Abstract: A metal layer is deposited on a wafer that has silicon carbide, wherein the metal layer forms a contact face. A laser annealing is performed at the contact face using a laser beam application that causes the metal layer to react with the wafer and form a silicide layer. The laser beam has a footprint having a size. To laser anneal the contact face, a first portion of the contact face is irradiated, the footprint of the laser beam is moved by a step smaller than the size of the footprint, and a second portion of the contact face is irradiated, thereby causing the first portion and the second portion of the contact face to overlap.

Abstract: A current sensor architecture is implemented using a trans-resistance amplifier circuit having a low pass filter characteristic. The current sensing resistor and the input resistors for the amplifier circuit are matched thermally so that they have substantially identical temperature coefficients. The feedback resistors, which are coupled in parallel with corresponding capacitors, are implemented using switched capacitor circuits that emulate resistors. With this configuration, the current sensor is temperature insensitive.

Abstract: An antenna configured for near field communication includes a first coil for transmitting and receiving signals having a first frequency and a second coil for transmitting and receiving signals having a second frequency greater than at least twice the first frequency. The first and second coils are magnetically coupled with a coupling coefficient greater than 0.5.

Abstract: A driving circuit for controlling a MEMS oscillator includes a digital conversion stage to acquire a differential sensing signal indicative of a displacement of a movable mass of the MEMS oscillator, and to convert the differential sensing signal of analog type into a digital differential signal of digital type. Processing circuitry is configured to generate a digital control signal of digital type as a function of the comparison between the digital differential signal and a differential reference signal indicative of a target amplitude of oscillation of the movable mass which causes the resonance of the MEMS oscillator. An analog conversion stage includes a ?? DAC and is configured to convert the digital control signal into a PDM control signal of analog type. A filtering stage of low-pass type, by filtering the PDM control signal, generates a control signal for controlling the amplitude of oscillation of the movable mass.

Abstract: A microelectronic device includes a PNP transistor and NPN transistor arranged vertically in a P-type doped semiconductor substrate. The PNP and NPN transistors are manufactured by: forming an N+ doped isolating well for the PNP transistor in the semiconductor substrate; forming a P+ doped region in the N+ doped isolating well; epitaxially growing a first semiconductor layer on the semiconductor substrate; forming an N+ doped well for the NPN transistor, where at least part of the N+ doped well extends into the first semiconductor layer; then epitaxially growing a second semiconductor layer on the first semiconductor layer; forming a P doped region forming the collector of the PNP transistor in the second semiconductor layer and in electrical contact with the P+ doped region; and forming an N doped region forming the collector of the NPN transistor in the second semiconductor layer and in electrical contact with the N+ doped well.

Abstract: A voltage reference circuit includes a first circuit block configured to generate a proportional to absolute temperature current, the first circuit block comprising a current mirror amplifier, a second circuit block coupled to the first circuit block and configured to generated a complimentary to absolute temperature current, and a third circuit block coupled to both the first circuit block and the second circuit block. The second circuit block includes a multi-stage common-source amplifier. The third circuit block is configured to combine the proportional to absolute temperature current and the complimentary to absolute temperature current to generate a reference voltage at an output of the voltage reference circuit.

Abstract: In an embodiment, a voltage comparator includes: a first switch having a conduction terminal coupled to an internal node that is coupled to an output of the voltage comparator; a current source; a capacitor; and a second switch connected in parallel with the capacitor, wherein the current source, the capacitor, and the first switch are coupled in series.

Abstract: Disclosed herein is a method of operating a display panel having a matrix of display elements. The method includes ordered steps of: (1) causing flow of current from a source of power, into an anode of a given display element, out of a cathode of the given display element to ground, wherein the flow of current into the anode and out the cathode to ground results in charging of a parasitic capacitance associated with the anode, (2) transferring charge from a storage capacitor to a parasitic capacitance associated with the cathode, and (3) stopping the flow of current, and then transferring charge from the parasitic capacitance associated with the anode to the storage capacitor.

