Abstract: A support substrate has a mounting face with a metal heat transfer layer. Holes are provided to extend at least partially through the metal heat transfer layer. Metal heat transfer elements are disposed in the holes of the metal heat transfer layer of the support substrate. An electronic integrated circuit (IC) chip has a rear face that is fixed to the mounting face of the support substrate via a layer of adhesive material. The metal heat transfer elements disposed in the holes of the metal layer of the support substrate extend to protrude, relative to the mounting face of the support substrate, into the layer of adhesive material.

Abstract: An electronic device such as a hardware security module device comprises a first cryptographic processing circuit configured to receive input data packets and apply thereto a first cryptographic processing to provide output data packets. A second cryptographic processing circuit is provided in the device, configured to receive the output data packets, apply thereto a second cryptographic processing inverse to the first cryptographic processing, and provide comparison data packets as a result of applying the second cryptographic processing to the output data packets received. A comparison processing circuit in the device is configured to compare the input data packets with the comparison data packets, and to produce an error signal as a result of the input data packets being different from the comparison data packets.

Abstract: A negative impedance circuit includes: a differential circuit stage; a positive feedback path from an output of the differential circuit stage to a first input of the differential circuit stage; and a negative feedback path from the output of the differential circuit stage to a second input of the differential circuit stage. The negative feedback path includes a first transistor, and a unitary gain path from the output of the differential circuit stage to the second input of the differential circuit stage, the unitary gain path coupled to ground via a reference impedance. The positive feedback path includes a second transistor. The first and second transistors are coupled in a current mirror arrangement and have respective control electrodes configured to be driven by the output of the differential circuit stage, where the negative impedance circuit causes a negative impedance at the first input of the differential circuit stage.

Abstract: An embodiment switching converter comprises an input stage; an output stage for providing an output voltage; a capacitive coupling stage for coupling the input stage to the output stage; a first switching stage configured to switch between a first state where an input voltage is provided to the input stage, and a second state where the input voltage is not provided to the input stage; a second switching stage configured to switch between a first state in which a reference voltage is provided to the output stage, and a second state in which the reference voltage is not provided to the output stage; and a voltage regulation stage configured to set, after the second switching stage switches from the first state to the second state and before the first switching stage switches from the second state to the first state, a target voltage across the input stage.

Abstract: An embodiment method for modifying the frequency of a clock signal clocking an integrated circuit supplied by a voltage controller comprises, in response to a command for the modification, varying the frequency of the clock signal at a rate allowing a supply voltage to be controlled by the controller. The variation comprises at least one series of successive divisions of the frequency of the clock signal into successive intermediate signals of respective intermediate frequencies.

Abstract: A circuit includes a tank capacitor coupled between first and second nodes, and a sense resistor having a first terminal coupled to the first node and a second terminal coupled to a regulator input. A switching circuit has first and second inputs coupled to the first and second terminals of the sense resistor. A gain stage has first and second inputs capacitively coupled to first and second outputs of the switching circuit. An analog-to-digital converter receives the output of the gain stage, and receives first and second differential voltages. A reference voltage generator has a temperature independent current source coupled to source current to a reference resistor, the first differential reference voltage being formed across the reference resistor. The reference resistor and sense resistor are located sufficiently close to one another on a single common substrate such that they remain at substantially a same temperature.

Abstract: A combinational circuit block has input pins configured to receive input digital signals and output pins configured to provide output digital signals as a function of the input digital signals received. A test input pin receives a test input signal. A test output pin provides a test output signal as a function of the test input signal received. A set of scan registers are selectively coupled to either the combinational circuit block or to one another so as to form a scan chain of scan registers serially coupled between the test input pin and the test output pin. The scan registers in the set of scan registers are clocked by a clock signal. At least one input register is coupled between the test input pin and a first scan register of the scan chain. The at least one input register is clocked by an inverted replica of the clock signal.

Abstract: An integrated circuit comprises a memory device including at least one memory point having a volatile memory cell and a single non-volatile memory cell coupled together to a common node, and a single selection transistor coupled between the common node and a single bit line. A first output of the volatile memory cell is coupled to the common node, and a second output of the volatile memory cell, complementary to the first output, is not connected to any node outside the volatile memory cell.

Abstract: A MOSFET device includes a semiconductor body having a first and a second face. A source terminal of the MOSFET device includes a doped region which extends at the first face of the semiconductor body and a metal layer electrically coupled to the doped region. A drain terminal extends at the second face of the semiconductor body. The doped region includes a first sub-region having a first doping level and a first depth, and a second sub-region having a second doping level and a second depth. At least one among the second doping level and the second maximum depth has a value which is higher than a respective value of the first doping level and the first maximum depth. The metal layer is in electrical contact with the source terminal exclusively through the second sub-region.

Abstract: A semiconductor substrate includes a matrix of photosites. Each photosite is delimited by an isolation trench including polycrystalline silicon. A peripheral zone extends directly around the matrix of photosites. The peripheral zone includes dummy photosites delimited by isolation trenches including polycrystalline silicon. A density of polycrystalline silicon in the peripheral zone is between a density of polycrystalline silicon at an edge of the matrix of photosites and a density of polycrystalline silicon around the peripheral zone.

Abstract: An integrated circuit includes a continuous time delta sigma analog-to-digital converter (CTDS ADC) and a test circuit for testing the CTDS ADC. The test circuit converts multi-bit digital reference data to a single-bit digital stream. The test circuit then passes the single-bit digital stream to a finite impulse response digital-to-analog converter (FIR DAC). The FIR DAC converts the single-bit digital stream to an analog test signal. The analog test signal is then passed to the CTDS ADC. The CTDS ADC converts the analog test signal to digital test data. The test circuit analyzes the digital test data to determine the accuracy of the CTDS ADC.

