Abstract: A capacitive micro-electromechanical system (MEMS) structure or device and methods of making and operating the same are described. Generally, the MEMS device provides a large stroke while maintaining good damping, enabling fast beam steering and large scan angles. In one embodiment, the capacitive MEMS device includes a bottom electrode formed over a substrate; an electrically permeable damping structure formed over the bottom electrode, the electrically permeable damping structure including a first air-gap and a dielectric layer suspended above and separated from the bottom electrode by the first air-gap; and a plurality of movable members suspended above the damping structure and separated therefrom by a second air-gap, each of the plurality of movable members including a top electrode and being configured to deflect towards the bottom electrode by electrostatic force. Other embodiments are also described.

Abstract: A spatial light modulator (SLM) including a two-dimensional (2D) array of n rows of m pixels, and a stacked drive circuit including at least one, one-dimensional (1D) array of n*m drivers monolithically integrated on the same substrate and methods of fabricating and methods of using the same in materials processing applications are provided. Generally, each pixel includes at least one modulator, and is configured to modulate light incident thereon in response to drive signals received from the stacked drive circuit. The 1D array of the stacked drive circuit includes a single row of n*m drivers arranged adjacent to and laterally separated from the 2D array of pixels. Other embodiments are also described.

Abstract: A spatial light modulator (SLM) and methods of operating the same are described. The SLM includes an array of pixels formed on a substrate, each pixel including a one or more electrostatically operable optical modulators, a receiver, a memory coupled to the receiver, and a driver including a number of drive channels coupled to the memory. Each of the drive channels is coupled to one of the pixels to drive the optical modulators in the pixel to one of a number of discrete modulation levels. The receiver receives reduced depth programming data in a predetermined sequence whereby the location of the programming data in the received data sequence implies the associated pixel address within the pixel array. The memory includes look-up-table circuitry to convert the reduced depth programming data to full depth programming data. Generally, the receiver, memory and driver are integrally formed on the same substrate with the array.

Abstract: A multi-beam scanning system and methods of operating the same to compensate for distortion are provided. Generally, the method involves illuminating a spatial light modulator including SLM pixels arranged in parallel, each pixel including a multiple address pixels. Drive signals including image data are provided to the pixels to generate beams of modulated light reflected therefrom, which is scanned to a linear swath of a two-dimensional imaging plane using a collimate lens, a scan mirror moved about a first axis, and an imaging lens. The swath is scanned across the imaging plane in a direction orthogonal to a long axis of the swath by moving the scan mirror about a second axis. To compensate for distortion along the long axis of the swath compensated image data is provided to at least some of the address pixels generating beams of modulated light distal from an optical axis of the imaging lens.

Abstract: A multi-beam scanning system and methods of operating the same to compensate for distortion are provided. Generally, the method involves illuminating a spatial light modulator including SLM pixels arranged in parallel, each pixel including a multiple address pixels. Drive signals including image data are provided to the pixels to generate beams of modulated light reflected therefrom, which is scanned to a linear swath of a two-dimensional imaging plane using a collimate lens, a scan mirror moved about a first axis, and an imaging lens. The swath is scanned across the imaging plane in a direction orthogonal to a long axis of the swath by moving the scan mirror about a second axis. To compensate for distortion along the long axis of the swath compensated image data is provided to at least some of the address pixels generating beams of modulated light distal from an optical axis of the imaging lens.

Abstract: A flow through Micro-Electromechanical Systems (MEMS) package and methods of operating a MEMS packaged using the same are provided. Generally, the package includes a cavity in which the MEMS is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the MEMS and an outlet through which the fluid is removed during operation of the MEMS, wherein the package includes features that promote laminar flow of the fluid across the MEMS. The package and method are particularly useful in packaging spatial light modulators including a reflective surface and adapted to reflect and modulate a light beam incident thereon. Other embodiments are also provided.

Abstract: A circuit and method for driving electrostatic microelectomechanical systems (MEMS) are provided. In one embodiment, the circuit includes a first electrode in a movable element of the MEMS and a second electrode on a surface of a substrate of the MEMS over which the movable element is suspended, and a driver electrically coupled to the first and the second electrodes. The driver supplies a voltage differential between the first and second electrodes to vary an electrostatic force between the electrodes thereby moving the movable element. The driver is configured to supply a voltage pulse having a leading edge in which a first voltage intermediate between an initial, minimum voltage and a maximum voltage is maintained for a first time before rising to the maximum voltage timed to dampen oscillations of the movable element. Other embodiments are also described.

Abstract: A spatial light modulator (SLM) module and methods of designing, manufacturing and using the same are provided. In one embodiment, the SLM module comprises a diffractive, diffractive SLM formed on a substrate, the SLM including a plurality of pixels each including a plurality of electrostatically deflectable actuators, and a driver including a number of drive channels each coupled to one of the plurality of electrostatically deflectable actuators. Each of the drive channels include at least one internal digital-to-analog converter (DAC) integrally formed on the same substrate as the SLM. In one embodiment, the DAC is a multi-slope charge integrating DAC. In other embodiments, the driver includes circuitry to test each of the drive channels, and a spare drive channel that can be switched in to replace a defective drive channel.

Abstract: Megasonic cleaning systems and methods of fabricating and using the same are provided. In one embodiment, the system comprises a plurality of Micro-Electromechanical System (MEMS) transducers, each transducer including a movable membrane with a membrane electrode coupled to a first potential disposed above and spaced apart from an upper surface of a die including a cavity electrode coupled to a second potential, the membrane including multiple layers including a polysilicon layer between a top silicon nitride layer and a bottom silicon nitride layer, and the membrane electrode includes the polysilicon layer; a chuck on which a target workpiece is positioned; and a fluid to couple sonic energy from the plurality of MEMS transducers to the target workpiece. Other embodiments are also provided.

