Abstract: Improved switched multiplexer architecture for supporting carrier aggregation in front-end applications. Front end architectures are disclosed that use two filters for a particular frequency band to allow for carrier aggregation using bands that at least partially overlap in frequency. An antenna switch module can be used to independently couple individual filters to an antenna to support a variety of carrier aggregation modes. Switches that connect to the two filters that split the particular frequency band can be configured to operate independently so as to only pass signals within a sub-band of the particular frequency band when operating in certain carrier aggregation modes.

Abstract: An acoustic wave device includes an acoustic wave filter configured to filter a radio frequency signal and a loop circuit coupled to the acoustic wave filter. The loop circuit is configured to generate an anti-phase signal to a target signal at a particular frequency. The loop circuit includes a Lamb wave resonator having a piezoelectric layer and an interdigital transducer electrode disposed on the piezoelectric layer. The piezoelectric layer includes free edges. An edge of the piezoelectric layer is configured to one of suppress or scatter reflections of acoustic waves generated by the interdigital transducer electrode from the edge of the piezoelectric layer.

Abstract: Stack assembly having electro-acoustic device. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.

Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such packaged module includes a low noise amplifier in an interior of a radio frequency shielding structure and an antenna external to the radio frequency shielding structure. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The radio frequency shielding structure can extend above a package substrate. The antenna can be on the package substrate. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

Abstract: Envelope tracking systems with modeling for power amplifier supply voltage filtering are provided herein. In certain embodiments, an envelope tracking system includes a supply voltage filter, a power amplifier that receives a power amplifier supply voltage through the supply voltage filter, and an envelope tracker that generates the power amplifier supply voltage. The power amplifier provides amplification to a radio frequency (RF) signal that is generated based on digital signal data, and the envelope tracker generates the power amplifier supply voltage based on an envelope signal corresponding to an envelope of the RF signal. The envelope tracking system further includes digital modeling circuitry that models the supply voltage filter and operates to digitally compensate the digital signal data for effects of the supply voltage filter, such as distortion.

Abstract: A packaged radio frequency module includes a package substrate. A semiconductor die is attached to the package substrate and includes one or more radio frequency circuits fabricated therein. A molding compound encapsulates the semiconductor die. An electromagnetic shielding structure at least partially covers the molding compound, the electromagnetic shielding structure having an outer layer including cobalt. A phone board assembly can include the packaged radio frequency module attached to a printed circuit board. The packaged radio frequency module can be incorporated into a mobile device.

Abstract: An amplifier circuit is provided that includes an amplifier having a signal input and a signal output, the amplifier being configured to produce an amplified signal at the signal output, a feedback path coupled between the signal output and the signal input, and an amplifier linearity boost circuit positioned in the feedback path. The amplifier linearity boost circuit includes a non-linear current generator and a phase-shifting circuit, the non-linear current generator being configured to provide a non-linear current based on the amplified signal, and the phase-shifting circuit being configured to adjust a phase of the non-linear current to reduce an intermodulation distortion of the amplified signal.

Abstract: Aspects of this disclosure relate to a shielded radio frequency component with an integrated antenna. An antenna can be on a first side of a multi-layer substrate and a radio frequency component can be disposed on a second side of the multi-layer substrate such that a ground plane of the multi-layer substrate is positioned between the antenna and the radio frequency component. Conductive features can be disposed around the radio frequency component and electrically connected to the ground plane. The conductive features and the ground plane can provide shielding for the radio frequency component. In certain embodiments, the conductive features can include bumps, such as solder bumps and/or copper pillars.

Abstract: A ceramic resonator radio frequency filter includes a printed circuit board, one or more first coaxial resonators disposed on the printed circuit board, and one or more second coaxial resonators disposed over the one or more first coaxial resonators so that the one or more first coaxial resonators and one or more second coaxial resonators are arranged in a stacked configuration. The one or more first coaxial resonators and second coaxial resonators electrically connected to the printed circuit board.

Abstract: A piezoelectric material comprises AlN doped with cations of one or more elements selected from the group consisting of: one of Sb, Ta, Nb, or Ge; Cr in combination with one or more of B, Sc, Y, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, or Yb; one of Nb and Ta in combination with one of Li, Mg, Ca, Ni, Co, and Zn; Ca in combination with one of Si, Ge, Ti, Zr, and Hf; Mg in combination with one of Si, Ge, and Ti; and one or more of Co, Sb, Ta, Nb, Si, or Ge in combination with one or more of Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, or Yb. The cations at least partially substitute for Al in the crystal structure of the piezoelectric material.

