Patents Assigned to STMicroelectronics S.r.l.
  • Patent number: 11019485
    Abstract: A method for sharing a same profile on different integrated circuit cards includes performing a profile enable procedure for a first profile on a first mobile device; performing a mobile device authentication procedure between the first mobile device and the mobile network; and performing by the mobile network, a location update operation using identifier information including subscriber information.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: May 25, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventor: Francesco Caserta
  • Patent number: 11018601
    Abstract: A half-bridge driver circuit includes an amplifier configured to generate a measurement signal indicative of a current flowing through a shunt resistor. A processing circuit is configured to selectively acquire a sample of the measurement signal in response to a trigger signal. A synchronization circuit is configured to determine a first value indicative of the switch-on duration of a high side control signal, determine a second value indicative of the switching period of the high side control signal, compute a third value based on the first and second values, generate a third signal based on the third value when the next switching period of the high side control signal starts, start a second counter in response to the third signal, compare the count value of the second counter with a reference value to generate a fourth signal, and generate the trigger signal as a function of the fourth signal.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: May 25, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventor: Giuseppe D'Angelo
  • Patent number: 11009412
    Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: May 18, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Mohammad Abbasi Gavarti, Daniele Caltabiano, Andrea Picco, Anna Angela Pomarico, Giuditta Roselli, Francesco Braghin
  • Patent number: 11011476
    Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: May 18, 2021
    Assignees: STMICROELECTRONICS INTERNATIONAL N.V., STMICROELECTRONICS S.R.L.
    Inventors: Paolo Crema, J├╝rgen Barthelmes, Din-Ghee Neoh
  • Publication number: 20210143286
    Abstract: A semiconductor body includes a front side and a back side and is configured to support an electronic circuit. A buried region is provided in the semiconductor body at a location between the electronic circuit and the back side. The buried region includes a layer of conductive material and a dielectric layer, where the dielectric layer is arranged between the layer of conductive material and the semiconductor body. A conductive path extends between the buried region and the front side to form a path for electrical access to the layer of conductive material. A capacitor is thus formed with the layer of conductive material providing a capacitor plate and the dielectric layer providing the capacitor dielectric. A further capacitor plate is provided by the semiconductor body, or by a further layer of conductive material in the buried region.
    Type: Application
    Filed: January 20, 2021
    Publication date: May 13, 2021
    Applicant: STMicroelectronics S.r.l.
    Inventors: Flavio Francesco VILLA, Marco MORELLI, Marco MARCHESI, Simone Dario MARIANI, Fabrizio Fausto Renzo TOIA
  • Patent number: 11002543
    Abstract: A MEMS gyroscope can include a supporting structure and a mobile mass elastically suspended from the supporting structure in a driving direction and in a sensing direction, mutually perpendicular. A driving structure is coupled to the mobile mass for controlling a driving movement of the mobile mass in the driving direction at a driving frequency. A driving-frequency tuning electrode, distinct from the driving structure, faces the mobile mass. A driving-frequency tuner electrically coupled to the driving-frequency tuning electrode for supplying a tuning voltage to the driving-frequency tuning electrode.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: May 11, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventor: Daniele Prati
  • Patent number: 11003973
    Abstract: A Near Field Communication (NFC) device, includes: a device support body comprising at least one antenna coil, an integrated circuit coupled to the at least one antenna coil; and a photoresistive circuit coupled to the at least one antenna coil and comprising a photo-resistance, the photoresistive circuit being configured to increase a resistance of the at least one antenna coil when the at least one photo-resistance is in its high resistance state in a dark condition.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: May 11, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Antonio Sismundo, Giuliano Filpi, Antonio Amoroso, Raffaele Caiazzo
  • Patent number: 11001061
