Abstract: Envelope tracking power amplifiers with advanced gain shaping are provided. In certain implementations, a power amplifier system includes a power amplifier that amplifies a radio frequency (RF) signal and an envelope tracker that controls a voltage level of a supply voltage of the power amplifier based on an envelope of the RF signal. The power amplifier system further includes a gain shaping circuit that generates a gain shaping current that changes with the voltage level of the supply voltage from the envelope tracker. For example, the gain shaping circuit can include an analog look-up table (LUT) mapping a particular voltage level of the supply voltage to a particular current level of gain shaping current. Additionally, the gain shaping circuit biases the power amplifier based on the gain shaping current.
Type:
Grant
Filed:
February 27, 2020
Date of Patent:
August 3, 2021
Assignee:
Skyworks Solutions, Inc.
Inventors:
Yu-Jui Lin, Wei Zhang, David Steven Ripley, Vignesh Sridharan
Abstract: An acoustic wave device is disclosed. The acoustic wave device can include a transmit filter that includes bulk acoustic wave resonators and a series surface acoustic wave resonator that is coupled between the bulk acoustic wave resonators and a transmit output node. The acoustic wave device can also include a loop circuit that is coupled to the transmit filter. The loop circuit can generate an anti-phase signal to a target signal at a particular frequency.
Abstract: Embodiments described herein present a new LDO design that eliminates the need for the sleep bias circuitry included in other systems. Further, the new LDO design can be biased with a small fraction of the operating current enabling the LDO to wake up substantially faster than previous LDO designs that include separate sleep circuitry. In some cases, the LDO can instantly (or faster than other LDOs) transition from a sleep mode to an operating mode enabling improved operation compared to prior LDOs. Furthermore, the new LDO design maintains a non-breakdown voltage across the transistors reducing the need to enter sleep mode to prevent transistors of the LDO from entering a breakdown region.
Abstract: Circuits and methods related to radio-frequency (RF) architectures having carrier aggregation. In some implementations, a carrier aggregation (CA) architecture can include a duplexer configured to provide duplexing functionality for a first frequency band and a second frequency band with a common antenna. The CA architecture can further include a first amplification path and a second amplification path coupled to respective ports of the duplexer, each of the first amplification path and the second amplification path configured to amplify a signal in its respective frequency band, each amplification path including a transmit/receive (TX/RX) switch configured to provide time-division duplexing (TDD) functionality for the amplified signal and a received signal. In some implementations, the first frequency band includes a B39 band, and the second frequency band includes a B41 band.
Type:
Grant
Filed:
October 10, 2019
Date of Patent:
July 20, 2021
Assignee:
Skyworks Solutions, Inc.
Inventors:
Ethan Chang, Roman Zbigniew Arkiszewski, John G. Freed, Edward James Anthony, Reza Kasnavi
Abstract: Apparatus and methods for biasing power amplifiers are provided herein. In certain embodiments, a power amplifier includes a bipolar transistor having a base biased by a bias network having a reactance that controls an impedance at the transistor base to achieve substantially flat phase response over large dynamic power levels. For example, the bias network can have a frequency response, such as a high-pass or band-pass response, that reduces the impact of power level on phase distortion (AM/PM).
Type:
Grant
Filed:
January 9, 2020
Date of Patent:
July 20, 2021
Assignee:
Skyworks Solutions, Inc.
Inventors:
Kunal Datta, Khaled A. Fayed, Edward James Anthony, Srivatsan Jayaraman, Jinghang Feng
Abstract: A method for manufacturing a package with a conformal shield antenna includes forming a mold compound layer, attaching the mold compound layer to a printed circuit board, applying a conformal shield layer on a first surface of the mold compound layer, the mold compound layer disposed between the conformal shield layer and the printed circuit board module, and shaping the conformal shield layer to define a planar antenna structure. Optionally, the method includes forming a cavity in the mold compound layer, applying a cover layer over the cavity to enclose the cavity and hardening the cover layer.
Type:
Grant
Filed:
April 2, 2018
Date of Patent:
July 20, 2021
Assignee:
Skyworks Solutions, Inc.
