Abstract: An electronic system is configured to generate a sequential logic signal. The electronic system includes a first ring oscillator including a first plurality of cascaded inverter stages. A combinational logic circuit is configured to generate the sequential logic signal by combining signals at the output terminals of at least two of the inverter stages of the first ring oscillator. The electronic system further includes a second ring oscillator including a second plurality of cascaded inverter stages. A bias current source is configured to supply the inverter stages of the second ring oscillator with a bias current, and a first voltage is generated at the inverter stages of the second ring oscillator. A voltage follower is configured to supply the inverter stages of the first ring oscillator with a second voltage corresponding to the first voltage generated at the inverter stages of the second ring oscillator.

Abstract: In an embodiment, a voltage multiplier comprises an input node, an output node, and first and second control nodes for receiving first and second clock signals defining two commutation states. An ordered sequence of intermediate nodes is coupled between the input and output nodes and includes two ordered sub-sequences. Capacitors are coupled: between each odd intermediate node in the first sub-sequence and the first control node; between each even intermediate node in the first sub-sequence and the second control node; between each odd intermediate node in the second sub-sequence and a corresponding odd intermediate node in the first sub-sequence; and between each even intermediate node in the second sub-sequence and a corresponding even intermediate node in the first sub-sequence. The circuit comprises selectively conductive electronic components coupled to the intermediate nodes.

Abstract: A controller for an electronic circuit that includes a first and a second switch is provided. The controller includes an event detector stage that receives logic electrical signals and a pulse generator circuit, which is coupled to the event detector stage and generates a dead time signal based on edges of the logic electrical signals detected by the event detector stage. The dead time signal includes pulses delimited by an edge of a first type and by a subsequent edge of a second type. A combinatorial sampling circuit generates a first and a second sampled preliminary signal. An update stage updates the values of the first and the second control signals at each pulse of the dead time signal based on the first and the second sampled preliminary signals, subsequently to the edge of the first type or the second type of the pulse of the dead time signal.

Abstract: A circuit includes a clock input node, a first signal input node configured to receive a first modulated signal switching between a first DC voltage and a second DC voltage, a bias circuit, a first output node, a first capacitor, a second capacitor, and switching circuitry coupled to the first capacitor and the second capacitor. Control circuitry is configured to initially set the switching circuitry in a first configuration in response to the first modulated signal having the second DC voltage, thereby charging the first capacitor to the second DC voltage and charging the second capacitor to the first DC voltage, and subsequently set the switching circuitry in a second configuration in response to an edge detected in the clock signal, thereby producing the first threshold voltage at the first output node after charge redistribution taking place between the first and second capacitors.

Abstract: In an embodiment a One-Time Programmable (OTP) memory controller includes a data register, a given number K of shadow-registers, wherein the number K is smaller than a given number N of memory slots of an OTP memory area, a communication interface configured to receive a read request requesting the data of a given memory slot and a control circuit configured to receive a preload start signal and a shadow-register preload enable signal, wherein the control circuit is configured to manage a preload phase and a data-read phase.

Abstract: One or more semiconductor dice are arranged on a substrate. The semiconductor die or dice have a first surface adjacent the substrate and a second surface facing away from the substrate. Laser-induced forward transfer (LIFT) processing is applied to the semiconductor die or dice to form fiducial markers on the second surface of the semiconductor die or dice. Laser direct structuring (LDS) material is molded onto the substrate. The fiducial markers on the second surface of the semiconductor die or dice are optically detectable at the surface of the LDS material. Laser beam processing is applied to the molded LDS material at spatial positions located as a function of the optically detected fiducial markers to provide electrically conductive formations for the semiconductor die or dice.

