Patents Assigned to STMicroelectronics, Inc.
  • Patent number: 11927443
    Abstract: A microelectromechanical device is provided. A vibrating structure gyroscope included in the device employs a temporal differential sensing method alone or a spatial differential sensing method in combination with the temporal differential sensing method. When used in combination, the temporal sensing method may be applied before the spatial sensing method or applied after the spatial sensing method. The temporal differential sensing samples signals at times t1 and t2 when velocity of a sensing mass within the vibrating structure gyroscope is maximum and has an opposite sign. The temporal sensing method improves Euler and Centrifugal forces cancellation and increases the signal to noise ratio if forces remain equal at times t1 and t2. Applying a high sampling speed can result in times t1 and t2 being sufficiently close to each other and therefore cancel any error terms associated with Euler and Centrifugal forces.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: March 12, 2024
    Assignee: STMicroelectronics, Inc.
    Inventor: Andrea Lorenzo Vitali
  • Patent number: 11929259
    Abstract: The present disclosure is directed to leadless semiconductor packages with improved wettable flanks that encourage the formation of solder fillets when the leadless semiconductor package is mounted to a substrate. The solder fillets are consistently formed and are easily detectable by inspection systems, such as automated optical inspection (AOI) systems.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: March 12, 2024
    Assignee: STMICROELECTRONICS, INC.
    Inventors: Ian Harvey Arellano, Aaron Cadag, Ela Mia Cadag
  • Patent number: 11921655
    Abstract: A microcontroller includes a memory, direct memory access (DMA) controllers and a microprocessor. The microprocessor maintains one or more memory protection (MP) configurations to control access to protected memory areas of the microcontroller. In response to a secure service call of an unsecure user-application, the microprocessor executes a state machine which disables interrupt requests, determining whether DMA controller configurations and MP configurations satisfy secure-service criteria. When the secure-service criteria are satisfied, at least one secure operation associated with the secure service call is performed, and memory areas accessed during the execution of the at least one secure operation are cleaned. The interrupt requests are re-enabled and a response to the secure service call is generated.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: March 5, 2024
    Assignee: STMICROELECTRONICS, INC.
    Inventors: Massimo Panzica, Maurizio Gentili
  • Publication number: 20240067184
    Abstract: A system includes inertial sensors and a GPS. The system generates a first estimated vehicle velocity based on motion data and positioning data, generates a second estimated vehicle velocity based on the processed motion data and the first estimated vehicle velocity, and generates fused datasets indicative of position, velocity and attitude of a vehicle based on the processed motion data, the positioning data and the second estimated vehicle velocity. The generating the second estimated vehicle velocity includes: filtering the motion data, transforming the filtered motion data in a frequency domain based on the first estimated vehicle velocity, generating spectral power density signals, generating an estimated wheel angular frequency and an estimated wheel size based on the spectral power density signals, and generating the second estimated vehicle velocity as a function of the estimated wheel angular frequency and the estimated wheel size.
    Type: Application
    Filed: October 27, 2023
    Publication date: February 29, 2024
    Applicants: STMICROELECTRONICS S.r.l., STMICROELECTRONICS, INC., STMicroelectronics (Grand Ouest) SAS
    Inventors: Nicola Matteo PALELLA, Leonardo COLOMBO, Andrea DONADEL, Roberto MURA, Mahaveer JAIN, Joelle PHILIPPE
  • Patent number: 11916090
    Abstract: A first side of a tapeless leadframe package is etched to form a ring shaped protrusion and a lead protrusion extending from a base layer. An integrated circuit die is mounted to tapeless leadframe package in flip chip orientation with a front side facing the first side. An electrical and mechanical attachment is made between a bonding pad of the integrated circuit die and the lead protrusion. A mechanical attachment is made between the front side of the integrated circuit die and the ring shaped protrusion. The integrated circuit die and the protrusions from the tapeless leadframe package are encapsulated within an encapsulating block. The second side of the tapeless leadframe package is then etched to remove portions of the base layer and define a lead for a leadframe from the lead protrusion and further define a die support for the leadframe from the ring shaped protrusion.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: February 27, 2024
    Assignee: STMicroelectronics, Inc.
    Inventors: Aaron Cadag, Rohn Kenneth Serapio, Ela Mia Cadag
  • Patent number: 11897763
    Abstract: A semiconductor package that contains an application-specific integrated circuit (ASIC) die and a micro-electromechanical system (MEMS) die. The MEMS die and the ASIC die are coupled to a substrate that includes an opening that extends through the substrate and is in fluid communication with an air cavity positioned between and separating the MEMS die from the substrate. The opening exposes the air cavity to an external environment and, following this, the air cavity exposes a MEMS element of the MEMS die to the external environment. The air cavity separating the MEMS die from the substrate is formed with a method of manufacturing that utilizes a thermally decomposable die attach material.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: February 13, 2024
    Assignee: STMicroelectronics, Inc.
