloy includes an intermetallic compound. The intermetallic compound has a maximum grain size of 100 ?m or less in a region at least 50 ?m away from a surface of the solder alloy.
    Type: Application
    Filed: December 26, 2018
    Publication date: December 3, 2020
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takahiro YOKOYAMA, Shunsaku YOSHIKAWA
  • SOLDER MATERIAL, SOLDER PASTE, AND SOLDER JOINT
    Publication number: 20200376607
    Abstract: The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.
    Type: Application
    Filed: November 21, 2018
    Publication date: December 3, 2020
    Applicant: SENJU METAL INDUSTRY CO., LTD.,
    Inventors: Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma, Takashi Akagawa, Hiroshi Takahashi, Hiroshi Kawanago, Satoshi Yokota, Osamu Munekata
  • Flux and solder paste
    Patent number: 10843298
    Abstract: An object of the present invention is to provide a flux which does not precipitate a crystal and can improve solder wettability. A flux comprising 0.4 to 10.0 mass % of ditolylguanidine and 1.0 to 10.0 mass % of an organic acid, and not comprising diphenylguanidine as an amine compound.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: November 24, 2020
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Hiroyoshi Kawasaki, Masato Shiratori, Takahiro Nishizaki, Tomohisa Kawanago
  • FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND SOLDER JOINT
    Publication number: 20200353574
    Abstract: The object of the present invention is to provide a flux composition and a solder paste composition in which scattering of flux is suppressed. A flux composition comprising an anti-scattering agent represented by formula (1) below, wherein Z is optionally substituted alkylene, R1 and R2 are each independently optionally substituted alkyl, optionally substituted aralkyl, optionally substituted aryl, optionally substituted heteroaryl, optionally substituted cycloalkyl, or optionally substituted heterocycloalkyl, R3 and R4 are each independently optionally substituted alkyl.
    Type: Application
    Filed: April 12, 2018
    Publication date: November 12, 2020
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Tomoko NONAKA, Tomoko NAGAI
  • SOLDERING APPARATUS AND SOLDERING METHOD
    Publication number: 20200331086
    Abstract: A soldering apparatus 100 including: a chamber 120 configured to contain solder and include an opening 122 configured to discharge the solder in a bottom surface or a side surface; a pump 140 configured to transport the solder to the chamber 120; and an inner bath 160 configured to communicate with the opening 120 and perform soldering using the solder fed through the opening 120.
    Type: Application
    Filed: January 10, 2020
    Publication date: October 22, 2020
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Noboru HASHIMOTO, Takahiro KASAMA