Abstract: A light projection system includes a MEMS mirror operating on a mirror drive signal to generate a mirror sense signal resulting from operation of the MEMS mirror based on the mirror drive signal. A mirror driver generates the mirror drive signal from a drive control signal. A controller receives the mirror sense signal from the MEMS mirror, obtains a first sample of the mirror sense signal at a first phase thereof, obtains a second sample of the mirror sense signal at a second phase thereof, wherein the first and second phases are separated by a half period of the mirror drive signal, with the second phase occurring after the first phase, and generates the drive control signal based on a difference between the first and second samples to keep the mirror drive signal separated in phase from the mirror sense signal by a desired amount of phase separation.

Abstract: A first device includes a rectangular substrate having a first width and a first length and a first pattern of electrical interface nodes at first, second and third sides with a first set of electrical interface nodes at the fourth side. A second device includes a second rectangular substrate having a second width equal to the first width, a second length and a median line extending in the direction of the second width. A second pattern of electrical interface nodes for the second device includes two unmorphed replicas of the first pattern arranged mutually rotated 180° on opposite sides of the median line as well as two second sets of electrical interface nodes formed by two smaller morphed replicas of the first set of electrical interface nodes arranged mutually rotated 180° on opposite sides of said median line.

Abstract: A microcontroller includes an input pin and internal pull-up and pull-down circuits. External pull-up and pull-down circuits are also coupled to the input pin. The microcontroller is operable according to different configuration modes which include configuring the input pin in a floating state. A control logic then configures the internal pull-up and pull-down circuits according to an internal pull-up mode to acquire a first input voltage signal (at a first logic value) from the input pin, and further configure the internal pull-up and pull-down circuits according to an internal pull-down mode to acquire a second input voltage signal (at a second logic value) from the input pin. A selection of the operating mode of the MCU is then made based on the acquired first and second logic values.

Abstract: In an embodiment, a method includes: receiving a main supply voltage; generating a first regulated output voltage with a DC-DC converter; providing the main supply voltage to a driver of a control terminal of an output transistor of an LDO; receiving, at an input terminal of the LDO, the first regulated output voltage; generating, at an output terminal of the LDO, a second regulated output voltage from the first regulated output voltage; and when the main supply voltage falls below a predetermined threshold, discharging a capacitor coupled to the input terminal of the LDO by activating a switch coupled to the input terminal of the LDO.

Abstract: In accordance with an embodiment, a method of managing an automotive infotainment media library, in which media content files sourced from a set of source devices, and the media content files are accessible via respective playback paths by at least one media player application having a plurality of configurations, includes: parsing the media content files in the media library to create at least one indexed table including a respective list of identifiers associated to media content files, wherein the media content files are parsed as a function of at least one of a source device in the set of source devices, as a function of a configuration in the plurality of configurations of the at least one media player application, or as a function of folders grouping the media content files in the media library.

Abstract: A non-emissive display includes a backlight controller sending a pulse during each sub-frame of a plurality of frames to row and column drivers that drive backlight zones. The row drivers count each pulse to keep a pulse count total, and reset the pulse count total when it is equal to a first number indicating how many row drivers are present. Each row driver activates its channels and waits for a next pulse if the pulse count total is not equal to the first number and if the pulse count total is equal to a second number indicating in which sub-frame that first driver is to be activated. Each row driver waits for a next pulse if the pulse count total is not equal to the first number and the second number. Each column driver activates its channel in response to receipt of each pulse.

Abstract: Display elements, each having anode and cathode terminals, are arranged into rows and columns. Each row has an anode-line coupled to the anode terminals for its display elements. Each column has a cathode-line coupled to the cathode terminals for its display elements. A switch for each anode-line selectively couples that anode-line to a storage capacitor, and a switch for each cathode-line selectively couples that cathode-line to the storage capacitor. A display driver activates the row driver for a given row and the column driver for a given column. A switch driver closes the switch for the cathode-line for the given column, then opens the switch for that cathode-line. The display driver deactivates the row driver for the given row, after closing the switch for the cathode-line for the given column. The switch driver closes the switch for the anode-line for the given row.

Abstract: A probe device includes an optical device including at least one of a photodetector or a first light source. A cover structure is included and is arranged in front of the optical device. The cover structure includes an electrode which contacts, in use, a body tissue.

Abstract: A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

Abstract: A supply node receives supply voltage and an output node provides a regulated output voltage to a load. A switching transistor is coupled between the supply and output nodes. The switching transistor is controlled by a drive signal generated by a control circuit to control switching activity. The control circuit includes circuitry to sense a feedback voltage indicative of the regulated output voltage and a comparator generating a comparison logic signal dependent on a comparison of the feedback voltage to a reference. A logic circuit generates a skip signal in response to the comparison logic signal. A counter generates a termination signal. Signal processing circuitry controls the switching activity by asserting the drive signal as a function of the skip signal and the termination signal.

Abstract: A system-on-chip includes a process-voltage-temperature (PVT) sensor with a filter circuit that initiates a patterned digital signal and propagates the patterned digital signal in a manner responsive to variations in semiconductor material, operating supply voltage and operating temperature of the system-on-chip. A digital comparison circuit compares the initiated patterned digital signal and the propagated patterned digital signal. A warning signal is generated in response to the comparison where there is a detection of discrepancy between the initiated patterned digital signal and the propagated patterned digital signal.

