Abstract: There is provided a highly sensitive colorant-containing photosensitive resin composition that can form an excellent crack resistant cured product for use in the formation of organic EL element barrier ribs. One embodiment of the photosensitive resin composition for use in organic EL element barrier ribs comprises: (A) a binder resin; (B) a phenolic hydroxyl group-containing compound having a molecular weight of 260 to 5,000 and a phenolic hydroxyl group equivalent of 80 to 155; (C) a radiation sensitive compound; and (D) a colorant selected from the group consisting of black dyes and black pigments.
Abstract: A horizontal continuous casting apparatus includes a fluid supply pipe for supplying a lubricating fluid to the hollow portion of the mold, which is arranged on one end side of the mold; and, a cooling water cavity for accommodating cooling water cooling an inner peripheral surface of the hollow portion of the mold, which is formed outside the inner peripheral surface, wherein the inner peripheral surface and the inner bottom surface of the cooling water cavity facing the inner peripheral surface form parallel surfaces with each other, and a cooling wall of the mold between the inner peripheral surface and the inner bottom surface is formed so that the heat flux value per unit area from the molten aluminum alloy to the cooling water is 10×105 W/m2 or more.
Abstract: The present invention provides a crucible and a SiC single crystal growth apparatus capable of improving the efficiency of using source materials. The crucible includes a lid and a container. The container includes a bottom facing the lid. The bottom includes a recess which is recessed towards the lid.
Abstract: Provided is a fluorine-containing ether compound that can be suitably used as a material for a lubricant for a magnetic recording medium, capable of forming a lubricant layer having excellent chemical substance resistance and wear resistance even when the thickness is small. A fluorine-containing ether compound represented by the following formula (1): R1—R2—CH2—R3—CH2—R4—R5??(1) In the formula (1), R3 is a perfluoropolyether chain. R2 and R4 are divalent linkage groups having a polar group, and may be the same or different. R1 and R5 are terminal groups bonded to R2 or R4, which may be the same or different, and at least one of R1 and R5 is an organic group having 1 to 8 carbon atoms wherein one or more hydrogen atoms of the organic group is substituted with a cyano group.
Abstract: A battery packaging material is formed of a laminate. The laminate is composed of an outer layer including a substrate layer, a barrier layer as an intermediate layer, and a heat fusible resin layer as an innermost layer. The total thickness of the laminate is 60 ?m to 220 ?m. The barrier layer is formed of a metal foil. The product of a stress value and a thickness of the heat fusible resin layer at a time of 10% stretching is 1,200 Pa·m or more.
Abstract: To provide a bonding technique that is capable of bonding a metal and a resin with a sufficient bonding strength. A bonded article including a functional group-carrying metal surface and a functional group-carrying resin surface, which are bonded directly to each other, the functional group-carrying metal surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a metal, the functional group-carrying resin surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a resin.
Abstract: There is provided a fluorine-containing ether compound represented by the following formula. R1—R2—CH2—R3—CH2—OCH2CH(OH)CH2O—CH2—R3—CH2—R4—R5 (in the formula, R3 represents a perfluoropolyether chain; R2 and R4 represent a divalent linking group having a polar group and may be the same or different from each other; R1 and R5 represent a terminal group bonded to an oxygen atom of R2 or R4 and may be the same or different from each other; and at least one of R1 and R5 is an organic group having 1 to 8 carbon atoms and at least one of hydrogens included in the organic group is substituted by a cyano group).
Abstract: A SiC ingot includes a seed crystal and a single crystal grown on the seed crystal, wherein the single crystal has therein a micropipe passing through the single crystal in a growth direction, and when photoluminescence observation is performed on a plurality of wafers cut out from the single crystal in a direction intersecting the growth direction, an S/N ratio of the micropipe in a first wafer cut out of the plurality of wafers, which is closest to the seed crystal, is higher than an S/N ratio of the micropipe in a second wafer cut out from a position further away from the seed crystal than the first wafer.
Abstract: Provided is a transparent conducting film having a preferable optical property, a preferable electrical property, and further, a superior durability of folding. The transparent conducting film comprises a transparent substrate and a transparent conducting layer formed on at least one of main faces of the transparent substrate, wherein the transparent conducting layer contains a binder resin and a conducting fiber, a cut portion of the transparent conducting film has a straightness of 0.050 mm or less. Preferably, the transparent substrate is a resin film having an elongated resin film or cut out from an elongated film, and can be folded in with a folding axis in the direction perpendicular to the longitudinal direction of the elongated resin film.
