Patents Assigned to Shin-Etsu Chemical Co., Ltd.
  • Publication number: 20240002663
    Abstract: An anti-fouling silicone composite sheet including: a substrate layer containing a fluororesin; and a silicone adhesive layer stacked on one surface of the substrate layer, having a hardness of 5 or less as measured with an Asker C hardness tester, and having an adhesive force with respect to a mortar test piece of 5 N/25 mm or more, wherein the substrate layer has a surface on which the silicone adhesive layer is stacked and the other surface is an anti-fouling surface. By the above configuration, the present invention provides an anti-fouling silicone composite sheet capable of exhibiting anti-fouling performance, washability, easiness of washing, and wear resistance stably for a long period, easily attachable to an adherend, and conformable even to cracking and shifting on the application surface; and a method for performing a prevention of graffiti by using the anti-fouling silicone composite sheet.
    Type: Application
    Filed: November 22, 2021
    Publication date: January 4, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Keiji IMAIZUMI, Akihiro ENDO, Masaki MOTEKI
  • Publication number: 20240004285
    Abstract: The present invention is to provide a pellicle frame in a frame shape having an upper end face on which a pellicle film is to be arranged and a lower end face to face a photomask, which is characterized by being provided with a notched part from the outer side face toward inner side face of the lower end face; a pellicle including the pellicle frame as an element; and a method for peeling a pellicle from a photomask onto which the pellicle has been attached, which is characterized by inserting a peeling jig into a notched part from a side face of a pellicle frame, and moving the peeling jig in an upper end face direction of the pellicle frame in this state to peel off the pellicle from the photomask.
    Type: Application
    Filed: September 18, 2023
    Publication date: January 4, 2024
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventor: Yu YANASE
  • Publication number: 20240002606
    Abstract: The present invention provides: a room temperature curable organopolysiloxane composition which has curability equivalent to the curability of conventional dealcoholization type or deoximation type room temperature curable organopolysiloxane compositions even if various catalysts are used therefor, while reducing harmful effects on human bodies and burden on the environment, and which enables the achievement of a cured product that has good rubber properties, adhesiveness and durability if cured; various articles which comprise this composition or a cured product that is obtained by curing this composition; a novel hydrolyzable organosilane compound which is useful as a curing agent for this composition; and a method for producing this novel hydrolyzable organosilane compound.
    Type: Application
    Filed: August 16, 2021
    Publication date: January 4, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Akira UTA
  • Patent number: 11860540
    Abstract: A positive resist composition comprising a base polymer comprising recurring units (a) having the structure of an ammonium salt of a sulfonamide having an iodized aromatic ring, and recurring units (b1) having an acid labile group-substituted carboxyl group and/or recurring units (b2) having an acid labile group-substituted phenolic hydroxyl group exhibits a high sensitivity, high resolution, low edge roughness and improved CDU, and forms a pattern of good profile after exposure and development.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: January 2, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Jun Hatakeyama
  • Patent number: 11862755
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: January 2, 2024
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
  • Patent number: 11859050
    Abstract: Provided is a novel polyoxyalkylene compound which contains, at a molecular chain terminal, at least one reactive silicon-containing group represented by formula (1) per molecule and which has a main chain that is a polyoxyalkylene polymer. Also provided are: a process for producing the novel polyoxyalkylene compound; a room-temperature-curable composition which includes the compound as a main component and can contain any of various crosslinking agents; a sealing material; and an article. (In formula (1), R1 and R2 are each a monovalent hydrocarbon group, a hydrogen atom, or a triorganosiloxy group; n is 2 or larger; m is 1 or larger; and the broken line is a linking bond).
