Abstract: A half bridge switching power stage includes high/low side switches driven in response to a cycle-by-cycle protected driving signal derived from a PWM signal. Signals indicative of detected over-currents at said high/low side switches are processed to output the cycle-by-cycle protected driving signal, when the signal indicative of the detected over-current indicates, during a time interval within which the high/low side switch is turned on, that current flowing in the turned on high/low side switch crosses a given threshold, as an inverted PWM signal by turning off the turned on high/low side switch, and otherwise outputting said cycle-by-cycle protected driving signal as a not inverted PWM signal. An anomaly detection circuit receives the signals indicative of the over-current and switches off both the high/low side switches when an anomaly is detected in a pattern of over-current events in the signals indicative of the over-current.

Abstract: The present disclosure relates to solutions for operating a flyback converter comprising an active clamp. The flyback converter comprises two input terminals and two output terminals. A first electronic switch and the primary winding of a transformer are connected in series between the input terminals. An active clamp circuit is connected in parallel with the primary winding. The active clamp circuit comprises a series connection of a clamp capacitor and a second electronic switch. A third electronic switch and the secondary winding of the transformer are connected in series between the two output terminals. In particular, the present disclosure relates to solutions for switching the first, second and third electronic switch in order to achieve a zero-voltage switching of the first electronic switch.

Abstract: A switching regulator circuit has a switching transistor actuated during a switching on phase of a duty cycle. The current flowing through an inductor of the switching regulator circuit is determined from sensing a transistor current flowing through the switching transistor during switching on phase and selectively charging a capacitor of a switched capacitor circuit dependent on a current sense signal during the switching on phase.

Abstract: Disclosed herein is a method for manufacturing a semiconductor product package. The method includes arranging a leadframe with one or more leads such that each lead has an inner end facing a portion of a die-pad, attaching a semiconductor chip to the die-pad, attaching a first electrically conductive mass to the die-pad such that it is aligned with the inner end of a lead protruding over the die-pad, attaching an electrical component to the first electrically conductive mass such that a longitudinal axis of the electrical component is arranged traverse to the die-pad, and coupling a second electrically conductive mass between a termination of the electrical component and the inner end of the lead.

Abstract: A DC-DC boost converter includes an input receiving an input voltage and an output producing an output voltage. A switching stage is formed by a low-side transistor arranged between a switching node and a ground node, and a high-side transistor arranged between the switching node and the output. The high-side transistor includes a body diode having an anode coupled to the switching node and a cathode coupled to the output. The converter is controlled in an asynchronous operation mode where the low-side transistor is driven alternately to a conductive state and a non-conductive state, and the high-side transistor is driven steadily to a non-conductive state. A variable load circuit is selectively coupled between the two output terminals when the converter is in the asynchronous operation mode in order to sink a load current having a value that is a function of a value of the input voltage.

Abstract: A system for detecting a presence in an environment to be monitored includes an electrostatic charge variation sensor, a vibration sensor, and an environmental pressure sensor. A processing unit is configured to acquire, from the electrostatic charge variation sensor, an electrostatic charge variation signal, and detect in the electrostatic charge variation signal, first signal characteristics indicative of the presence of a subject in the environment to be monitored. The processing unit further validates the detection of presence of the subject using the vibration and pressure signals provided by the other sensors.

Abstract: A first RF-to-DC circuit receives a radiofrequency signal and produces a first converted signal delivered to an energy storage circuit. A second RF-to-DC circuit, which is a down-scaled replica of the first RF-to-DC circuit, produces a second converted signal from the radiofrequency signal that is indicative of an open-circuit voltage of the first RF-to-DC circuit. The first RF-to-DC section includes N sub-stages, with a sub-set of sub-stages being selectively activatable. A window comparison of the second converted signal generates a first signal and a second signal indicative of whether the second converted signal is within a range of values proportional to a voltage reference signal. The sub-set of sub-stages is selectively deactivated, respectively activated, when the performed window comparison has a first result, respectively, a second result.

Abstract: A voltage supply circuit and a method for controlling a voltage supply circuit are provided. The voltage supply circuit includes a positive charge pump stage that generates a positive voltage and a negative charge pump stage that generates a negative voltage. The voltage supply circuit also includes a control stage that compares a voltage representative of the negative voltage with a reference voltage and causes a slope of the positive voltage to decrease when the voltage representative of the negative voltage exceeds the reference voltage.

Abstract: A signal processing circuit includes a filter generating a quantizer input signal from a noise shaping input signal and a quantizer output signal. A quantizer divides the quantizer input signal by a scaling factor to produce a noise shaping output signal and multiplies the noise shaping output signal by the scaling factor to produce the quantizer output signal. Receiver circuitry scales the quantizer output signal by a second scaling factor. A dynamic range optimization circuit compares a current value of the noise shaping input signal to a threshold value, lowers or raises the scaling factor in response to the comparison, and proportionally lowers or raises the scaling factor such that a ratio between the scaling factor and second scaling factor remains substantially constant.