Abstract: An integrated circuit includes a first semiconductor well contained in a semiconductor substrate and a second semiconductor well contained in the first semiconductor well. A capacitive element for the integrated circuit includes a first electrode and a second electrode, where the first electrode includes at least one vertical conductive structure filling a trench extending vertically into the first semiconductor well. The vertical conductive structure is electrically isolated from the first semiconductor well by a dielectric envelope covering a base and the sides of the trench. The vertical conductive structure penetrates into the second semiconductor well at least at one longitudinal end of the trench. The second electrode includes the first semiconductor well and the second semiconductor well.

Abstract: An electronic device includes a switched-mode power supply having a first operating phase during which the output node of the switched-mode power supply is coupled by an on switch to a source of a first reference voltage. The first operating phase is followed by a second operation phase during which the output node of the switched-mode power supply is in a high impedance state. While in the second operating phase, a capacitor connected to the output node of the switched-mode power supply at least partially discharges into a load.

Abstract: A smart card includes a first circuit delivering a power supply voltage and a second circuit coupled to the first circuit by an electrical conductor and powered with the power supply voltage. A light-emitting diode has a first terminal coupled to the electrical conductor and a second terminal coupled to a first terminal of the second circuit. During a first operating phase, the first circuit delivers a first value of the power supply voltage and the second circuit applies a first voltage to the first terminal. During a second operating phase, the first circuit delivers a second value of the power supply voltage and the second circuit applies a second voltage to the first terminal.

Abstract: A first element and a second element of a same device communicate with each other. The first element sends the second element a first piece of information representative of energy supplied by an electromagnetic field supplying power the device. The second element adapts its operating frequency as a function of the first piece of information.

Abstract: An electronic chip includes a seal ring whose shape is contained within a rectangle, of a width equal to a maximum width of the electronic chip and a length equal to a maximum length of the electronic chip. At least one test pad is arranged at least partially within the rectangle. The test pad is shared with at least one other adjacent electronic chip.

Abstract: An integrated sensor includes a substrate made of a first semiconductor material having a first optical refractive index. The substrate includes a pixel array, wherein each pixel has a photosensitive active zone formed by an index contrast zone including a matrix of the first semiconductor material and a periodic structure embedded in the matrix. The periodic structure extends from the backside of the substrate and has a two-dimensional periodicity in a parallel plane with the backside. A value of the periodicity is linked with the wavelength of the optical signal and with the first refractive index. Elements of the periodic structure are formed of a second optically transparent material having a second refractive index less than the first refractive index. These elements are positioned at locations defined by the periodicity except for at one location defining a region, preferably central, that is devoid of a corresponding one of the elements.

Abstract: The present disclosure relates to an image sensor comprising a first layer of photoelectric material and a diffraction grating located between said first layer and the face of the sensor configured to receive light rays.

Abstract: A photosensitive sensor includes a pixel formed by a photosensitive region in a first semiconductor material, a read region in a second semiconductor material, and a transfer gate facing the parts of the first semiconductor material and the second semiconductor material located between the photosensitive region and the read region. The first semiconductor material and the second semiconductor material have different band gaps and are in contact with one another to form a heterojunction facing the transfer gate.

Abstract: Overvoltage protection circuits are provided. In some embodiments, an overvoltage protection circuit includes a first diode made of a first semiconductor material having a bandgap width greater than that of silicon. A second diode is included and is electrically cross-coupled with the first diode. The second diode is made of a second semiconductor material different from the first semiconductor material.

Abstract: The present disclosure relates to an electronic device comprising a first capacitor and a quartz crystal coupled in series between a first node and a second node; an inverter coupled between the first and second nodes; a first variable capacitor coupled between the first node and a third node; and a second variable capacitor coupled between the second node and the third node.

Abstract: A method includes forming a layer made of a first insulating material on a first layer made of a second insulating material that covers a support, defining a waveguide made of the first material in the layer of the first material, covering the waveguide made of the first material with a second layer of the second material, planarizing an upper surface of the second layer of the second material, and forming a single-crystal silicon layer over the second layer.

Abstract: Techniques and systems are provided for implementing a convolutional neural network. One or more convolution accelerators are provided that each include a feature line buffer memory, a kernel buffer memory, and a plurality of multiply-accumulate (MAC) circuits arranged to multiply and accumulate data. In a first operational mode the convolutional accelerator stores feature data in the feature line buffer memory and stores kernel data in the kernel data buffer memory. In a second mode of operation, the convolutional accelerator stores kernel decompression tables in the feature line buffer memory.