    Inventor: Jefferson Sismundo Talledo
  • Publication number: 20240045001
    Abstract: An electronic device includes a magnetometer that outputs magnetometer sensor signals and a gyroscope that outputs gyroscope sensor signals. The electronic device includes a magnetometer calibration module that calibrates the magnetometer utilizing the gyroscope sensor signals. The electronic device generates a first magnetometer calibration parameter based on a Kalman filter process. The electronic device generates a second magnetometer calibration parameter based on a least squares estimation process.
    Type: Application
    Filed: October 17, 2023
    Publication date: February 8, 2024
    Applicant: STMICROELECTRONICS, INC.
    Inventors: Mahaveer JAIN, Mahesh CHOWDHARY
  • Publication number: 20240044646
    Abstract: A microelectromechanical device is provided. A vibrating structure gyroscope included in the device employs a temporal differential sensing method alone or a spatial differential sensing method in combination with the temporal differential sensing method. When used in combination, the temporal sensing method may be applied before the spatial sensing method or applied after the spatial sensing method. The temporal differential sensing samples signals at times t1 and t2 when velocity of a sensing mass within the vibrating structure gyroscope is maximum and has an opposite sign. The temporal sensing method improves Euler and Centrifugal forces cancellation and increases the signal to noise ratio if forces remain equal at times t1 and t2. Applying a high sampling speed can result in times t1 and t2 being sufficiently close to each other and therefore cancel any error terms associated with Euler and Centrifugal forces.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 8, 2024
    Applicant: STMICROELECTRONICS, INC.
    Inventor: Andrea Lorenzo VITALI
  • Patent number: 11862579
    Abstract: In various embodiments, the present disclosure provides semiconductor devices, packages, and methods. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and an encapsulant on the die pad and the lead. A plurality of cavities extends into at least one of the die pad or the lead to a depth from a surface of the at least one of the die pad or the lead. The depth is within a range from 0.5 ?m to 5 ?m. The encapsulant extends into the plurality of cavities. The cavities facilitate improved adhesion between the die pad or lead and the encapsulant, as the cavities increase a surface area of contact with the encapsulant, and further increase a mechanical interlock with the encapsulant, as the cavities may have a rounded or semi-spherical shape.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: January 2, 2024
    Assignee: STMicroelectronics, Inc.
    Inventor: Ian Harvey Arellano
  • Publication number: 20230420390
    Abstract: A leadframe having extensions around an outer edge of a die pad are disclosed. More specifically, leadframes are created with a flange formed at the outer edge of the die pad and extending away from the die pad. The flange is bent, such that it is positioned at an angle with respect to the die pad. Leadframes are also created with anchoring posts formed adjacent the outer edge of the die pad and extending away from the die pad. The anchoring posts have a central thickness that is less than a thickness of first and second portions opposite the central portion. When the leadframe is incorporated into a package, molding compound completely surrounds each flange or anchoring post, which increases the bond strength between the leadframe and the molding compound due to increased contact area. The net result is a reduced possibility of delamination at edges of the die pad.
    Type: Application
    Filed: June 22, 2023
    Publication date: December 28, 2023
    Applicant: STMicroelectronics, Inc.
    Inventor: Jefferson Sismundo TALLEDO
  • Patent number: 11856657
    Abstract: An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: December 26, 2023
    Assignees: STMICROELECTRONICS ASIA PACIFIC PTE LTD, STMICROELECTRONICS, INC.
    Inventors: Fuchao Wang, Olivier Leneel, Ravi Shankar
  • Publication number: 20230411251
    Abstract: The present disclosure is directed to a thin substrate package and a lead frame method of fabricating the semiconductor package. The semiconductor package includes a first lead frame portion and a second lead frame portion. A substrate is positioned in a center opening between the first lead frame portion and the second lead frame portion, the substrate having a thickness less than or equal to 0.10-millimeters (mm). A first die having a plurality of wires is positioned on the substrate by an adhesive. A molding compound covers the first and second lead frame portions, the substrate, and the first die.
    Type: Application
    Filed: June 6, 2023
    Publication date: December 21, 2023
    Applicant: STMicroelectronics, Inc.
    Inventor: Jefferson Sismundo TALLEDO
  • Patent number: 11848256
    Abstract: Embodiments of the present disclosure are directed to leadframe semiconductor packages having die pads with cooling fins. In at least one embodiment, the leadframe semiconductor package includes leads and a semiconductor die (or chip) coupled to a die pad with cooling fins. The cooling fins are defined by recesses formed in the die pad. The recesses extend into the die pad at a bottom surface of the semiconductor package, such that the bottom surfaces of the cooling fins of the die pad are flush or coplanar with a surface of the package body, such as an encapsulation material. Furthermore, bottom surfaces of the cooling fins of the die pad are flush or coplanar with exposed bottom surfaces of the leads.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: December 19, 2023
    Assignee: STMICROELECTRONICS, INC.