Abstract: An audio device includes a gain step selection circuit that receives a different requested gain value and an associated requested step size from each of a plurality of sources, compares each requested gain value to a same feedback gain value and generates a polarity based thereupon, performs step polarization on each requested step size as a function of the generated polarity therefor to thereby generate a plurality of step values, and outputs a least of the plurality of step values as an output step value. An accumulator circuit generates a current input gain value based upon the output step value and the feedback gain value, and then updates the feedback gain value to be equal to the current input gain value. A normalizing circuit multiplies an input data value by the current input gain value and applies a truncation function to a result thereof to produce an output data value.

Abstract: A method of driving an electrical load includes coupling a power supply source to a power supply pin of a driver circuit, and coupling an electrical load to at least one output pin of the driver circuit. A driver sub-circuit of the driver circuit produces at least one driving signal for driving the electrical load. The at least one driving signal is provided to the electrical load via the at least one output pin. The at least one driving signal is modulated to supply the electrical load with a load current and to subsequently interrupt the load current. A compensation current pulse is sunk from the power supply pin, at a compensation circuit of the driver circuit, in response to the load current being interrupted.

Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.

Abstract: An integrated circuit includes a semiconductor substrate, electronic components integrated in the semiconductor substrate, an electric connection structure overlying the semiconductor substrate, and an conductive region, with elongated shaped, having a first and a second end. The conductive region is formed in the electric connection structure, extends over an entire length of the substrate and is not directly electrically connected to the electronic components. A first and a second synchronization connection element are electrically coupled to the first end and to the second end, respectively, of the conductive region and have each a respective synchronization connection portion facing the coupling face.

Abstract: In an embodiment, an electronic circuit includes: an input differential pair including first and second transistors; a first pair of transistors in emitter-follower configuration including third and fourth transistors, and an output differential pair including fifth and sixth transistors. The third transistor has a control terminal coupled to the first transistor, and a current path coupled to a first output terminal. The fourth transistor has a control terminal coupled to the second transistor, and a current path coupled to a second output terminal. The fifth transistor has a control terminal coupled to the first transistor, and a first current path terminal coupled to the first output terminal. The sixth transistor has a control terminal coupled to the second transistor, and a first current path terminal coupled to the second output terminal. First and second termination resistors are coupled between the first pair of transistors and the output differential pair.

Abstract: A semiconductor device comprises at least one semiconductor die electrically coupled to a set of electrically conductive leads, and package molding material molded over the at least one semiconductor die and the electrically conductive leads. At least a portion of the electrically conductive leads is exposed at a rear surface of the package molding material to provide electrically conductive pads. The electrically conductive pads comprise enlarged end portions extending at least partially over the package molding material and configured for coupling to a printed circuit board.

Abstract: A microelectromechanical device has a first tiltable mirror structure extending in a horizontal plane defined by first and second horizontal axes and includes a fixed structure defining a frame delimiting a cavity, a tiltable element carrying a reflecting region, elastically suspended above the cavity having first and second median axes of symmetry, elastically coupled to the frame by first and second coupling structures on opposite sides of the second horizontal axis. The first tiltable mirror structure has a driving structure coupled to the tiltable element to cause rotation around the first horizontal axis. The first tiltable mirror structure is asymmetrical with respect to the second horizontal axis and has, along the first horizontal axis, a first extension on a first side of the second horizontal axis, and a second extension greater than the first extension, on a second side of the second horizontal axis opposite to the first side.

Abstract: An optoelectronic device includes a backlight panel illuminating a display panel. The backlight panel includes an array of light emitting pixels, with each light emitting pixel including at least one subpixel formed by one or more light emitting diodes positioned on a substrate. At least one photodetector is positioned on the substrate and arranged to detect an amount of reflected light emitted by said subpixel and reflected by the display panel.

Abstract: A method for manufacturing an electronic device based on SiC includes forming a structural layer of SiC on a front side of a substrate. The substrate has a back side that is opposite to the front side along a direction. Active regions of the electronic device are formed in the structure layer, and the active regions are configured to generate or conduct electric current during the use of the electronic device. A first electric terminal is formed on the structure layer, and an intermediate layer is formed at the back side of the substrate. The intermediate layer is heated by a LASER beam in order to generate local heating such as to favor the formation of an ohmic contact of Titanium compounds. A second electric terminal of the electronic device is formed on the intermediate layer.

Abstract: A switching circuit includes first and second half bridges supplying an electrical load via filter networks. During alternate switching sequences a first transistor pair (high-side in one half bridge and low-side in the other half bridge) is switched to a non-conductive state, and a second transistor pair (high-side in the other half bridge and low-side in the one half bridge) is switched to a conductive state. A current flow line is provided by an inductance, a first switch and a second switch between outputs of the half bridges. In a medium-high power mode, the first and second switches are in the conductive state between switching the first pair of transistors to the non-conductive state and the second pair of transistors to the conductive state. In a low or quiescent power mode, switching the first and second switches to the conductive state is refrained due to application of a longer delay.

Abstract: Described herein is a method including measuring a current in a wire, normalizing the measured current, and comparing the normalized measured current to a control curve. The control curve is a function of a series of normalized current magnitudes and reaction times for corresponding ones of that series of normalized current magnitudes. The method further includes limiting the current in the wire based upon the comparison. The reaction times for ones of the series of normalized current magnitudes are times at which current limitation would occur if the normalized current remained at an associated normalized current magnitude.