Patents Assigned to Shipley Company, L.L.C.
  • Patent number: 6973253
    Abstract: A first waveguide holding member has a first transverse surface region and a first optical waveguide having an end terminating at the first transverse surface region. A second waveguide holding member has a second transverse surface region which confronts the first transverse surface region of the first waveguide holding member and a second optical waveguide having an end terminating at the second transverse surface region. A guide member is operatively coupled to the first and second waveguide holding members and guides the first waveguide holding member in a transverse direction relative to the second waveguide holding member so as to selectively optically couple and decouple the ends of the first and second optical waveguides.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: December 6, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Dan A. Steinberg, David W. Sherrer, Mindaugas F. Dautartas, Donald E. Leber
  • Publication number: 20050261152
    Abstract: A composition composed of a persulfate, boric acid, a fluorine containing acid and an inorganic acid. Adjuvants also may be included in the composition. The composition may be employed as a microetch solution in the fabrication of microelectronic packages.
    Type: Application
    Filed: July 28, 2005
    Publication date: November 24, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: John Carter, Jack Fellman, Jacek Knop, Martin Bayes
  • Patent number: 6967222
    Abstract: Methods of preparing porous optical materials are provided. These methods allow for the selection of the desired pore size and level of porosity in the porous optical material. Such methods utilize a preformed polymeric porogen.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: November 22, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Garo Khanarian, Yujian You, Robert H. Gore, Angelo A. Lamola
  • Publication number: 20050255710
    Abstract: Porous thermoset dielectric materials having low dielectric constants useful in electronic component manufacture are provided along with methods of preparing the porous thermoset dielectric materials. Also provided are methods of forming integrated circuits containing such porous thermoset dielectric material.
    Type: Application
    Filed: June 24, 2005
    Publication date: November 17, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: Yujian You, Nikoi Annan, Michael Gallagher, Robert Gore
  • Patent number: 6964804
    Abstract: A micromachined structure, comprising: a substarte; a first wet etched pit disposed in the substrate; a second wet etched pit disposed in the substrate, the second pit extending into the substrate a greater depth than the first pit; and a dry pit disposed between, and adjacent to, the first and second pits. Also disclosed is a micromachined substrate comprising: a wet etched pit; and a dry-etched hole disposed in the wet etched pit, wherein the dry hole extends through the substrate.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: November 15, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Dan A. Steinberg, Jasean Rasnake, David W. Sherrer
  • Publication number: 20050250044
    Abstract: A polymer having ?,? unsaturated groups and a group that generates a free radical when exposed to actinic radiation. The polymer may be self-cross-linking.
    Type: Application
    Filed: July 13, 2005
    Publication date: November 10, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: Robert Barr, Edgardo Anzures, Daniel Lundy
  • Publication number: 20050250045
    Abstract: A polymer having ?,? unsaturated groups and a group that generates a free radical when exposed to actinic radiation. The polymer may be self-cross-linking.
    Type: Application
    Filed: July 13, 2005
    Publication date: November 10, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: Robert Barr, Edgardo Anzures, Daniel Lundy
  • Publication number: 20050249967
    Abstract: Tin deposits having greatly reduced whisker formation are provided. Methods of depositing tin layers or films having a reduced tendency to form whiskers are also provided.
    Type: Application
    Filed: July 13, 2005
    Publication date: November 10, 2005
    Applicant: Shipley Company, L.L.C.
    Inventor: Andre Egli
  • Patent number: 6956127
    Abstract: Disclosed are methods of preparing monoalkyl Group VA metal dihalide compounds in high yield and high purity by the reaction of a Group VA metal trihalide with an organo lithium reagent or a compound of the formula RnM1X3?n, where R is an alkyl, M1 is a Group IIIA metal, X is a halogen and n is an integer fro 1 to 3. Such monoalkyl Group VA metal dihalide compounds are substantially free of oxygenated impurities, ethereal solvents and metallic impurities. Monoalkyl Group VA metal dihydride compounds can be easily produced in high yield and high purity by reducing such monoalkyl Group VA metal dihalide compounds.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: October 18, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Deodatta Vinayak Shenai-Khatkhate, Michael Brendan Power, Artashes Amamchyan, Ronald L. DiCarlo, Jr.
  • Patent number: 6944945
    Abstract: A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.
    Type: Grant
    Filed: May 12, 2000
    Date of Patent: September 20, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Charles R. Shipley, Robert L. Goldberg, James G. Shelnut
  • Patent number: 6939821
    Abstract: An opaque, low resistivity silicon carbide and a method of making the opaque, low resistivity silicon carbide. The opaque, low resistivity silicon carbide is doped with a sufficient amount of nitrogen to provide the desired properties of the silicon carbide. The opaque, low resistivity silicon carbide is a free-standing bulk material that may be machined to form furniture used for holding semi-conductor wafers during processing of the wafers. The opaque, low resistivity silicon carbide is opaque at wavelengths of light where semi-conductor wafers are processed. Such opaqueness provides for improved semi-conductor wafer manufacturing. Edge rings fashioned from the opaque, low resistivity silicon carbide can be employed in RTP chambers.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: September 6, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Jitendra S. Goela, Michael A. Pickering
  • Publication number: 20050191515
    Abstract: Disclosed are composites having very low coefficients of thermal expansion and methods of preparing the composites. Also disclosed are composites having negative coefficients of thermal expansion. Applications of the composites to a wide variety of uses, such as electronic and optoelectronic devices are also disclosed.