    Abstract: Methods for manufacturing a microfluidic delivery device comprising a semiconductor structure, such as silicon, are provided. In particular, the structure for delivering fluid may be formed from polycrystalline silicon, also called polysilicon, or epitaxial silicon. The microfluidic delivery device that predominantly uses semiconductor material, such as silicon, to form the structures that are in contact with the dispensed fluid results in a device that is compatible with a wide set of fluids and applications.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: May 11, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Dino Faralli, Laura Maria Castoldi, Paolo Ferrari, Marta Carminati
  • Patent number: 11004775
    Abstract: One or more embodiments are directed to quad flat no-lead (QFN) semiconductor packages, devices, and methods in which one or more electrical components are positioned between a die pad of a QFN leadframe and a semiconductor die. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and at least one electrical component that has a first contact on the die pad and a second contact on the lead. A semiconductor die is positioned on the at least one electrical component and is spaced apart from the die pad by the at least one electrical component. The device further includes at least one conductive wire, or wire bond, that electrically couples the at least one lead to the semiconductor die.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: May 11, 2021
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Cristina Somma, Fulvio Vittorio Fontana
  • Patent number: 11001496
    Abstract: A microelectromechanical system (MEMS) sensor testing device, system and method are provided. The testing device includes a socket having a plurality of pads configured to receive a respective plurality of pins of the MEMS sensor, a body having a plurality of operable positions associated with a respective plurality of orientations of the MEMS sensor and circuitry which performs a method for testing the MEMS sensor in the plurality of operable positions. The method includes, for each position of the plurality of operable positions, outputting an indication of the position to the plurality of operable positions, receiving one or more measurements made by the MEMS sensor at the respective position and determining whether the one or more measurements satisfy a reliability criterion. The method includes generating a report based on the plurality of measurements and indicating whether the plurality of measurements satisfy a plurality of reliability criteria, respectively.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: May 11, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Federico Iaccarino, Andrea Labombarda, Fabio Tota, Stefano Bosco
  • Patent number: 11005397
    Abstract: A method for detecting the angular position of an electric motor includes: applying a first drive signal with a first polarity between first and second drive terminals that are coupled to respective stator windings of the electric motor; sensing at a third drive terminal a first signal resulting from the application of the first drive signal; applying a second drive signal with a second polarity between the first and second drive terminals, the second polarity being opposite the first polarity; sensing at the third drive terminal a second signal resulting from the application of the second drive signal; and producing a sum signal by summing the first and second signals, wherein the sum signal is indicative of an angular position of a rotor of the electric motor with respect to the stator windings.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: May 11, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventor: Michele Boscolo Berto
  • Patent number: 11005361
    Abstract: A control circuit is configured to control a power factor correction (PFC) pre-regulator including a power switch and being configured to operate in a transition mode of operation and a valley-skipping mode of operation. The control circuit generates a drive signal to control a switching of the power switch based on a current threshold. A current threshold generator in the control circuit is configured to modulate the current threshold as a function of a number of valleys skipped in the valley-skipping mode of operation.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: May 11, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventors: Giuseppe Scappatura, Alberto Bianco, Francesco Ciappa
  • Publication number: 20210135661
    Abstract: An H-bridge circuit includes a supply voltage node, a first pair of transistors and a second pair of transistors. First transistors in each pair have the current paths therethrough included in current flow lines between the supply node and, respectively, a first output node and a second output node. Second transistors in each pair have the current paths therethrough coupled to a third output node and a fourth output node, respectively. The first and third output nodes are mutually isolated from each other and the second and fourth output nodes are mutually isolated from each other. The H-bridge circuit is operable in a selected one of a first, second and third mode.