Abstract: The invention relates to a method for producing a slurry for a nonaqueous battery electrode, a method for producing a nonaqueous battery electrode, and a method for producing a nonaqueous battery. The method for producing a slurry for a nonaqueous battery electrode includes a dispersing step of dispersing a conductive auxiliary agent in an aqueous binder composition, and a mixing step of mixing the conductive auxiliary agent-containing binder composition obtained in the dispersing step with an active material. In the conductive auxiliary agent-containing binder composition, a particle diameter at which particles begin to appear, which is measured according to a degree of dispersion by a grain gauge method, is 90 ?m or less.
Abstract: The invention provides a SiC single crystal production apparatus with high uniformity of temperature distribution in a crystal growth vessel. The SiC single crystal production apparatus includes a crystal growth vessel containing SiC raw material; an insulation part covering the periphery of the crystal growth vessel; a heater used to heat the crystal growth vessel; and a holding member used to hold the crystal growth vessel, wherein the crystal growth vessel is held in a suspended state by the holding member.
Abstract: A fluorine-containing ether compound represented by a formula (1) shown below. R1—(O(CH2)a)b-[A]-[B]—O—CH2—R2—CH2—R3??(1) (In the formula (1), R1 is an alkyl group which may have a substituent, or an organic group having at least one double bond or triple bond. Further, a represents an integer of 2 to 4, and b is 0 or 1. [A] is represented by a formula (2): —(OCH2CH(OH)CH2)c— (wherein c is 1 or 2). [B] is represented by a formula (3): —(O(CH2)eCH(OH)CH2)d— (wherein d is 0 or 1, and e represents an integer of 2 to 4). However, the sum of c in the formula (2) and d in the formula (3) is 2. R2 is a perfluoropolyether chain. R3 is represented by a formula (4): —(OCH2CH(OH)CH2)2—O—CH2(CH2)fOH (wherein f represents an integer of 2 to 5).
Abstract: A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.
Abstract: An electrode body having an electrode, and a primer layer or a plurality of primer layers laminated on the electrode, wherein the at least one primer layer is an in-situ polymerizable composition layer formed from a polymerization product of an in-situ polymerizable composition, a method for producing an electrode body, and an electrochemical element.
Abstract: Provided is a method for evaluating a sample, the method including using a mixture containing a sample including at least one member selected from the group consisting of cell support-derived components, a cell suspension containing cells, an evaluation sample obtained from a cell suspension, a sample containing a liquid and microcarriers for use in cell culture, and a sample containing a liquid obtained following treatment of microcarriers, together with at least one substance selected from the group consisting of an aromatic compound having at least one functional group selected from the group consisting of a hydroxyl group, an amino group, a nitro group and a carbonyl group, and a fluorescent dye.
Type:
Application
Filed:
September 25, 2020
Publication date:
April 6, 2023
Applicant:
Showa Denko Materials Co., Ltd.
Inventors:
Masashi Maruyama, Hirotaka Sakuma, Yushi Sato, Yasuhiko Tada
Abstract: A SiC single crystal composite includes: a central portion positioned at a center in plan view; and an outer circumferential portion surrounding an outer circumference of the central portion, in which crystal planes of the central portion and the outer circumferential portion are inclined to each other or different from each other, a boundary is present between the central portion and the outer circumferential portion, and a direction of a crystal constituting the central portion and a direction of a crystal constituting the outer circumferential portion are different from each other via the boundary.
Abstract: There is provided a fluorine-containing ether compound represented by the following formula. R1—R2—CH2—R3—CH2—OCH2CH(OH)CH2O—CH2—R3—CH2—R4—R5 (in the formula. R3 represents a perfluoropolyether chain; R2 and R4 represent a divalent linking group having a polar group; R1 and R5 represent a terminal group bonded to an oxygen atom of R2 or R4; and at least one of R1 and R5 is any one selected from the group consisting of an alkenyl group having 2 to 8 carbon atoms, an alkynyl group having 3 to 8 carbon atoms, an aromatic hydrocarbon-containing group, and an aromatic heterocycle-containing group).
Abstract: The present invention provides a fluorine-containing ether compound represented by the following formula: R1—R2—CH2—R3—CH2—R4—R5 (in the formula, R3 represents a perfluoropolyether chain; R1 and R5 each independently represent any of an alkyl group which may have a substituent, an organic group having a double bond or a triple bond, and a hydrogen atom; —R2—CH2—R3 is represented by -[A]-[B]—O—CH2—R3; R3—CH2—R4— is represented by R3—CH2—O—[C]-[D]-; [A] is represented by Formula (4), [B] is represented by Formula (5), [C] is represented by Formula (6), and [D] is represented by Formula (7)):
Abstract: A resin composition for molding includes an epoxy resin, a curing agent, and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler.
Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.