Patents Assigned to Skyworks Solution, Inc.
  • Capacitive-coupled bandpass filter
    Patent number: 11211911
    Abstract: Examples of a capacitive-coupled bandpass filter include a plurality of coupling capacitors connected in series along a signal path extending between an input contact and an output contact, a first harmonic suppression notch circuit configured to provide a first harmonic suppression notch in a frequency response of the capacitive-coupled bandpass filter, and a second harmonic suppression notch circuit configured to provide a second harmonic suppression notch in the frequency response of the capacitive-coupled bandpass filter. The first harmonic suppression notch circuit includes a first pair of series L/C resonators connected in shunt between the signal path and a reference potential, and the second harmonic suppression notch circuit includes a second pair of series L/C resonators connected in shunt between the signal path and the reference potential.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: December 28, 2021
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Dongjin Jung, Hanseung Lee, Weimin Sun
  • Methods related to radio-frequency front-end systems
    Patent number: 11211976
    Abstract: Methods related to radio frequency front end systems. In some embodiments, the method can include providing a first module configured to provide multi-input multi-output (MIMO) receive operations for a first plurality of mid bands and a first plurality of high bands. The first module can be further configured to provide transmit operations for the plurality of mid bands. The first module can include a first node. The method can include providing a second module configured to provide transmit and receive operations for a second plurality of mid bands and a second plurality of high bands. The second module can be a power amplifier integrated duplexer (PAiD) module. The second module can include a second node. The first module and the second module can be coupled by a signal path at the first node and the second node, respectively.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: December 28, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventor: John Chi-Shuen Leung
  • High dielectric constant material at locations of high fields
    Patent number: 11205696
    Abstract: An integrated circuit has an isolation capacitor structure that reduces the risk of breakdown from high electric fields at the edge of the top metal plate of the capacitor. The capacitor structure includes a bottom metal plate above a substrate. A first dielectric layer of a first dielectric material is formed between the bottom metal plate and the top metal plate. The capacitor structure also includes a thin narrow ring formed of a second dielectric material located under a portion of the top metal plate. The second dielectric material has a higher dielectric constant than the first dielectric material. The thin narrow ring follows the shape of the edge of the top metal plate with a portion of the ring underneath the top metal plate and a portion outside the edge of the top metal plate to thereby be located at a place of the maximum electric field.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: December 21, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Dan B. Kasha, Russell Croman, Stefan N. Mastovich, Thomas C. Fowler
  • Cascode power amplifier with switchable output matching network
    Patent number: 11201595
    Abstract: A radio-frequency (RF) module includes a first transistor having a base, a collector, and an emitter, a radio-frequency output transmit path coupled to the collector of the first transistor at a first end and to a radio-frequency output port at a second end, and an output matching network disposed in the radio-frequency output transmit path, the output matching network including a shunt arm coupled to ground, the shunt arm including a switch that is controllable to modify an impedance of the output matching network.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: December 14, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: John William Mitchell Rogers, Gordon Glen Rabjohn, John Jackson Nisbet
  • Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array package
    Patent number: 11201066
    Abstract: Described herein are methods of manufacturing dual-sided packaged electronic modules to control the distribution of an under-fill material between one or more components and a packaging substrate. The disclosed technologies include using a dam on a packaging substrate that is configured to prevent or limit the flow of a capillary under-fill material. This can prevent or limit the capillary under-fill material from flowing onto or contacting other components or elements on the packaging substrate, such as solder balls of a ball-grid array. Accordingly, the disclosed technologies control under-fill for dual-sided ball grid array packages using a dam on a packaging substrate.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: December 14, 2021
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Robert Francis Darveaux, Bruce Joseph Freyman, Yi Liu
  • Switch linearization by compensation of a field-effect transistor
    Patent number: 11196159
    Abstract: A radio-frequency switch is disclosed, comprising a set of field-effect transistors disposed between a first node and a second node. In some embodiments, each field-effect transistor of the set of field-effect transistors has a respective source, drain, gate, and body. In some embodiments, the radio-frequency switch includes a compensation circuit coupled in parallel with the set of field-effect transistors, the compensation circuit configured to compensate a non-linearity effect generated by the set of field-effect transistors.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: December 7, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Zhiyang Liu, Nuttapong Srirattana
  • High-power hybrid SPDT switch
    Patent number: 11196453
    Abstract: A switch assembly includes a PIN diode connected between an antenna port and a receive port, a first shunt FET device connected between the receive port and ground, a first series FET device connected between the antenna port and a transmit port, a second shunt FET device connected between the transmit port and ground, and a plurality of bias control contacts configured to receive a corresponding plurality of bias control voltages to forward bias the first shunt FET device and the first series FET device into an ON state and to reverse bias the PIN diode and the second shunt FET device into an OFF state in a transmit mode, and to reverse bias the first shunt FET device and the first series FET device into the OFF state and to forward bias the PIN diode and the second shunt FET device into the ON state in a receive mode.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: December 7, 2021
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventor: Stephen Richard Moreschi
  • Method of modifying a supply voltage to a power amplifier based on estimated number of resource blocks
    Patent number: 11196340
    Abstract: Described herein are systems, architectures, circuits, devices, and methods for a DC-DC converter that dynamically adjusts a supply voltage to a power amplifier based on the number of resource blocks in a signal to be transmitted. The disclosed technologies estimate the number of resource blocks in a signal, generate a signal corresponding to the estimated number of resource blocks, and modify a supply voltage based on the generated signal. These technologies can be used to increase the efficiency of power amplifier systems for cellular signals being transmitted that have fewer resource blocks than is typically assumed (e.g., at least 100 resource blocks).