Abstract: A flow through Micro-Electromechanical Systems (MEMS) package and methods of operating a MEMS packaged using the same are provided. Generally, the package includes a cavity in which the MEMS is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the MEMS and an outlet through which the fluid is removed during operation of the MEMS, wherein the package includes features that promote laminar flow of the fluid across the MEMS. The package and method are particularly useful in packaging spatial light modulators including a reflective surface and adapted to reflect and modulate a light beam incident thereon. Other embodiments are also provided.

Abstract: A system including spatial light modulators with multiple one-dimensional (1D) diffractor arrays and methods of operating the same are provided. In one embodiment, the system comprises a spatial light modulator (SLM) assembly including a plurality of one-dimensional (1D) diffractor arrays to modulate light from a light source, the plurality of 1D diffractor arrays integrally formed on a die; illumination optics disposed in a light path between the plurality of 1D diffractor arrays and the light source to illuminate a substantially linear portion of at least one of the plurality of 1D diffractor arrays; and imaging optics disposed in a light path between the SLM assembly and an image plane on a target-substrate, the imaging optics adapted to transmit modulated light from the SLM assembly to a substantially linear portion of the image plane. Other embodiments are also provided.

Abstract: A flow through Micro-Electromechanical Systems (MEMS) package and methods of operating a MEMS packaged using the same are provided. Generally, the package includes a cavity in which the MEMS is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the MEMS and an outlet through which the fluid is removed during operation of the MEMS. In certain embodiments, the fluid includes an gas, such as nitrogen, and the inlet and outlet are adapted to provide a flow of gas of from 0.01 Standard Cubic Centimeters per Minute (sccm) to 10000 sccm during operation of the MEMS. The package and method are particularly useful in packaging spatial light modulators including a reflective surface and adapted to reflect and modulate a light beam incident thereon. Other embodiments are also provided.

Abstract: A film recorder including a linear diffractive spatial light modulator (LDSLM) and methods of using the same to record a digital image on a strip of photographic film are provided. In one embodiment, the recorder includes: an illuminator including at least one monochromatic light source generating a light beam; a spatial light modulator assembly including at least one linear diffractive spatial light modulator (LDSLM) to receive the light beam from the illuminator and modulate the light beam from the illuminator; a film transport for transporting a photographic film on an imaging plane; and imaging optics disposed in a light path between the LDSLM and the imaging plane to image the light beam simultaneously on a substantially linear portion of the photographic film to record an image on the photographic film. Other embodiments are also provided.

Abstract: A diffractive MicroElectroMechanical systems and a method of fabricating the same are provided. In one embodiment, the method comprises: depositing a sacrificial layer onto a substrate; depositing a first structural layer on the sacrificial layer and patterning the structural layer to form a patterned structural layer including plurality of actuators; conformably depositing a sacrificial film on the patterned structural layer; depositing a second structural layer on the sacrificial film; planarizing the second structural layer to expose the sacrificial film and the plurality of actuators; and removing the sacrificial layer and sacrificial film to release the plurality of actuators, each of the plurality of actuators separated from the second structural layer by a thickness of the conformal sacrificial film. Other embodiments are also provided.

Abstract: A spatial light modulator (SLM) module and methods of designing, manufacturing and using the same are provided. In one embodiment, the SLM module comprises a diffractive, diffractive SLM formed on a substrate, the SLM including a plurality of pixels each including a plurality of electrostatically deflectable actuators, and a driver including a number of drive channels each coupled to one of the plurality of electrostatically deflectable actuators. Each of the drive channels include at least one internal digital-to-analog converter (DAC) integrally formed on the same substrate as the SLM. In one embodiment, the DAC is a multi-slope charge integrating DAC. In other embodiments, the driver includes circuitry to test each of the drive channels, and a spare drive channel that can be switched in to replace a defective drive channel.

Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature capable contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract: A film recorder including a linear diffractive spatial light modulator (LDSLM) and methods of using the same to record a digital image on a strip of photographic film are provided. In one embodiment, the recorder includes: an illuminator including at least one monochromatic light source generating a light beam; a spatial light modulator assembly including at least one linear diffractive spatial light modulator (LDSLM) to receive the light beam from the illuminator and modulate the light beam from the illuminator; a film transport for transporting a photographic film on an imaging plane; and imaging optics disposed in a light path between the LDSLM and the imaging plane to image the light beam simultaneously on a substantially linear portion of the photographic film to record an image on the photographic film. Other embodiments are also provided.

Abstract: A linear dense-packed spatial light modulator (LDSLM) and method of modulating light using the same are provided. In one embodiment, the LDSLM comprises a plurality of two dimensional (2D) modulators grouped proximal to one another on a surface of a substrate to form a densely-packed, linear array having a plurality of pixels along a longitudinal axis of the array. Each pixel includes a number of 2D modulators electrically coupled to receive a common drive signal and to modulate light reflected therefrom in response to the drive signal. Preferably, each pixel includes at least two 2D modulators grouped along a transverse axis of the array. More preferably, the number of 2D modulators along the transverse axis in each pixel is selected to provide a desired power density while avoiding an undesired thermal gradient across the LDSLM. The LDSLM and method are particularly useful in printing applications. Other embodiments are also disclosed.