Abstract: In accordance with an embodiment a method includes: receiving a slow down command to slow down a speed of a voice coil motor (VCM) in a hard disk drive; in response to receiving the slow down command, operating the VCM in a discontinuous mode by switching on and off a current through the VCM with a duty-cycle, wherein operating the VCM in the discontinuous mode reduces the speed of the VCM; sensing the speed of the VCM while operating the VCM in the discontinuous mode; and varying the duty-cycle of the switching on and off the current through the VCM as a function of the sensed speed of the VCM operated in the discontinuous mode, wherein varying the duty-cycle comprises reducing the duty-cycle in response to a reduction of the sensed VCM speed.

Abstract: A voltage conversion system provides gain and offset trimming for generating a controlled output voltage. The system includes a digital-to-analog converter (DAC) that generates a reference voltage based on an input code, and a voltage converter that converts an input voltage to an output voltage based on the reference voltage. A first adjustable reference circuit provides a first reference signal to the DAC and a second adjustable reference circuit provides a second reference signal to the DAC. Control circuitry adjusts the first adjustable reference circuit to perform gain trimming of the output voltage and adjusts the second adjustable reference circuit to perform offset trimming of the output voltage. A calibration procedure includes adjusting for both gain and offset, with a two-step approach for positive offset conditions—first incrementing the input code to create a negative offset, then performing offset trimming.

Abstract: An electronic device includes a semiconductor body of silicon carbide, and a body region at a first surface of the semiconductor body. A source region is disposed in the body region. A drain region is disposed at a second surface of the semiconductor body. A doped region extends seamlessly at the entire first surface of the semiconductor body and includes one or more first sub-regions having a first doping concentration and one or more second sub-regions having a second doping concentration lower than the first doping concentration. Thus, the device has zones alternated to each other having different conduction threshold voltage and different saturation current.

Abstract: A control module is used to control a switching buck-boost converter that includes an inductor, a capacitor, a first top switch and a second top switch, a first bottom switch and a second bottom switch and a diode coupled to the second top switch. The control module controls the switching buck-boost converter so as to alternate: first time periods, in which the second top switch is open and cycles of charge and discharge of the inductor are carried out, during which the inductor is traversed by a current that also passes through the diode and charges the capacitor; and second time periods, in which the first and second top switches are open and the first and second bottom switches are closed so that the current in the inductor recirculates, and the capacitor is discharged by a current that flows in the load.

Abstract: In accordance with an embodiment, a circuit is configured to vary an intensity of a drive current of a resistive heater element based on the digital control signal. The circuit includes and output circuit configured to control a respective slew rate and an electric energy dissipated in the resistive heater element independently of a resistance value of the resistive heater element.

Abstract: A process for manufacturing a vertical conduction MOSFET device including a body of silicon carbide having a first conductivity type and a face. A metallization region extends on the face of the body. A body region of a second conductivity type extends in the body, from the face of the body, along a first direction parallel to the face and along a second direction transverse to the face. A source region of the first conductivity type extends towards the inside of the body region, from the face of the body, and has a first portion and a second portion. The first portion has a first doping level and extends in direct electrical contact with the metallization region. The second portion has a second doping level and extends in direct electrical contact with the first portion of the source region. The second doping level is lower than the first doping level.

Abstract: In a multi-level hybrid DC-DC converter with a flying capacitor, a feedback circuit includes a first oscillator and produces a first clock signal with a frequency dependent on an output voltage. A second oscillator produces a second clock signal having a frequency dependent on a reference voltage. A logic circuit switches, as a function of the first and second clock signals, connection of the flying capacitor between one state where the flying capacitor is connected between an input node and a switching node, and another state where the capacitor is connected between the switching node and a ground node. The duty cycle of the first/second clock signal varies so that when the flying capacitor voltage is lower than a target voltage a duration of the one state is increased, and when the flying capacitor voltage is higher than the target voltage a duration of the another state is increased.

Abstract: A device for monitoring the health state is made in a chip including a semiconductor die integrating an electric potential sensor and a cardiac parameter determination unit. The potential sensor is configured to detect potential variations on the body of a living being and associated with a heart rhythm and to generate a cardiac signal. The cardiac parameter determination unit is configured to receive the cardiac signal and determine cardiac parameters indicative of a health state. In particular, the cardiac parameter determination unit is configured to detect triggering events and to determine features of the cardiac signal in time windows defined by the triggering events. The die also integrates a decision unit, configured to receive the cardiac parameters and generate a health signal based on a comparison with threshold values. The cardiac parameters include heart rate and QRS-complex.