Abstract: An isolated driver device comprises a first semiconductor die and a second semiconductor die galvanically isolated from each other. The second semiconductor die includes a signal modulator circuit configured to modulate a carrier signal to produce a modulated signal encoding information. A galvanically isolated communication channel implemented in the first semiconductor die and the second semiconductor die is configured to transmit the modulated signal from the second semiconductor die to the first semiconductor die.

Abstract: A DC-DC boost converter includes an inductor coupled between an input voltage and an input node, a diode coupled between the input node and an output node, and an output capacitor coupled between the output node and ground such that an output voltage is formed across the output capacitor. A switch selectively couples the input node to ground in response to a drive signal. Control loop circuitry includes an error amplifier to generate an analog error voltage based upon a comparison of a feedback voltage to a reference voltage, the feedback voltage being indicative of the output voltage, a quantizer to quantize the analog error voltage to produce a digital error signal, and a drive voltage generation circuit to generate the drive signal as having a duty cycle based upon the digital error signal.

Abstract: A leadframe has a die pad area and an outer layer of a first metal having a first oxidation potential. The leadframe is placed in contact with a solution containing a second metal having a second oxidation potential, the second oxidation potential being more negative than the first oxidation potential. Radiation energy is then applied to the die pad area of the leadframe contacted with the solution to cause a local increase in temperature of the leadframe. As a result of the temperature increase, a layer of said second metal is selectively provided at the die pad area of the leadframe by a galvanic displacement reaction. An oxidation of the outer layer of the leadframe is then performed to provide an enhancing layer which counters device package delamination.

Abstract: An electro-acoustical transducer such as a Piezoelectric Micromachined Ultrasonic Transducers is coupled with an adjustable load circuit having a set of adjustable load parameters including resistance and inductance parameters. Starting from at least one resonance frequency or at least one ring-down parameter of the electro-acoustical transducer a set of model parameters is calculated for a Butterworth-Van Dyke (BVD) model of the electro-acoustical transducer. The BVD model includes an equivalent circuit network having a constant capacitance coupled to a RLC branch and the adjustable load circuit is coupled with the electro-acoustical transducer at an input port of the equivalent circuit network of the model of the electro-acoustical transducer. The adjustable load parameters are adjusted as a function of the set of model parameters calculated for the BVD model of the electro-acoustic transducer to increase the bandwidth or the sensitivity of the electro-acoustic transducer.

Abstract: A method of making a MEMS actuator with a monolithic body of semiconductor material includes forming a supporting portion of semiconductor material, orientable with respect to first and second rotation axes, the first rotation axis being transverse with respect to the second rotation axis, and forming a first frame of semiconductor material. The method further includes forming first deformable elements, of semiconductor material, coupled to the first frame, and configured to control a rotation of the supporting portion about the first rotation axis. The method also includes forming a second frame of semiconductor material, and forming second deformable elements, of semiconductor material, coupled to the first frame and to the second frame, and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements are formed to carry respective first and second piezoelectric actuation elements.

Abstract: A DC-DC boost converter includes an inductor coupled between an input voltage and an input node, a first path coupled between the input node and a first output node at which a first output voltage is generated, and a second path coupled between the input node and a second output node at which a second output voltage is generated. The DC-DC boost converter operates in a first operating phase where the first path boosts the first output voltage and where the second path is kept from boosting the second output voltage by the second path being coupled to the first path, and operates in a second operating phase where the second path boosts the second output voltage and where the first path is kept from boosting the first output voltage by the second path not being coupled to the first path.

Abstract: A voltage controlled oscillator (VCO) includes: a pair of inductors coupled in series; a first pair of varactors coupled in series, and a second pair of varactors coupled in series. A first common mode node is between the respective varactors of the first pair of varactors and a second common mode node is between the respective varactors of the second pair of varactors. A supply voltage node is switchably coupled to the first common mode node through a first switch, the supply voltage node being a node located between the pair of inductors. A control voltage node (VC) is switchably coupled to the second common mode node through a second switch.

Abstract: A MEMS based device includes a phononic crystal body formed from unit cells and having a defect line extending through the phononic crystal body. Unit cells inside of the defect line lack a same phononic bandgap as the unit cells outside of the defect line. An input MEMS resonator is mechanically coupled to a first end of the defect line, and an output MEMS resonator is mechanically coupled to a second end of the defect line. Each of the unit cells outside of the defect line has an identical geometry. The input MEMS resonator and output MEMS resonator each have a natural frequency within the same phononic bandgap possessed by the unit cells outside of the defect line. There may be more than one defect line, and in such cases, the MEMS device may include more than one input MEMS resonator and/or more than one output MEMS resonator.

Abstract: Disclosed herein is a tunable resonant circuit including an inductance directly electrically connected in series between first and second nodes, a variable capacitance directly electrically connected between the first and second nodes, and a set of switched capacitances coupled between the first and second nodes. The set of switched capacitances includes a plurality of capacitance units, each capacitance unit comprising a first capacitance for that capacitance unit directly electrically connected between the first node and a switch and a second capacitance for the capacitance unit directly electrically connected between the switch and the second node. Control circuitry is configured to receive an input control signal and connected to control the switches of the set of switched capacitances. A biasing circuit is directly electrically connected to the tunable resonance circuit at the first and second nodes.