Patents Assigned to STMicroelectronics, Inc.
  • Publication number: 20210327874
    Abstract: A multi-fin FINFET device may include a substrate and a plurality of semiconductor fins extending upwardly from the substrate and being spaced apart along the substrate. Each semiconductor fin may have opposing first and second ends and a medial portion therebetween, and outermost fins of the plurality of semiconductor fins may comprise an epitaxial growth barrier on outside surfaces thereof. The FINFET may further include at least one gate overlying the medial portions of the semiconductor fins, a plurality of raised epitaxial semiconductor source regions between the semiconductor fins adjacent the first ends thereof, and a plurality of raised epitaxial semiconductor drain regions between the semiconductor fins adjacent the second ends thereof.
    Type: Application
    Filed: July 1, 2021
    Publication date: October 21, 2021
    Applicant: STMICROELECTRONICS, INC.
    Inventors: Qing LIU, Prasanna KHARE, Nicolas LOUBET
  • Patent number: 11152326
    Abstract: The present disclosure is directed to a semiconductor die with multiple contact pads electrically coupled to a single lead via a single wire, and methods for fabricating the same. In one or more embodiments, multiple contact pads are electrically coupled to each other by a plurality of conductive layers stacked on top of each other. The uppermost conductive layer is then electrically coupled to a single lead via a single wire.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: October 19, 2021
    Assignee: STMicroelectronics, Inc.
    Inventors: Rennier Rodriguez, Rammil Seguido, Raymond Albert Narvadez, Michael Tabiera
  • Patent number: 11143670
    Abstract: In one embodiment, a method for detecting functional state of a microelectromechanical (MEMS) sensor is described. The method includes monitoring an input common-mode feedback (ICMFB) voltage generated by an ICMFB circuit coupled to the MEMS sensor through a plurality of nodes. The method also includes determining, using the monitored ICMFB voltage, whether all of the plurality of nodes of the MEMS sensor are electrically connected to the ICMFB circuit.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: October 12, 2021
    Assignee: STMICROELECTRONICS, INC.
    Inventors: Davy Choi, Yamu Hu, Deyou Fang
  • Publication number: 20210313255
    Abstract: The present disclosure is directed to leadless semiconductor packages with improved wettable flanks that encourage the formation of solder fillets when the leadless semiconductor package is mounted to a substrate. The solder fillets are consistently formed and are easily detectable by inspection systems, such as automated optical inspection (AOI) systems.
    Type: Application
    Filed: June 21, 2021
    Publication date: October 7, 2021
    Applicant: STMICROELECTRONICS, INC.
    Inventors: Ian Harvey ARELLANO, Aaron CADAG, Ela Mia CADAG
  • Patent number: 11140750
    Abstract: An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: October 5, 2021
    Assignees: STMICROELECTRONICS, INC., STMICROELECTRONICS ASIA PACIFIC PTE LTD
    Inventors: Fuchao Wang, Olivier Leneel, Ravi Shankar
  • Patent number: 11133241
    Abstract: A semiconductor package having an aperture in a die pad and solder in the aperture coplanar with a surface of the package is disclosed. The package includes a die pad, a plurality of leads, and a semiconductor die coupled to the die pad with a die attach material. A cavity or aperture is formed through the die pad to expose a portion of the die attach material. Multiple solder reflows are performed to reduce the presence of voids in the die attach material. In a first solder reflow, the voids of trapped gas that form when attaching the die to the die pad are released. Then, in a second solder reflow, solder is added to the aperture coplanar with a surface of the die pad. The additional solder can be the same material as the die attach material or a different material.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: September 28, 2021
    Assignee: STMicroelectronics, Inc.
    Inventor: Jefferson Talledo
  • Patent number: 11133331
    Abstract: A tensile strained silicon layer is patterned to form a first group of fins in a first substrate area and a second group of fins in a second substrate area. The second group of fins is covered with a tensile strained material, and an anneal is performed to relax the tensile strained silicon semiconductor material in the second group of fins and produce relaxed silicon semiconductor fins in the second area. The first group of fins is covered with a mask, and silicon-germanium material is provided on the relaxed silicon semiconductor fins. Germanium from the silicon germanium material is then driven into the relaxed silicon semiconductor fins to produce compressive strained silicon-germanium semiconductor fins in the second substrate area (from which p-channel finFET devices are formed). The mask is removed to reveal tensile strained silicon semiconductor fins in the first substrate area (from which n-channel finFET devices are formed).
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: September 28, 2021
    Assignee: STMicroelectronics, Inc.
    Inventors: Qing Liu, Pierre Morin
  • Publication number: 20210273116
    Abstract: A vacuum channel transistor having a vertical gate-all-around (GAA) architecture provides high performance for high-frequency applications, and features a small footprint compared with existing planar devices. The GAA vacuum channel transistor features stacked, tapered source and drain regions that are formed by notching a doped silicon pillar using a lateral oxidation process. A temporary support structure is provided for the pillar during formation of the vacuum channel. Performance of the GAA vacuum channel transistor can be tuned by replacing air in the channel with other gases such as helium, neon, or argon. A threshold voltage of the GAA vacuum channel transistor can be adjusted by altering dopant concentrations of the silicon pillar from which the source and drain regions are formed.