Inventors:
Dinhphuoc Vu Hoang, Robert Francis Darveaux, Anthony James LoBianco, Lori Ann DeOrio, Hoang Mong Nguyen, Ki Wook Lee, Hardik Bhupendra Modi, Foad Arfaei Malekzadeh, Stephen Joseph Kovacic, René Rodriguez
Abstract: Apparatus and methods for quadrature combined Doherty amplifiers are provided herein. In certain embodiments, a separator is used to separate a radio frequency (RF) input signal into a plurality of input signal components that are amplified by a pair of Doherty amplifiers operating in quadrature. Additionally, a combiner is used to combine a plurality of output signal components generated by the pair of Doherty amplifiers, thereby generating an RF output signal exhibiting quadrature balancing.
Type:
Grant
Filed:
April 14, 2020
Date of Patent:
July 20, 2021
Assignee:
Skyworks Solutions, Inc.
Inventors:
Aleksey A. Lyalin, Philip John Lehtola, Bo Pan, Weimin Sun
Abstract: Disclosed herein are embodiments of modified z-type hexagonal ferrite materials having improved properties that are advantageous for radiofrequency applications, in particular high frequency ranges for antennas and other devices. Atomic substitution of strontium, aluminum, potassium, and trivalent ions can be used to replace certain atoms in the ferrite crystal structure to improve loss factor at high frequencies.
Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding, and forming a conductive layer on an upper surface of the overmold such that the conductive layer is in electrical contact with some or all of the shielding-wirebonds.
Type:
Grant
Filed:
January 5, 2020
Date of Patent:
July 13, 2021
Assignee:
Skyworks Solutions, Inc.
Inventors:
Hoang Mong Nguyen, Luis Eduardo Herrera, Sergio Joaquin Gonzalez Flores, Matthew Sean Read, Anthony James Lobianco, Heliodoro Osuna
Abstract: Disclosed herein are front-end modules that support carrier aggregation. Wireless communication configurations are disclosed that include a plurality of such front-end modules to support uplink and/or downlink carrier aggregation. Individual front end modules include a power amplifier module to amplify signals received at a transceiver port and a low-noise amplifier module to amplify signals received at an antenna port. The front-end modules include a multiplexer and an antenna switch module with a plurality of filters and duplexers between them along a corresponding plurality of paths. One path processes frequency division duplex (FDD) signals and another path processes time division duplex (TDD) signals. The front-end modules amplify TDD signals while received FDD signals are directed off module for amplification.
Abstract: Disclosed herein are switching or other active FET configurations that implement a branch design with one or more interior FETs of a main path coupled in parallel with one or more auxiliary FETs of an auxiliary path. Such designs include a circuit assembly for performing a switching function that includes a branch with a plurality of auxiliary FETs coupled in series and a main FET coupled in parallel with an interior FET of the plurality of auxiliary FETs. The body nodes of the FETs can be interconnected and/or connected to a body bias network. The body nodes of the FETs can be connected to body bias networks to enable individual body bias voltages to be used for individual or groups of FETs.
Type:
Grant
Filed:
September 1, 2020
Date of Patent:
July 13, 2021
Assignee:
SKYWORKS SOLUTIONS, INC.
Inventors:
Hailing Wang, Dylan Charles Bartle, Hanching Fuh, Jerod F. Mason, David Scott Whitefield, Paul T. DiCarlo
Abstract: The present disclosure relates to devices and methods for detecting and preventing occurrence of a saturation state in a power amplifier. A power amplifier module can include a power amplifier including a cascode transistor pair. The cascode transistor pair can include a first transistor and a second transistor. The power amplifier module can include a current comparator configured to compare a first base current of the first transistor and a second base current of the second transistor to obtain a comparison value. The power amplifier module can include a saturation controller configured to supply a reference signal to an impedance matching network based on the comparison value. The impedance matching network can be configured to modify a load impedance of a load line in electrical communication with the power amplifier based at least in part on the reference signal.
Type:
Grant
Filed:
May 31, 2019
Date of Patent:
July 6, 2021
Assignee:
Skyworks Solutions, Inc.
