Abstract: The present invention is a sulfonium salt represented by the following formula (1), wherein “p” represents an integer of 1 to 3; R11 represents a hydrocarbyl group having 1 to 20 carbon atoms; Rf represents a fluorine atom or a fluorine-atom-containing C1 to C6 group selected from alkyl, alkoxy, and sulfide; “q” represents an integer of 1 to 4; RALU represents an acid-labile group; “r” represents an integer of 1 to 4; R12 represents a hydrocarbyl group having 1 to 20 carbon atoms; “s” represents an integer of 0 to 4; “t” represents an integer of 0 to 2; Rf and —O—RALU are bonded to adjacent carbon atoms; and X? represents a non-nucleophilic counterion having no polymerizable group.

Abstract: A fluoroplastic substrate for high-speed communications has a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0008 and a permittivity at 40 GHz of from 2.0 to 3.2. The substrate includes a quartz glass cloth having a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0008 and a fluoroplastic having a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0005.

Abstract: A method for manufacturing a solar cell, including the steps of: forming unevenness on both of main surfaces of a semiconductor substrate of a first conductivity type; forming an emitter layer on a first main surface of the semiconductor substrate; forming a diffusion mask on the emitter layer; removing the diffusion mask in a pattern; forming a base layer on the portion where the diffusion mask have been removed; removing the remaining diffusion mask; forming a dielectric film on the first main surface; forming a base electrode on the base layer; and forming an emitter electrode on the emitter layer. This provides a method for manufacturing a solar cell that can bring high photoelectric conversion efficiency while decreasing the number of steps.

Abstract: A method for manufacturing a composite substrate includes: forming a first intermediate layer including thermally synthesized silica on a surface of a support substrate; forming a second intermediate layer including an inorganic material on a surface of a piezoelectric single crystal substrate; flattening a surface of the second intermediate layer; and bonding a surface of the first intermediate layer to the flattened surface of the second intermediate layer.

Abstract: A chemically amplified resist composition comprising a quencher and an acid generator is provided. The quencher is a nitrogen-containing carboxylic acid compound having a carboxy group whose hydrogen is substituted by a tertiary hydrocarbyl group having an androstane structure. The resist composition has a high sensitivity and forms a pattern with improved LWR or CDU, independent of whether it is of positive or negative tone.

Abstract: A substrate for mask blanks having first and second main surfaces of 152 mm×152 mm square and a thickness of 6.35 mm, wherein: when a range of 132 mm×132 mm square centered on an intersection of diagonal lines is defined as a calculation region in each of the first and second main surfaces, on a substrate surface of the calculation region of at least one of the first and second main surfaces, flatness of the substrate surface of the calculation region based on a least square plane is 100 nm or less, and a difference (PV) between a highest value and a lowest value of a height of a calculation surface represented by a difference between shapes of the substrate surfaces before and after smoothing processing with a Gaussian filter (10 mm×10 mm) based on the least square plane is 20 nm or less.

Abstract: Provided is a resin composition capable of being turned into a cured product exhibiting excellent dielectric properties even at high frequencies and small changes in dielectric properties even after being left under a high temperature for a long period. The resin composition is a curable resin composition containing: (A) a maleimide compound represented by the following general formula (1) wherein D independently represents a dimer acid- and trimer acid-derived hydrocarbon group; B independently represents a cyclic structure-containing divalent hydrocarbon group other than a dimer acid- and trimer acid-derived hydrocarbon group; A independently represents a tetravalent organic group having a cyclic structure; m is 0 to 100, n is 0 to 100; and (B) a catalyst, wherein D in the formula (1) is a group in which dimer acid-derived hydrocarbon group occupies 95% by mass or more of the dimer acid- and trimer acid-derived hydrocarbon group, and is a hydrogenated group.

Abstract: An object of the present invention is to provide a conductive polymer composition which has good filterability and good film formability of a flat film on an electron beam resist and can be suitably used for an antistatic film for electron beam resist writing, showing excellent antistatic property in the electron beam writing process due to the property of low volume resistivity (?·cm), and, reducing an effect on lithography by making an effect of an acid diffused from the film minimum, and further having excellent peelability by H2O or an alkaline developer after writing.

Abstract: A material for forming an organic film, including: a polymer having a structure shown by the following general formula (1A) as a partial structure; and an organic solvent, where in the general formula (1A), W1 represents a tetravalent organic group, W2 represents a single bond or a linking group shown by the following formula (1B), R1 represents a hydrogen atom or a monovalent organic group having 1 to 10 carbon atoms, n1 represents an integer of 0 or 1, and n2 and n3 satisfy 0?n2?6,0?n3?6, and 1?n2+n3?6, and where R2 and R3 each independently represent hydrogen or an organic group having 1 to 30 carbon atoms, and the organic group R2 and the organic group R3 optionally bond to each other within a molecule to form a cyclic organic group.

Abstract: A synthetic quartz glass substrate having a controlled hydrogen molecule concentration is prepared by (a) hot shaping a synthetic quartz glass ingot into a glass block, (b) slicing the glass block into a glass plate, (c) annealing the glass plate at 500-1,250° C. for 15-60 hours, (d) hydrogen doping treatment of the glass plate in a hydrogen gas atmosphere at 300-450° C. for 20-40 hours, and (e) dehydrogenation treatment of the glass plate at 200-400° C. for 5-10 hours.

