Abstract: Electronic device and method to facilitate control frame transmission are provided. The electronic device comprises an interconnection controller including a physical layer circuit for signal transmission, a signaling interface, a link controller coupled to the physical layer circuit through the signaling interface, and a bypass path coupled to the link controller for control frame transmission. The link controller is configured to transmit data to the physical layer circuit through the signaling interface, and to transmit a control frame to the physical layer circuit through a signal path including the bypass path to bypass at least one circuit stage of the link controller.

Abstract: A semiconductor device and a manufacturing method of the semiconductor device are provided. The semiconductor device includes a stacked structure including a plurality of conductive patterns and a plurality of insulating patterns alternately stacked on each other, a cell plug passing through the stacked structure, a select plug coupled to the cell plug, and a select pattern surrounding the select plug, wherein the select pattern includes a first conductive portion and a second conductive portion covering a sidewall and a top surface of the first conductive portion, and wherein the conductive patterns, the first conductive portion, and the second conductive portion include different materials.

Abstract: A semiconductor memory device includes: a gate electrode stack vertically stacked over a substrate with bent gate pads, the bent gate pads portion of the gate electrode stack having a step-shaped structure; an inter-layer dielectric layer covering the bent gate pads; and a plurality of contact plugs respectively coupled to the bent gate pads by penetrating the inter-layer dielectric layer, wherein the bent gate pads include angled corner portions of different sizes.

Abstract: A semiconductor device includes a gate structure including alternately stacked conductive layers and insulating layers, channel structures passing through the gate structure. Each of the conductive layers may include a first portion having a first thickness and a second portion having a second thickness thicker than the first thickness, and the second portion may include a first metal layer, a second metal layer in the first metal layer, and a first barrier layer interposed between the first metal layer and the second metal layer.

Abstract: A semiconductor device includes an error correction buffer circuit that generates an error correction signal when one of a first write operation and a second write operation is performed based on a command address, a first chip selection signal, a second chip selection signal, first data, and second data; a first data storage block that stores the first data when the first write operation is performed based on the command address, the first chip selection signal, and the second chip selection signal, a second data storage block that stores the second data when the second write operation is performed based on the command address, the first chip selection signal, and the second chip selection signal; and an error correction signal storage circuit that stores the error correction signal when one of the first write operation and the second write operation is performed based on the command address.

Abstract: A memory system includes a memory device and a controller. The memory device includes a plurality of memory cells. The controller is configured to select first map data entries associated with first data entries stored in a first region of the memory device that includes some of the plurality of memory cells, to exclude a second map data entry associated with second data entry sequentially read from among the first map data entries, and to transmit a remaining first map data entry to an external device.

Abstract: A storage device includes: a memory device; and a memory controller configured to receive, from an external device having an external memory, a write command for storing data in the memory device and address information of an area in the external memory that corresponds to the write command, and acquire write data from the external device based on the address information. The memory controller may be further configured to store the write data in the memory device in response to the write command. The memory controller may be further configured to acquire a portion of the write data from the external memory upon a failure of storage of the portion of the write data in the memory device, and provide a response to the write command to the external device after completing storing of the write data in the memory device.

Abstract: A storage device includes a plurality of memory devices, a plurality of cores controlling the plurality of memory devices, and a host interface configured to select a first core of the plurality of cores to store a plurality of meta data in a memory device controlled by the first core, and configured to switch to a second core from the plurality of cores to store the plurality of meta data in a memory device controlled by the second core, when the number of operations for storing a first meta data, from among the plurality of meta data, by the first core exceeds a threshold value.

Abstract: A semiconductor system includes a first semiconductor apparatus and a second semiconductor apparatus. The first semiconductor apparatus transmits an address signal during an address cycle after transmitting a command signal during a command cycle. The first semiconductor apparatus transmits a selection signal during a logical unit number selection cycle before the command cycle. The second semiconductor apparatus performs a data input and output operation based on the selection signal, the command signal, and the address signal.

Abstract: A signal transmission circuit comprising: a first data transmission circuit configured to output, through a first data output node thereof and in response to a first operation clock applied to a first clock input node thereof, first output data obtained by sensing and amplifying a first input data pair applied to a first differential input node pair thereof, a clock transmission circuit configured to output through a second data output node thereof, a second operation clock generated in response to the first operation clock applied to a second clock input node thereof while a power supply voltage and a ground voltage are applied to a second differential input node pair thereof, and a first data output circuit configured to output the first output data in synchronization with the second operation clock, wherein the first data transmission circuit is modeled on the clock transmission circuit.