    Inventor: Jefferson Talledo
  • Patent number: 11834054
    Abstract: A system includes inertial sensors and a GPS. The system generates a first estimated vehicle velocity based on motion data and positioning data, generates a second estimated vehicle velocity based on the processed motion data and the first estimated vehicle velocity, and generates fused datasets indicative of position, velocity and attitude of a vehicle based on the processed motion data, the positioning data and the second estimated vehicle velocity. The generating the second estimated vehicle velocity includes: filtering the motion data, transforming the filtered motion data in a frequency domain based on the first estimated vehicle velocity, generating spectral power density signals, generating an estimated wheel angular frequency and an estimated wheel size based on the spectral power density signals, and generating the second estimated vehicle velocity as a function of the estimated wheel angular frequency and the estimated wheel size.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: December 5, 2023
    Assignees: STMICROELECTRONICS S.r.l., STMICROELECTRONICS, INC., STMicroelectronics (Grand Ouest) SAS
    Inventors: Nicola Matteo Palella, Leonardo Colombo, Andrea Donadel, Roberto Mura, Mahaveer Jain, Joƫlle Philippe
  • Patent number: 11815568
    Abstract: An electronic device includes a magnetometer that outputs magnetometer sensor signals and a gyroscope that outputs gyroscope sensor signals. The electronic device includes a magnetometer calibration module that calibrates the magnetometer utilizing the gyroscope sensor signals. The electronic device generates a first magnetometer calibration parameter based on a Kalman filter process. The electronic device generates a second magnetometer calibration parameter based on a least squares estimation process.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: November 14, 2023
    Assignee: STMicroelectronics, Inc.
    Inventors: Mahaveer Jain, Mahesh Chowdhary
  • Publication number: 20230358541
    Abstract: A device including microelectromechanical systems (MEMS) sensors are used in dead reckoning in conditions where Global Positioning System (GPS) signals or Global Navigation Satellite System (GNSS) signals are lost. The device is capable of tracking the location of the device after the GPS/GNSS signals are lost by using MEMS sensors such as accelerometers and gyroscopes. By calculating a misalignment angle between a forward axis of a sensor frame of the device and a forward axis of a vehicle frame using the data received from the MEMS sensors, the device can accurately calculate the location of a user or the vehicle of the device even without the GPS/GNSS signals. Accordingly, a device capable of tracking the location of the user riding in the vehicle in GPS/GNSS signals absent environment can be provided.
    Type: Application
    Filed: July 14, 2023
    Publication date: November 9, 2023
    Applicants: STMICROELECTRONICS, INC., STMICROELECTRONICS S.r.l.
    Inventors: Mahaveer JAIN, Mahesh CHOWDHARY, Roberto MURA, Nicola Matteo PALELLA, Leonardo COLOMBO
  • Patent number: 11808063
    Abstract: A method and device for unlatching a door from a frame, using a keyless door latch system, is provided. In one embodiment, a secondary unlocking component receives a signal and derives power from the signal to provide a power source for the keyless door latch system. A microcontroller generates a control signal and an actuator, in response to receiving the control signal, actuates the secondary unlocking component, which allows an energy source, from an exterior of the door, to be transferred to the keyless door latch system for the unlatching of the door.
    Type: Grant
    Filed: March 3, 2023
    Date of Patent: November 7, 2023
    Assignees: STMicroelectronics S.r.l., STMicroelectronics, Inc.
    Inventors: Williamson Sy, Emiliano Mario Piccinelli, Keith Walters
  • Publication number: 20230352586
    Abstract: Methods and structures for forming strained-channel finFETs are described. Fin structures for finFETs may be formed in two epitaxial layers that are grown over a bulk substrate. A first thin epitaxial layer may be cut and used to impart strain to an adjacent channel region of the finFET via elastic relaxation. The structures exhibit a preferred design range for increasing induced strain and uniformity of the strain over the fin height.
    Type: Application
    Filed: December 27, 2022
    Publication date: November 2, 2023
    Applicant: STMICROELECTRONICS, INC.
    Inventors: Nicolas LOUBET, Pierre MORIN
  • Patent number: 11800224
    Abstract: A method includes dividing a field of view into a plurality of zones and sampling the field of view to generate a photon count for each zone of the plurality of zones, identifying a focal sector of the field of view and analyzing each zone to select a final focal object from a first prospective focal object and a second prospective focal object.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: October 24, 2023
    Assignees: STMicroelectronics SA, STMicroelectronics, Inc., STMicroelectronics (Research & Development) Limited
    Inventors: Darin K. Winterton, Donald Baxter, Andrew Hodgson, Gordon Lunn, Olivier Pothier, Kalyan-Kumar Vadlamudi-Reddy
  • Publication number: 20230333648
    Abstract: An electronic device capable of determining an eye convergence angle using a magnetometer sensor is provided. The magnetometer sensor is capable of reporting angle readings in three dimensions that is aligned with an eye gaze direction of each eye of a user. The magnetometer which is incorporated into the device can fit into a human eye like a contact lens and determine the angle of the gaze direction of both eyes with respect to an object within a field of view. By obtaining this eye convergence angle for an object, it is possible to accurately detect depth information. The electronic device also functions as a digital contact lens that can automatically adjust the focal point of the object to provide the user with a clear vision. The electronic device also includes a display that provides the user with additional information about the object.
    Type: Application
    Filed: June 22, 2023
    Publication date: October 19, 2023
    Applicant: STMICROELECTRONICS, INC.
    Inventor: Dominique Paul BARBIER