Abstract: A film-forming powder containing a rare earth oxyfluoride has an average particle size D50 of 0.6-15 ?m, a total volume of ?10 ?m pores of 0.51-1.5 cm3/g as measured by mercury porosimetry, and a BET surface area of 3-50 m2/g is suitable for forming a dense film in high yields or deposition rates and high productivity. The film-forming powder having a greater pore volume can be prepared by forming a rare earth ammonium fluoride complex salt on surfaces of rare earth oxide particles to provide precursor particles, and heat treating the precursor particles at a temperature of 350 to 700° C.

Abstract: Provided is a magnetic refrigeration material whose magnetic transition temperature has been adjusted with high accuracy and which includes at least a first predetermined magnetic refrigeration material and a second predetermined magnetic refrigeration material which differs from the first magnetic refrigeration material. The absolute value of the difference between the magnetic transition temperature of the present magnetic refrigeration material and a target magnetic transition temperature is 0.7 K or less. The content of the first magnetic refrigeration material and the content of the second magnetic refrigeration material are determined by the magnetic transition temperatures of the first magnetic refrigeration material and the second magnetic refrigeration material and by a target magnetic transition temperature of the magnetic refrigeration material.

Abstract: A pellicle characterized by having an amount of released aqueous gas of 1×10?3 Pa·L/s or less per pellicle, an amount of released hydrocarbon-based gas of 1×10?5 Pa·L/s or less per pellicle in a range of measured mass number of 45 to 100 amu, and an amount of released hydrocarbon-based gas of 4×10?7 Pa·L/s or less per pellicle in a range of measured mass number of 101 to 200 amu, under vacuum after the pellicle has been left to stand for 10 minutes in an atmosphere of 23° C. and 1×10?3 Pa or less.

Abstract: A pellicle characterized by having an amount of released aqueous gas of 1×10?3 Pa·L/s or less per pellicle, an amount of released hydrocarbon-based gas of 1×10?5 Pa·L/s or less per pellicle in a range of measured mass number of 45 to 100 amu, and an amount of released hydrocarbon-based gas of 4×10?7 Pa·L/s or less per pellicle in a range of measured mass number of 101 to 200 amu, under vacuum after the pellicle has been left to stand for 10 minutes in an atmosphere of 23° C. and 1×10?3 Pa or less.

Abstract: The present invention is to provide a pellicle frame characterized by including a metal or alloy having a linear expansion coefficient of 10×10?6 (1/K) or less and further a density of 4.6 g/cm3 or less, and a pellicle characterized by including the pellicle frame as an element.

Abstract: Provided is a heat-curable resin composition capable of lowering the elastic modulus of a cured product obtained even when a heat-curable resin component in the composition contains an organic solvent or has a high curing temperature. The heat-curable resin composition contains: (A) a heat-curable resin; and (B) spherical polymethylphenyl silsesquioxane particles that have a volume average particle size of 0.1 to 30 ?m, and are in an amount of 1 to 35 parts by mass per 100 parts by mass of the component (A), wherein a molar ratio between units represented by CH3SiO3/2 and units represented by C6H5SiO3/2 (CH3SiO3/2 units:C6H5SiO3/2 units) in the polymethylphenyl silsesquioxane particles is 95:5 to 55:45.

Abstract: A millable-type silicone rubber composition, including: (A) 100 parts by mass of an organopolysiloxane represented by following average composition formula (1), the organopolysiloxane having polymerization degree of 100 or more, wherein a content of a low molecular siloxane contained as an impurity and having a polymerization degree of 10 or less is less than 1,000 ppm; (B) 5 to 100 parts by mass of a treated silica treated with a vinyl group-containing alkoxysilane and/or a vinyl group-containing organosilazane, the treated silica having a hydrophobicity degree of 40 or more; and (C) an effective amount of a curing agent. This provides a millable-type silicone rubber composition that yields a silicone rubber cured product with: a total of low molecular siloxane components having polymerization degree of 10 or less of less than 1,000 ppm; a small change in plasticity degree of the silicone rubber compound; and a small compression set.

Abstract: The present invention is a polymerizable monomer represented by the following general formula (1), wherein RA represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; ZL is a single bond or (backbone) —C(?O)—O—; RALU is an acid-labile group formed with an adjacent oxygen atom; XL represents an oxygen atom or a sulfur atom; Raa represents a hydrogen atom or a fluorine atom; R1a independently represents a hydrocarbyl group having 1 to 20 carbon atoms; n1 is an integer of 0 to 2; n2 is an integer of 1 or 2; n3 is an integer of 1 or 2; and n4 is an integer of 0 to 4.

Abstract: The present invention is to provide a pellicle frame characterized by including a metal or alloy having a linear expansion coefficient of 10×10?6 (1/K) or less and further a density of 4.6 g/cm3 or less, and a pellicle characterized by including the pellicle frame as an element.

Abstract: A chemically amplified resist composition is provided comprising an acid generator and a quencher comprising a salt compound consisting of a nitrogen-containing cation and a 1,1,1,3,3,3-hexafluoro-2-propoxide anion having a trifluoromethyl, hydrocarbylcarbonyl or hydrocarbyloxycarbonyl group bonded thereto. The resist composition has a high sensitivity and forms a pattern with improved LWR or CDU, independent of whether it is of positive or negative tone.