    Type: Application
    Filed: April 25, 2005
    Publication date: September 1, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: Nathaniel Brese, Garo Khanarian, Craig Allen
  • Patent number: 6932519
    Abstract: An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber. The optical fiber is positioned within the groove in the substrate such that the tap surface of the optical fiber is substantially at or below the upper surface of the substrate and the optical fiber is operatively aligned with the optical semiconductor component for the transfer of optical signals therebetween. A frame is hermetically sealed to the upper surface of the substrate.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: August 23, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Dan. A. Steinberg, David W. Sherrer, Mindaugas F. Dautargas
  • Publication number: 20050180701
    Abstract: An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber. The optical fiber is positioned within the groove in said substrate such that the top surface of the optical fiber is substantially at or below the upper surface of the substrate and the optical fiber is operatively aligned with the optical semiconductor component for the transfer of optical signals therebetween. A frame is hermetically sealed to the upper surface of the substrate.
    Type: Application
    Filed: March 15, 2005
    Publication date: August 18, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: Dan Steinberg, David Sherrer, Mindaugas Dautargas
  • Publication number: 20050180712
    Abstract: Provided are photodefinable compositions suitable for use in forming an optical waveguide. The compositions include a silsesquioxane polymer having polymerized units of the formula (R1SiO1.5) and (R2SiO1.5), wherein R1 and R2 are different and are substituted or unsubstituted organic side chain groups and are free of hydroxy groups, and two or more functional end groups, and a photoactive component. The solubility of the silsesquioxane polymer is altered upon exposure to actinic radiation such that the composition is developable in an aqueous developer solution. Also provided are methods of forming an optical waveguide with the inventive compositions, optical waveguides, and electronic devices including one or more optical waveguide.
    Type: Application
    Filed: January 10, 2005
    Publication date: August 18, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: James Shelnut, Matthew Moynihan, Omari Patterson
  • Patent number: 6926922
    Abstract: A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and composition for depositing a final finish that is even and bright. The present invention is particularly suitable for the manufacture of printed circuit boards containing one or more electroless nickel-immersion gold layers.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: August 9, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Mei Kiu Leung, Willetta Lai, Pit Kai Peter Cheng, Cecilia Po Sze Wong
  • Patent number: 6927492
    Abstract: A device including a first solder pad and a second solder pad comprised of a post-soldering alloy composition on a substrate is provided. The alloy composition comprises two or more elements, and the post soldering alloy composition of the first solder pad has different amounts of the two or more elements than the alloy composition of the second solder pad. A method of making a solder pad comprises masking a substrate comprising at least a first solder pad and a second solder pad, wherein the mask exposes a greater area of the first solder pad so that the deposited element becomes part of an alloy composition of the first solder pad upon soldering thereby changing the melting point of the first solder pad.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: August 9, 2005
    Assignee: Shipley Company, L.L.C.
    Inventor: Mindaugas F. Dautartas
  • Publication number: 20050170077
    Abstract: A primer composed of a polymer solution is applied to a roughened metal surface, and a polymer material such as a pre-preg is applied to the treated metal surface to form a bond between the metal and the polymer material.
    Type: Application
    Filed: March 25, 2005
    Publication date: August 4, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: Joseph Montano, James Shelnut
  • Patent number: 6923899
    Abstract: Provided for is a solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting of fluoboric acid, an organic sulfonic acid, a mineral acid, or a combination thereof; divalent tin ions; and an antioxidant comprising a hydroxy benzene sulfonic acid or salt thereof, in an amount effective to prevent the oxidation of divalent tin ions. Also provided for is a method for electroplating comprising electroplating a substrate using an electroplating solution comprising a hydroxy benzene sulfonic acid or salt thereof in an amount effective to decrease the oxidation of tin ions.
    Type: Grant
    Filed: March 5, 2003
    Date of Patent: August 2, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Neil D. Brown, Angelo Chirafisi, Peter R. Levey
  • Publication number: 20050164020
    Abstract: This invention offers a composite material with improved binding strength and a method for its manufacture. In particular, the invention offers a composite material having metal at the surface of a resin base, obtained by subjecting the surface of a resin base to an ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions, and then reducing said metal ions, where the aforementioned composite material resin is characterized in that the resin base and metal of said composite material are hot-pressed. Said composite material has superior binding strength between resin base and metal relative to composite materials obtained by electroless plating which have inferior binding strength between resin base and metal. Moreover, said composite material is readily manufactured because hot-press methods can be used in the formation of said composite material.
    Type: Application
    Filed: January 24, 2005
    Publication date: July 28, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: Masaru Seita, Hideki Tsuchida, Masaaki Imanari, Masaru Kusaka, Koichi Yomogida, Hidemi Nawafune, Syozo Mizumoto, Shingo Ikeda