Abstract: An inertial structure is elastically coupled through a first elastic structure to a supporting structure so as to move along a sensing axis as a function of a quantity to be detected. The inertial structure includes first and second inertial masses which are elastically coupled together by a second elastic structure to enable movement of the second inertial mass along the sensing axis. The first elastic structure has a lower elastic constant than the second elastic structure so that, in presence of the quantity to be detected, the inertial structure moves in a sensing direction until the first inertial mass stops against a stop structure and the second elastic mass can move further in the sensing direction. Once the quantity to be detected ends, the second inertial mass moves in a direction opposite to the sensing direction and detaches the first inertial mass from the stop structure.

Abstract: A wireless device includes an energy harvester and an energy storage that operate in a sequence of energy harvesting cycles to alternately harvest energy and release energy for supplying the wireless device. The wireless device also includes a processing circuit and a wireless communication circuit. A configuration method for the wireless device includes first step where a base station receives a signal from the wireless device indicating wireless communication circuit entry into a receiving operation mode. In a second step, the base station transmits configuration data to the wireless device. The received configuration data is temporarily stored in a memory area of the wireless communication circuit. In a third step, the temporarily stored configuration data is transmitted from the wireless communication circuit to the processing circuit for storage in a memory area. The second and third steps are carried out during distinct energy harvesting cycles of the wireless device.

Abstract: A substrate includes electrically-conductive tracks. A semiconductor chip is arranged on the substrate and electrically coupled to selected ones of the electrically-conductive tracks. Containment structures are provided at selected locations on the electrically-conductive tracks, where the containment structures have respective perimeter walls defining respective cavities. Each cavity is configured to accommodate a base portion of a pin holder. These pin holders are soldered to the electrically-conductive tracks within the cavities defined by the containment structures. Each containment structure may be formed by a ring of resist material configured to receive solder and maintain the pin holders in a desired alignment position.

Abstract: A DC-DC boost converter includes an inductor coupled between an input voltage and an input node, a first path coupled between the input node and a first output node at which a first output voltage is generated, and a second path coupled between the input node and a second output node at which a second output voltage is generated. The DC-DC boost converter operates in a first operating phase where the first path boosts the first output voltage and where the second path is kept from boosting the second output voltage by the second path being coupled to the first path, and operates in a second operating phase where the second path boosts the second output voltage and where the first path is kept from boosting the first output voltage by the second path not being coupled to the first path.

Abstract: A first input node receives a first input signal and a second input node receives a second input signal. The first and second input signals are in phase quadrature. An edge detector circuit senses the first input signal and produces a pulsed signal indicative of edges detected in the first input signal. A pulse skip and reset circuit senses the pulsed signal and the second input signal, and produces a reset signal indicative of pulses detected in the pulsed signal while the second input signal is de-asserted. A sampling circuit senses the second input signal and the reset signal, and produces an output signal that is deasserted in response to assertion of the second input signal and is asserted in response to a pulse being detected in the reset signal.

Abstract: A device includes a leadframe with a semiconductor die having a first side facing and electrically coupled to the leadframe and a second side facing away from the leadframe. An encapsulation body containing laser direct structuring (LDS) material covers the semiconductor die and has an outer surface opposite the leadframe. Metal vias are formed through the LDS material between the outer surface and the second side of the semiconductor die, and a metal pad is formed at the outer surface. The metal vias and pad create a thermal dissipation path. The semiconductor die may be mounted in a flip-chip configuration and connected to the leadframe through metal pillars. The metal vias and pad may be formed by laser-activating the LDS material followed by copper plating. The device can be configured as a Quad Flat No-leads (QFN) package, and a heat sink may be mounted on the metal pad.