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: January 2, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takahiro Yamaguchi, Masayuki Ikeno, Isao Iwasaki, Takafumi Sakamoto
  • Patent number: 11859055
    Abstract: The purpose of the present invention is to provide a polysiloxane monomer which gives an ophthalmic device with excellent wettability and a method for preparing the same. The present invention provides a compound represented by the following formula (1): wherein R1 is a hydrogen atom or a methyl group, L1 is a single bond or a divalent hydrocarbon group which has 1 to 6 carbon atoms and may have at least one selected from an ether bond, an ester bond, and a urethane bond, Z is a monovalent organic group which has 1 to 10 carbon atoms and has a quaternary ammonium group or an amphoteric ion group, A is a linear or branched organo(poly)siloxanyl group having 1 to 100 siloxane units, L2 is a linear, branched or cyclic, divalent or trivalent hydrocarbon group which has 2 to 10 carbon atoms and may have an ether bond, and L3 is a divalent or trivalent hydrocarbon group having one carbon atom, provided that and when L3 is trivalent, then L2 is also trivalent, and L3 and L2 together form a ring.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: January 2, 2024
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Kaoru Okamura
  • Patent number: 11860529
    Abstract: A substrate with a multilayer reflection film for an EUV mask blank including a substrate, and a multilayer reflection film formed on the substrate is provided. The multilayer reflection film includes a Si/Mo laminated portion and a protection layer containing Ru and including a lower layer composed of Ru, and an upper layer composed of a material containing Ru and at least one selected from the group consisting of metals other than Ru, and metalloids.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: January 2, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yukio Inazuki, Tsuneo Terasawa, Takuro Kosaka, Hideo Kaneko, Kazuhiro Nishikawa
  • Patent number: 11862754
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: January 2, 2024
    Assignees: SemiLEDs Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
  • Publication number: 20230416566
    Abstract: A coating agent composition containing as essential components (A) a lipophilic group-containing (hydrolyzable) organosiloxane compound, containing a lipophilic group selected from groups represented by the formulas (—C(?O)OR1), (—O—C(?O)R1), (—C(?O)NR12), (—C(?O)SR1), and (—P(?O)(OR1)2) (R1: H, C1-30 alkyl group, C6-30 aryl group, or C7-30 aralkyl group) and a silanol group or a hydrolyzable silyl group, and/or a partial (hydrolyzed) condensation product thereof and (B) a polyol ester comprising a condensation product of a dihydric to hexahydric alcohol and a C3-22 fatty acid, the mass ratio of components (A) and (B) being 0.1<(A)/(B)<10, can form a cured film having excellent lipophilicity and wear resistance.
    Type: Application
    Filed: November 1, 2021
    Publication date: December 28, 2023
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Seiya MORI
  • Publication number: 20230418158
    Abstract: The present invention is a sulfonium salt represented by the following formula (1), wherein “p” represents an integer of 1 to 3; R11 represents a hydrocarbyl group having 1 to 20 carbon atoms; Rf represents a fluorine atom or a fluorine-atom-containing C1 to C6 group selected from alkyl, alkoxy, and sulfide; “q” represents an integer of 1 to 4; RALU represents an acid-labile group; “r” represents an integer of 1 to 4; R12 represents a hydrocarbyl group having 1 to 20 carbon atoms; “s” represents an integer of 0 to 4; “t” represents an integer of 0 to 2; Rf and —O—RALU are bonded to adjacent carbon atoms; and X? represents a non-nucleophilic counterion having no polymerizable group.
    Type: Application
    Filed: May 12, 2023
    Publication date: December 28, 2023
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masahiro FUKUSHIMA, Satoshi WATANABE, Jun HATAKEYAMA, Keiichi MASUNAGA, Masaaki KOTAKE, Yuta MATSUZAWA
  • Publication number: 20230416482
    Abstract: A fluoroplastic substrate for high-speed communications has a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0008 and a permittivity at 40 GHz of from 2.0 to 3.2. The substrate includes a quartz glass cloth having a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0008 and a fluoroplastic having a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0005.
    Type: Application
    Filed: June 23, 2023
    Publication date: December 28, 2023
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toshio Shiobara, Ryunosuke Nomura, Hajim Itokawa
  • Publication number: 20230420581
    Abstract: A method for manufacturing a solar cell, including the steps of: forming unevenness on both of main surfaces of a semiconductor substrate of a first conductivity type; forming an emitter layer on a first main surface of the semiconductor substrate; forming a diffusion mask on the emitter layer; removing the diffusion mask in a pattern; forming a base layer on the portion where the diffusion mask have been removed; removing the remaining diffusion mask; forming a dielectric film on the first main surface; forming a base electrode on the base layer; and forming an emitter electrode on the emitter layer. This provides a method for manufacturing a solar cell that can bring high photoelectric conversion efficiency while decreasing the number of steps.
    Type: Application
    Filed: July 7, 2023
    Publication date: December 28, 2023
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takenori WATABE, Hiroshi HASHIGAMI, Hiroyuki OHTSUKA
  • Publication number: 20230422620
    Abstract: A method for manufacturing a composite substrate includes: forming a first intermediate layer including thermally synthesized silica on a surface of a support substrate; forming a second intermediate layer including an inorganic material on a surface of a piezoelectric single crystal substrate; flattening a surface of the second intermediate layer; and bonding a surface of the first intermediate layer to the flattened surface of the second intermediate layer.