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: December 7, 2021
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Sabah Khesbak, Florinel G. Balteanu, Roman Zbigniew Arkiszewski
  • Control circuitry for silicon-on-insulator chip
    Patent number: 11190182
    Abstract: Disclosed herein are non-limiting examples of charge pumps that reduce the introduction of noise into a circuit in which they are implemented and/or lower the output impedance when providing certain voltages (e.g., negative voltage generators). The disclosed technologies utilize a plurality of smaller charge pumps (or charge pump units) working in parallel that operate on different clock phases rather than using a single charge pump with a relatively large flying capacitor or a plurality of charge pumps in series. This can, for example, reduce spurious signals or spurs that arise due at least in part to the characteristics of the clock signal. The disclosed technologies may be particularly advantageous for SOI-based components and circuits.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: November 30, 2021
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Florinel G. Balteanu, Paul T. DiCarlo
  • Carrier aggregation with switchable impedance and reconfigurable network selection
    Patent number: 11190223
    Abstract: Described herein are systems configured for carrier aggregation. Systems include a multiplexing circuit having a filter assembly, switching circuit with a switching path, and a switchable impedance. The filters can be designed so that when operated simultaneously (e.g., during multi-band operation) the same inductance can be used allowing the switching network to switch in a particular inductance into the path. The described systems can include an inductance that is coupled to an output port so that when operating in single-band mode, the different paths share the same inductance. Relative to other solutions, the described systems can improve performance (e.g., reduce insertion loss), reduce the number of components in the associated module, reduce manufacturing costs, and the like.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: November 30, 2021
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Stephane Richard Marie Wloczysiak, Phi Nguyen Dang
  • Low frequency shield solutions with sputtered/sprayed absorber materials and/or absorber materials mixed in mold compound
    Patent number: 11190158
    Abstract: An electronic device includes an electromagnetic interference shield having a layer of conductive material covering at least a portion of the electronic device and having a skin depth of less than 2 ?m for electromagnetic signals having frequencies in a kilohertz range.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: November 30, 2021
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Dinhphuoc Vu Hoang, Robert Francis Darveaux
  • Variable-phase amplifier circuits and devices
    Patent number: 11183984
    Abstract: Variable-phase amplifier circuits and devices. In some embodiments, an amplifier can include a variable-gain stage having a plurality of switchable amplification branches, with each being capable of being activated, such that a combination of one or more activated amplification branches provides respective gain level and phase shift. The plurality of switchable amplification branches can be configured such that the phase shift provided by each combination of one or more activated amplification branches compensates for a phase shift associated with the amplifier operating with the respective gain level of the variable-gain stage.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: November 23, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Junhyung Lee, Johannes Jacobus Emile Maria Hageraats, Joshua Haeseok Cho
  • Amplitude-phase canceling circuit for switch linearity
    Patent number: 11177802
    Abstract: Amplitude-phase canceling circuit for switch linearity. In some embodiments, a radio-frequency switch circuit can include first and second switch arms, with each switch arm including a plurality of transistors arranged in series to form a stack between a first node and a second node. The first node of the first switch arm can be coupled to the first node of the second switch arm. The radio-frequency switch circuit can further include an amplitude-phase cancelling block implemented across one or more transistors of each switch arm, and configured such that a third harmonic resulting from an ON state of the first switch arm is substantially canceled by a third harmonic resulting from an OFF state of the second switch arm.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: November 16, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Zijiang Yang, Nuttapong Srirattana
  • Lamb wave resonator and other type of acoustic wave resonator included in one or more filters
    Patent number: 11177787