Abstract: A method of forming patterns includes: forming a hard mask layer on a target layer, coating a cleavage relief layer on the hard mask layer to fill cleavages generated in the hard mask layer, forming photoresist patterns on the cleavage relief layer, removing portions of the cleavage relief layer and portions of the hard mask layer using the photoresist patterns as a first etch mask to form hard mask patterns, removing portions of the target layer using the hard mask patterns as a second etch mask to form target layer patterns, and removing the hard mask patterns. The hard mask layer includes an amorphous carbon layer (ACL), and the cleavage relief layer includes a spin-on carbon (SOC) layer.

Abstract: A storage device may receive, from an external device, a target read recovery level indicating information on a read command execution completion time and an error recovery amount requested by the external device, may read, from a memory, data requested by a read command transmitted by the external device, and may transmit, to the external device, a response regarding a result of executing the read command transmitted by the external device within the read command execution completion time indicated by the target read recovery level.

Abstract: A memory device and a method of manufacturing the memory device are described. The memory device includes a connection structure formed on a substrate, lower contacts formed on the connection structure, upper contacts formed on the lower contacts, a dummy pattern configured to enclose the lower contacts and spaced apart from the lower contacts, etching stop patterns formed in an upper region of the dummy pattern, and dummy contacts formed over the etching stop patterns.

Abstract: A memory device includes a cell area and a contact area extending from the cell area in a first direction. The contact area includes a stepped structure arranged along a second direction that intersects the first direction. The memory device also includes a support pattern separating the contact area into a first contact area coupled to the cell area and a second contact area separated from the cell area by the support pattern. The support pattern may include sub-support patterns extending in the first direction and contacting both sides of the second contact area. At least one of the sub-support patterns overlaps at least a portion of the stepped structure, and the second contact area does not overlap with the stepped structure.

Abstract: An electronic device includes a count signal generation circuit configured to increase one of the values of a weak cell count signal and an active count signal by comparing a weak cell address with an adjacent address generated from a row address, when an active operation is performed. The electronic device also includes a target refresh control circuit configured to latch the adjacent address based on the values of the weak cell count signal and the active count signal and to output the latched adjacent address as a target address for a refresh operation based on a target refresh signal.

Abstract: A memory module includes a module substrate, a plurality of memory devices, a first power line, and a second power line. The memory devices are mounted on the module substrate. Each of the memory devices includes a power management member. The first power line may be arranged in the module substrate to provide each of the memory devices with power. The second power line may be electrically connected between the power management members of adjacent memory devices to control and share the power provided to the adjacent memory devices.

Abstract: A memory device includes: a memory cell array including a cell string including a plurality of memory cells respectively connected between a common source line and a plurality of bit lines; a peripheral circuit for performing an internal operation on the memory cells; and control logic for controlling the peripheral circuit to apply a voltage necessary for the internal operation to word lines connected to the plurality of memory cells. The peripheral circuit includes a pass voltage information generator for generating pass voltage information including a number of clocks input from a time at which a pass voltage is applied to the word lines to a time at which a voltage level of the common source line reaches a predetermined reference level. The control logic includes a pass voltage determiner for determining a pass voltage to be applied to the word lines, based on the pass voltage information.

Abstract: The present technology may include a voltage generation circuit configured to generate a plurality of voltages in response to at least one voltage control signal, and control logic configured to generate the at least one voltage control signal in order to adjust at least one of an under drive time and an under drive offset during an under drive operation of a semiconductor apparatus according to a temperature information signal and a pre-stored temperature characteristic signal of the semiconductor apparatus.

Abstract: An image sensing device includes a first substrate including a first front surface and a first back surface, a first interlayer insulation layer disposed below the first front surface and including a first interconnect, a second substrate including a second front surface and a second back surface, a second interlayer insulation layer disposed over the second front surface and below the first interlayer insulation layer to be in contact with the first interlayer insulation layer, and including a second interconnect, a first TSV disposed in a through hole formed by penetrating the first substrate and the first interlayer insulation layer and by etching of a portion of the second interlayer insulation layer, and electrically connecting the first interconnect to the second interconnect, and a passivation layer formed to cover the first TSV. An upper end of the first TSV is located at a height lower than the first back surface.

Abstract: A memory device, and a method of operating the memory device, includes a memory block including strings formed between bit lines and a source line and includes a peripheral circuit configured to perform a read operation of a selected memory cell included in a selected string among the strings. The peripheral circuit includes page buffers configured to increase a voltage of channels of the strings by applying a first precharge voltage to the bit lines in a set-up phase of the read operation, apply a second precharge voltage lower than the first precharge voltage to the bit lines in a read phase of the read operation, and discharge the bit lines in a discharge phase of the read operation.