    Type: Application
    Filed: September 8, 2023
    Publication date: December 28, 2023
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shoji AKIYAMA, Masayuki TANNO
  • Publication number: 20230418157
    Abstract: A chemically amplified resist composition comprising a quencher and an acid generator is provided. The quencher is a nitrogen-containing carboxylic acid compound having a carboxy group whose hydrogen is substituted by a tertiary hydrocarbyl group having an androstane structure. The resist composition has a high sensitivity and forms a pattern with improved LWR or CDU, independent of whether it is of positive or negative tone.
    Type: Application
    Filed: June 22, 2023
    Publication date: December 28, 2023
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Jun Hatakeyama, Masahiro Fukushima
  • Publication number: 20230418149
    Abstract: A substrate for mask blanks having first and second main surfaces of 152 mm×152 mm square and a thickness of 6.35 mm, wherein: when a range of 132 mm×132 mm square centered on an intersection of diagonal lines is defined as a calculation region in each of the first and second main surfaces, on a substrate surface of the calculation region of at least one of the first and second main surfaces, flatness of the substrate surface of the calculation region based on a least square plane is 100 nm or less, and a difference (PV) between a highest value and a lowest value of a height of a calculation surface represented by a difference between shapes of the substrate surfaces before and after smoothing processing with a Gaussian filter (10 mm×10 mm) based on the least square plane is 20 nm or less.
    Type: Application
    Filed: June 1, 2023
    Publication date: December 28, 2023
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tomoaki SUGIYAMA, Daijitsu HARADA, Harunobu MATSUI, Naoki YARITA, Masaki TAKEUCHI
  • Publication number: 20230416466
    Abstract: Provided is a resin composition capable of being turned into a cured product exhibiting excellent dielectric properties even at high frequencies and small changes in dielectric properties even after being left under a high temperature for a long period. The resin composition is a curable resin composition containing: (A) a maleimide compound represented by the following general formula (1) wherein D independently represents a dimer acid- and trimer acid-derived hydrocarbon group; B independently represents a cyclic structure-containing divalent hydrocarbon group other than a dimer acid- and trimer acid-derived hydrocarbon group; A independently represents a tetravalent organic group having a cyclic structure; m is 0 to 100, n is 0 to 100; and (B) a catalyst, wherein D in the formula (1) is a group in which dimer acid-derived hydrocarbon group occupies 95% by mass or more of the dimer acid- and trimer acid-derived hydrocarbon group, and is a hydrogenated group.
    Type: Application
    Filed: June 14, 2023
    Publication date: December 28, 2023
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro TSUTSUMI, Yuki KUDO, Tadaharu IKEDA, Hiroyuki IGUCHI, Atsushi TSUURA
  • Patent number: 11852974
    Abstract: An object of the present invention is to provide a conductive polymer composition which has good filterability and good film formability of a flat film on an electron beam resist and can be suitably used for an antistatic film for electron beam resist writing, showing excellent antistatic property in the electron beam writing process due to the property of low volume resistivity (?·cm), and, reducing an effect on lithography by making an effect of an acid diffused from the film minimum, and further having excellent peelability by H2O or an alkaline developer after writing.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: December 26, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takayuki Nagasawa, Keiichi Masunaga, Masaaki Kotake, Satoshi Watanabe
  • Patent number: 11851530
    Abstract: A material for forming an organic film, including: a polymer having a structure shown by the following general formula (1A) as a partial structure; and an organic solvent, where in the general formula (1A), W1 represents a tetravalent organic group, W2 represents a single bond or a linking group shown by the following formula (1B), R1 represents a hydrogen atom or a monovalent organic group having 1 to 10 carbon atoms, n1 represents an integer of 0 or 1, and n2 and n3 satisfy 0?n2?6,0?n3?6, and 1?n2+n3?6, and where R2 and R3 each independently represent hydrogen or an organic group having 1 to 30 carbon atoms, and the organic group R2 and the organic group R3 optionally bond to each other within a molecule to form a cyclic organic group.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: December 26, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Daisuke Kori, Takashi Sawamura, Keisuke Niida, Seiichiro Tachibana
  • Patent number: 11851364
    Abstract: A synthetic quartz glass substrate having a controlled hydrogen molecule concentration is prepared by (a) hot shaping a synthetic quartz glass ingot into a glass block, (b) slicing the glass block into a glass plate, (c) annealing the glass plate at 500-1,250° C. for 15-60 hours, (d) hydrogen doping treatment of the glass plate in a hydrogen gas atmosphere at 300-450° C. for 20-40 hours, and (e) dehydrogenation treatment of the glass plate at 200-400° C. for 5-10 hours.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: December 26, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Junichiro Nishida, Kazuo Shirota, Hisashi Yagi, Masaki Takeuchi