    Abstract: Aspects of this disclosure relate to acoustic wave filters that include a Lamb wave resonator and a second acoustic wave resonator that is a different type of acoustic wave resonator than the Lamb wave resonator. The different type of resonator can be a film bulk acoustic wave resonator for example. Some embodiments of this disclosure relate to an acoustic wave filter that includes the Lamb wave resonator and the second acoustic wave resonator. Some embodiments of this disclosure related to different respective acoustic wave filters including the Lamb wave resonator and the second acoustic wave resonator, in which the Lamb wave resonator and the second acoustic wave resonator are implemented on a common substrate.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 16, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Joshua James Caron, Toru Jibu, Benjamin Paul Abbott
  • Backside metalization with through-wafer-via processing to allow use of high q bondwire inductances
    Patent number: 11171110
    Abstract: A flip-chip integrated circuit die includes a front side including active circuitry formed therein and a plurality of bond pads in electrical communication with the active circuitry, at least two through-wafer vias extending at least partially though the die and having portions at a rear side of the die, and a bond wire external to the die and electrically coupling the portions of the at least two through-wafer vias at the rear side of the die.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: November 9, 2021
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Bharatjeet Singh Gill, Grant Darcy Poulin
  • Envelope tracking for Doherty power amplifiers
    Patent number: 11165393
    Abstract: Envelope tracking schemes for Doherty power amplifiers are provided herein. In certain embodiments, a mobile device includes a Doherty power amplifier that amplifies an RF signal for transmission on an antenna, and an envelope tracker that controls a supply voltage of the Doherty power amplifier based on an envelope of the RF signal amplified by the Doherty power amplifier. Thus, supply modulation is used to control the supply voltage of the Doherty power amplifier to achieve gains in linearity, efficiency, and/or other performance metrics. Furthermore, the Doherty power amplifiers herein can provide higher overall transmission efficiency and/or lower DC power consumption, which in turn leads to lower operating temperatures and/or improved reliability.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: November 2, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventor: David Richard Pehlke
  • Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
    Patent number: 11166399
    Abstract: An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: November 2, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Philip H. Thompson, Larry D. Pottebaum
  • Variable power amplifier bias impedance
    Patent number: 11165392
    Abstract: Systems and methods including variable power amplifier bias impedance are disclosed. In one aspect, there is provided a power amplifier system including a bias circuit configured to receive a bias voltage and generate a bias signal and a power amplifier stage configured to receive an input radio frequency (RF) signal and generate an output RF signal. The power amplifier system may also include a bias impedance component operatively coupled between the bias circuit and the power amplifier stage. The bias impedance is component configured to receive a control signal and adjust an impedance value of the bias impedance component in response to the control signal.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: November 2, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventor: Philip John Lehtola
  • Apparatus and methods for overload protection of radio frequency amplifiers
    Patent number: 11165395
    Abstract: Radio frequency amplifiers with overload protection are provided herein. In certain configurations, an RF amplifier system includes an RF amplifier that receives an RF signal from an input terminal and that generates an amplified RF signal at an output terminal, and an overload detection circuit that generates a detection signal indicating a detected signal level of the RF amplifier. The RF amplifier includes an amplification device that amplifies the RF signal and a degeneration circuit that provides degeneration to the amplification device. Additionally, the detection signal is operable to control an amount of degeneration provided by the degeneration circuit so as to protect the RF amplifier from overload.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: November 2, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventor: Leslie Paul Wallis
  • Beamforming communication systems with sensor aided beam management
    Patent number: 11165477
    Abstract: Apparatus and methods for beamforming communication systems with sensor aided beam management are provided. In certain embodiments, a beamforming communication system includes an antenna array including a plurality of antenna elements. The beamforming communication system further includes a plurality of signal conditioning circuits operatively associated with the antenna elements, one or more sensors that generate sensor data, and a beam management circuit that controls the signal conditioning circuits to manage beamforming. The beam management circuit provides beam management based on the sensor data.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: November 2, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventor: Dominique Michel Yves Brunel