Abstract: Disclosed herein is a microelectromechanical (MEMS) device, including a rotor and a first piezoelectric actuator mechanically coupled to the rotor. The first piezoelectric actuator is electrically coupled between a first signal node and a common voltage node. A second piezoelectric actuator is mechanically coupled to the rotor, and is electrically coupled between a second signal node and the common voltage node. Control circuitry includes a drive circuit configured to drive the first and second piezoelectric actuators, a sense circuit configured to process sense signals generated by the first and second pizeoelectric actuators, and a multiplexing circuit. The multiplexing circuit is configured to alternate between connecting the drive circuit to the first piezoelectric actuator while connecting the sense circuit to the second piezoelectric actuator, and connecting the drive circuit to the second piezoelectric actuator while connecting the sense circuit to the first piezoelectric actuator.

Abstract: A capacitive element includes a first conductive layer delimited by an outline and a low voltage dielectric layer covering the first conductive layer. A second conductive layer covers the low voltage dielectric layer and includes: a first portion located over a central zone of the first conductive layer which forms a first capacitor electrode; and a second portion located over the first conductive layer at the inner border of the entire outline of the first conductive layer, and over the front face at the outer border of the entire outline of the first conductive layer. The first portion and the second portion of the second conductive layer are electrically separated by an annular opening extending through the second conductive layer. The first conductive layer is electrically connected to the second portion of the second conductive layer to form a second capacitor electrode.

Abstract: A microelectromechanical mirror device includes a fixed structure defining a cavity, a tiltable structure elastically suspended above the cavity and carrying a reflecting surface, and having a main extension in a horizontal plane. A first pair of driving arms carry respective piezoelectric material regions that are biased to cause a rotation of the tiltable structure around a first rotation axis parallel to a first horizontal axis of the horizontal plane, and elastically coupled to the tiltable structure. Elastic suspension elements that couple the tiltable structure to the fixed structure at the first rotation axis are stiff with respect to movements out of the horizontal plane and yielding with respect to torsion around the first rotation axis, and further extend between the tiltable structure and the fixed structure. The elastic suspension elements have an asymmetrical arrangement on opposite sides of the tiltable structure along the first rotation axis.

Abstract: A driver circuit includes a fly capacitor with a first end and a second end. The driver circuit includes a laser diode having an anode and a cathode. The driver circuit is configured to operate in first and second operating states. The anode is coupled to the first end of the fly capacitor. In the first operating state, the cathode is coupled to a first voltage supply node, the first end of the fly capacitor is coupled to a second voltage supply node, and the second end of the fly capacitor is coupled to a first reference terminal. In the second operating state, the cathode is coupled to a second reference terminal and decoupled from the first voltage supply node, the first end of the fly capacitor is decoupled from the second voltage supply node, and the second end of the fly capacitor is coupled to a third reference terminal.

Abstract: A control circuit for a voltage source generates a reference signal for a voltage source, wherein the reference signal indicates a requested output voltage to be generated by the voltage source. A digital feed-forward control circuit computes a digital feed-forward regulation value indicative of a requested output voltage by determining a maximum voltage drop at strings of solid-state light sources. A digital feed-back control circuit determines a minimum voltage drop for current regulators/limiters for the strings and determines a digital feed-back correction value as a function of the minimum voltage drop. The control circuit then sets the reference signal after a start-up as a function of the digital feed-forward regulation value and corrects the reference signal as a function of the digital feed-back correction value.

Abstract: A device for controlling a first voltage with a second voltage includes a first terminal of application of the second voltage and a second terminal for supplying the first voltage. A comparator has a first input terminal connected to the first terminal and has a second input terminal receiving information representative of the first voltage. At least one first current source of programmable intensity is connected to the second input terminal of the comparator.

Abstract: A processing system includes a digital processing unit programmable as a function of a firmware stored to a non-volatile memory and a resource connected to the digital processing unit via a communication system. The processing system also includes a time reference circuit including a first digital counter circuit to generate, in response to a clock signal, a system time signal including a plurality of bits indicative of a time tick-count, and a time base distribution circuit to generate a time base signal by selecting a subset of the bits of the system time signal, wherein the time base signal is provided to the resource. The resource detects a given event, stores the time base signal to a register in response to the event, and signals the event to the digital processing unit. The digital processing unit reads, via the communication system, the time base signal from the register.

Abstract: A control circuit for a driving an electronic switch associated with a switching node of a flyback converter includes a comparison circuit configured to generate a switch-off signal by comparing a current measurement signal with a current measurement threshold signal. A valley detection circuit is configured to generate a trigger in a trigger signal when a valley signal indicates a valley in a voltage at the switching node of the flyback converter, and a blanking circuit is configured to generate a switch-on signal by combining the trigger signal with a timer signal provide by a timer circuit. The timer signal indicates whether a blanking time-interval has elapsed.

Abstract: A method of managing an integrated circuit memory includes having an integrated circuit card with a memory space including memory space regions for storing user profile data. The memory space is partitioned into segments of memory space regions, where the segments of memory space regions includes allocated regions and empty regions. From the empty regions, the biggest empty region of the memory space is selected. The selected biggest empty region is widened by moving memory blocks positioned in a subset of allocated regions that are at boundaries of the selected biggest empty region into other available empty regions.