Inventors:
David Steven Ripley, Philip John Lehtola
Abstract: Voltage converter having light-load control. In some embodiments, a voltage converter can be configured to receive an input voltage and generate a regulated voltage. Such a voltage converter can include a determining unit configured to determine whether the voltage converter is in a first load state. The voltage converter can further include a driving unit in communication with the determining unit, and be configured to generate a first driving signal when the voltage converter is in the first load state. The voltage converter can further include a switching unit in communication with the driving unit, and be configured to route the first driving signal to a control element of the voltage converter when the voltage converter is in the first load state, and be further configured to route a second driving signal to the control element when the voltage converter is in a second load state.
Abstract: Aspects of this disclosure relate to a filter that includes an acoustic wave device with a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate (e.g., a quartz substrate), a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the acoustic wave device. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. The thermally conductive layer has a thickness that is greater than 10 nanometers and less than a thickness of the piezoelectric layer.
Type:
Grant
Filed:
May 16, 2019
Date of Patent:
June 29, 2021
Assignee:
Skyworks Solutions, Inc.
Inventors:
Keiichi Maki, Rei Goto, Gong Bin Tang, Yosuke Hamaoka
Abstract: Field-effect transistor (FET) devices are described herein that include an insulator layer, a plurality of active field-effect transistors (FETs) formed from an active silicon layer implemented over the insulator layer, a substrate layer implemented under the insulator layer, and proximity electrodes for a plurality of the FETs that are each configured to receive a voltage and to generate an electric field between the proximity electrode and a region generally underneath a corresponding active FET. FET devices can be stacked wherein one or more of the FET devices in the stack includes a proximity electrode. The proximity electrodes can be biased together, biased in groups, and/or biased individually.
Type:
Grant
Filed:
October 1, 2019
Date of Patent:
June 29, 2021
Assignee:
SKYWORKS SOLUTIONS, INC.
Inventors:
Hailing Wang, Hanching Fuh, Dylan Charles Bartle, Jerod F. Mason
Abstract: A shield enclosure includes a housing with a peripheral wall that defines a cavity, and a cover removably coupleable to the housing to at least partially seal the cavity. The cavity is sized to receive a printed circuit board therein. The housing shields the printed circuit board from electromagnetic interference and noise during noise figure testing of a radiofrequency component on the printed circuit board.
Type:
Grant
Filed:
April 2, 2020
Date of Patent:
June 29, 2021
Assignee:
Skyworks Solutions, Inc.
Inventors:
Cesar Verdugo Muñoz, Jorge Luis Pineda, Edgar Antonio Martinez, Daniel Murillo, Adrian Flores Baca
Abstract: An electronic device includes a first substrate and a second substrate. A side wall joins the first substrate to the second substrate. The side wall includes a first alloy layer of a first metal and a second metal bonded directly to an upper surface of the first substrate and a second alloy layer of the first metal and a third metal disposed on top of the first alloy layer and bonded directly to a lower surface of the second substrate, the second metal and the third metal being different from each other and from the first metal. An electronic circuit is disposed on the lower surface of the second substrate within a cavity defined by the lower surface of the first substrate, the upper surface of the second substrate, and the side wall.
Abstract: Radio-frequency (RF) switching devices having improved voltage handling capability. In some embodiments, a switching device can include a first terminal and a second terminal, and a plurality of switching elements connected in series to form a stack between the first terminal and the second terminal. The switching elements can have a non-uniform distribution of a parameter that results in the stack having a first voltage handling capacity that is greater than a second voltage handling capacity corresponding to a similar stack having a substantially uniform distribution of the parameter.
Type:
Grant
Filed:
November 5, 2014
Date of Patent:
June 22, 2021
Assignee:
Skyworks Solutions, Inc.
Inventors:
Guillaume Alexandre Blin, Aniruddha B. Joshi, Christophe Masse
Abstract: Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.
Type:
Grant
Filed:
November 8, 2019
Date of Patent:
June 22, 2021
Assignee:
Skyworks Solutions, Inc.
Inventors:
Gregory Edward Babcock, Lori Ann DeOrio, Darren Roger Frenette, George Khoury, Anthony James LoBianco, Hoang Mong Nguyen, Leslie Paul Wallis