    Type: Application
    Filed: January 11, 2021
    Publication date: May 6, 2021
    Applicants: STMicroelectronics S.r.l., STMicroelectronics (Alps) SAS
    Inventors: Giovanni Luca TORRISI, Domenico aka Massimo PORTO, Christophe ROUSSEL
  • Patent number: 10996341
    Abstract: A Pseudo-Random Noise code generator module is configured to generate PRN codes operating with different navigation standards for use with a GNSS receiver. The generator includes a number of linear shift registers including a respective number of feedback taps and a channel selection network including an output multiplexer. A first register includes a first number of taps and a second register includes a second number of taps. The first register and second register are associated with a respective feedback network to combine signals at the feedback taps to obtain a feedback signal that is selectably fed back through a selection circuit at an input of the respective register. A network can selectably concatenate the first register with the second register.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: May 4, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventor: Gennaro Musella
  • Patent number: 10998811
    Abstract: An electronic converter includes first and second inputs, first and second outputs, and a switching cell configured to supply current. The switching cell includes a half-bridge including first and second switches connected in series between the two inputs. The half-bridge includes a intermediate point between the first and second switch, a first inductor directly connected to the first output, a second inductor connected to the intermediate point, a first capacitor connected in series with the first and second inductors, a second capacitor connected between the intermediate point and the second input, and a circuit connected between a terminal of the first inductor and the second output. A circuit path of the converter is configured to couple the second inductor with the first output through the first capacitor and the first inductor, and another circuit path is configured to couple the second capacitor with the first output through the first inductor.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: May 4, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventor: Osvaldo Enrico Zambetti
  • Patent number: 10991654
    Abstract: A pad forms a connection terminal suitable for coupling circuit elements integrated in a chip to circuits outside the chip itself. At least one inductor is provided for use in the reception/transmission of electromagnetic waves or for supplying the chip with power or both. The connection pad and inductor are combined in a structure which reduces overall occupied area. A magnetic containment structure surrounds the structure to contain a magnetic field of the inductor.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: April 27, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 10987007
    Abstract: A method of processing electrophysiological signals includes: receiving, over a limited time duration, sample electrocardiography (ECG) signals indicative of heart pulsatile activity occurring with a variable heart rate, wherein receiving the sample ECG signals is discontinued at an expiry of the limited time duration; receiving photoplethysmography (PPG) signals indicative of the heart pulsatile activity; determining a correlation between the sample ECG signals and the PPG signals; determining reconstructed ECG signals from the PPG signals as a function of the correlation between the sample ECG signals and the PPG signals; and estimating a heart rate variability of the variable heart rate as a function of the reconstructed ECG signals.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: April 27, 2021
    Assignee: STMicroelectronics S.R.L.
    Inventors: Francesco Rundo, Sabrina Conoci, Piero Fallica
  • Patent number: 10987039
    Abstract: A microneedle array device includes a substrate and an array of microneedles on the substrate. Each microneedle includes a redox enzyme and redox mediator and an electrically conductive layer on the substrate. The electrically conductive layer may extend partway up each microneedle exposing the tip thereof.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: April 27, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Vincenza Di Palma, Maria Fortuna Bevilacqua, Andrea Di Matteo, Principia Dardano
  • Patent number: 10982785
    Abstract: A circuit for controlling current in an inductive load is provided. The circuit includes a driver circuit for driving a load current in the inductive load. The driver circuit includes a switch, which is switched on to increase the load current and a recirculation diode, which re-circulates the load current when the switch is off. The circuit includes a control module that generates a control signal to switch on and off the switch. The control module includes a PWM current controller comprising a negative feedback closed loop implementing at least a proportional control and an integral control. The PWM current controller receives a target current value and an estimated current flowing in the load during a measurement PWM cycle. The PWM current controller generates the control signal for a control input of the switch based on an error between the target current and the estimated current.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: April 20, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventor: Sergio Lecce
  • Patent number: 10985269
    Abstract: Embodiments are directed to two-dimensional electron gas (2DEG)-confined 2DEG devices and methods. One such device includes a substrate and a heterostructure on the substrate. The heterostructure includes a first semiconductor layer, a second semiconductor layer, and a 2DEG layer between the first and second semiconductor layers. The device further includes a 2DEG device having a conduction channel in the 2DEG layer. An isolation electrode overlies the heterostructure and at least partially surrounds a periphery of the 2DEG device. The isolation electrode, in use, interrupts the 2DEG layer in response to an applied voltage.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: April 20, 2021
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Alessandro Paolo Bramanti, Alberto Pagani