Abstract: Disclosed are methods for biasing amplifiers and for manufacturing bias circuits bias for biasing amplifiers. A power amplifier bias circuit can include an emitter follower device and an emitter follower mirror device coupled to form a mirror configuration. The emitter follower device can be configured to provide a bias signal for a power amplifier at an output port. The power amplifier bias circuit can include a reference device configured to mirror an amplifying transistor of an amplifying device of the power amplifier. The emitter follower mirror device can be configured to provide a mirror bias signal to the reference device. A node between the emitter follower device and the emitter follower mirror device can have a voltage of approximately twice a base-emitter voltage (2Vbe) of the amplifying transistor.

Abstract: An acoustic wave device includes a piezoelectric substrate, interdigital transducer electrodes including a predetermined number of electrode fingers disposed on an upper surface of the substrate, and a dielectric material layer having a first portion and a second portion. The first portion is disposed on the upper surface of the substrate and between the interdigital transducer electrode fingers. The second portion is disposed above the interdigital transducer electrode fingers. The acoustic wave device further includes at least one thermally conductive bridge disposed within the dielectric material layer and contacting upper surfaces of at least two adjacent interdigital transducer electrode fingers to dissipate heat therefrom.

Abstract: Disclosed are embodiments of tungsten bronze crystal structures that can have both a high dielectric constant and low temperature coefficient, making them advantageous for applications that experience temperature changes and gradients. In particular, tantalum can be substituted into the crystal structure to improve properties. Embodiments of the material can be useful for radiofrequency applications such as resonators and antennas.

Abstract: Systems and methods related to power amplification and power supply control. A method of operating a power amplification control system can include receiving, by an interface, a transceiver control signal from a transceiver. The method can further include generating, by a power amplifier control component, a power amplifier control signal based on the transceiver control signal from the transceiver. The method can also include generating, by a power supply control component, a power supply control signal based on one or more of the transceiver control signal from the transceiver or a local control signal from the power amplifier control component.

Abstract: Disclosed are embodiments of synthetic garnet materials for use in radiofrequency applications. In some embodiments, increased amounts of bismuth can be added into specific sites in the crystal structure of the synthetic garnet in order to boost certain properties, such as the dielectric constant and magnetization. Accordingly, embodiments of the disclosed materials can be used in high frequency applications, such as in base station antennas.

Abstract: Systems and methods for integrating injection-locked oscillators into transceiver arrays are disclosed. In one aspect, there is provided an injection-locked oscillator (ILO) distribution system including a master clock generator configured to generate a master clock signal. The ILO distribution system also includes an ILO distribution circuit including an ILO and configured to receive the master clock signal. The ILO is configured to generate a reference clock signal based on the master clock signal. The ILO distribution circuit is further configured to generate an output signal indicative of an operating frequency of the ILO. The ILO distribution system further includes an injection-locked detector (ILD) configured to receive the master clock signal and the output signal. The ILD is further configured to determine whether the ILO is in a locked state or in an unlocked state based on the master clock signal and the output signal.

Abstract: Systems and methods for integrating injection-locked oscillators into transceiver arrays are disclosed. In one aspect, there is provided an injection-locked oscillator (ILO) distribution system including a master clock generator configured to generate a master clock signal. The ILO distribution system also includes an ILO distribution circuit including an ILO and configured to receive the master clock signal. The ILO is configured to generate a reference clock signal based on the master clock signal. The ILO distribution circuit is further configured to generate an output signal indicative of an operating frequency of the ILO. The ILO distribution system further includes an injection-locked detector (ILD) configured to receive the master clock signal and the output signal. The ILD is further configured to determine whether the ILO is in a locked state or in an unlocked state based on the master clock signal and the output signal.

Abstract: A power amplifier layout can include multiple cascoded devices each having a radio-frequency transistor coupled to a cascode transistor. An orientation of a radio-frequency transistor of a first cascoded device relative to a cascode transistor of the first cascoded device can be configured to be different than an orientation of a radio-frequency transistor of a second cascoded device relative to a cascode transistor of the second cascoded device.

Abstract: A Radio Frequency (RF) circuit including a receive path, a transmit path, a switching circuit, and an output configured to receive RF signals from an antenna in a receive mode of operation, and to provide RF signals to the antenna in a transmit mode of operation. The receive path is configured to be coupled between a low-noise amplifier and the output. The switching circuit is located in the receive path and is configured, in the receive mode, to selectively couple the low-noise amplifier to the output and to pass the received RF signals from the output to the low-noise amplifier. The transmit path is configured to be coupled between a power amplifier and the output, to provide, in the transmit mode, signals from the power amplifier to the output, bypassing the switching circuit, and to have, in receive mode of operation, an off-state impedance of at least 200+j*13 Ohm.

Abstract: Radio-frequency front-end systems and devices. In some embodiments, a front-end system can include a first mid-band amplifier system configured to amplify transmit and receive signals in a first mid-band. The front-end system can further include a second mid-band amplifier system configured to amplify at least a transmit signal in a second mid-band, such that the front-end system is capable of simultaneous uplink operations in the first mid-band and the second mid-band.