    Type: Application
    Filed: May 17, 2021
    Publication date: September 2, 2021
    Applicant: STMICROELECTRONICS, INC.
    Inventor: John H. ZHANG
  • Publication number: 20210272025
    Abstract: A sensor management system includes a cloud-based sensor configuration system and an electronic device. The electronic device includes a sensor unit. The sensor unit includes configuration data that controls operation of the sensor unit. The configuration data includes a classifier that classifies feature sets generated from sensor signals of the sensor unit. The electronic device sends sensor data to the cloud-based sensor configuration system. The cloud-based sensor configuration system analyzes the sensor data and generates a new classifier customized for the sensor unit based on the sensor data. The cloud-based sensor configuration system sends the new classifier to the electronic device. The electronic device replaces the classifier in the sensor unit with the new classifier.
    Type: Application
    Filed: May 14, 2021
    Publication date: September 2, 2021
    Applicant: STMicroelectronics, Inc.
    Inventors: Mahesh CHOWDHARY, Mahaveer JAIN
  • Patent number: 11096593
    Abstract: Motion activity data is collected from at least one sensor. An initial motion activity classifier function is applied to the motion activity data to produce an initial motion activity posteriorgram. Pre-processing and segmenting the motion activity data into windows produces segmented motion activity data from which sensor specific features are extracted. An updated motion activity classifier function is generated from the extracted sensor specific features. Subsequent motion activity data is also collected from the at least one sensor, and the updated motion activity classifier function is applied to the subsequent motion activity data to produce an updated motion activity posteriorgram.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: August 24, 2021
    Assignees: STMicroelectronics, Inc., STMicroelectronics International N.V.
    Inventors: Mahesh Chowdhary, Arun Kumar, Ghanapriya Singh, Rajendar Bahl
  • Publication number: 20210257315
    Abstract: A leadframe having extensions around an outer edge of a die pad are disclosed. More specifically, leadframes are created with a flange formed at the outer edge of the die pad and extending away from the die pad. The flange is bent, such that it is positioned at an angle with respect to the die pad. Leadframes are also created with anchoring posts formed adjacent the outer edge of the die pad and extending away from the die pad. The anchoring posts have a central thickness that is less than a thickness of first and second portions opposite the central portion. When the leadframe is incorporated into a package, molding compound completely surrounds each flange or anchoring post, which increases the bond strength between the leadframe and the molding compound due to increased contact area. The net result is a reduced possibility of delamination at edges of the die pad.
    Type: Application
    Filed: May 3, 2021
    Publication date: August 19, 2021
    Applicant: STMICROELECTRONICS, INC.
    Inventor: Jefferson TALLEDO
  • Patent number: 11093197
    Abstract: A method includes receiving, at a master agent, announcements from candidate consumer agents indicating the presence of the candidate consumer agents. Each announcement includes display parameters for a display of the corresponding candidate consumer agent. The method further includes receiving at the master agent content parameters from a producer agent, the content parameters defining characteristics of content to be provided by the consumer agent. A mosaic screen is configured based on the received announcements and the content parameters. This configuring of the mosaic screen includes selecting ones of the consumer agents for which an announcement was received and generating content distribution parameters based on the content parameters and the display parameters of the selected ones of the consumer agents. The generated content distribution parameters are provided to the consumer agent.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: August 17, 2021
    Assignees: STMICROELECTRONICS, INC., STMICROELECTRONICS INTERNATIONAL NV
    Inventors: Benedetto Vigna, Mahesh Chowdhary, Matteo Dameno
  • Patent number: 11092618
    Abstract: The present disclosure is directed to a system that includes a sensor and a signal conditioner coupled to the sensor. The signal conditioner includes signal processing circuitry coupled to the sensor and offset cancellation circuitry. The offset cancellation circuitry includes a sign detector configured to output a high signal or a low signal based on a sign of an output signal from the signal processing circuitry, an integrator coupled to the sign detector, and a divider coupled to the integrator and to an input of the signal processing circuitry.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: August 17, 2021
    Assignee: STMicroelectronics, Inc.
    Inventor: Fabio Romano
  • Patent number: 11084283
    Abstract: Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: August 10, 2021
    Assignees: STMICROELECTRONICS S.R.L., STMICROELECTRONICS, INC.
    Inventors: Domenico Giusti, Marco Ferrera, Carlo Luigi Prelini, Simon Dodd
  • Patent number: 11088087
    Abstract: The present disclosure is directed to a micro module with a support structure. The micro module includes a carrier substrate having contacts and a bonding pad, a semiconductor die, and a support structure. The semiconductor die is positioned on the bonding pad and is electrically coupled to the contacts. The support structure is positioned on the bonding pad and adjacent to the semiconductor die. The support structure reinforces the bonding pad such that the bonding pad is more rigid than flexible. As a result, an external force applied to the micro module is less likely to cause the micro module to bend and damage the semiconductor die.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: August 10, 2021
    Assignee: STMicroelectronics, Inc.
    Inventors: Freddie Folio, Michael Tabiera, Edwin Graycochea, Jr.
  • Patent number: 11085769
    Abstract: A gyroscope includes a substrate, a first structure, a second structure and a third structure elastically coupled to the substrate and movable along a first axis. The first and second structure are arranged at opposite sides of the third structure with respect to the first axis A driving system is configured to oscillate the first and second structure along the first axis in phase with one another and in phase opposition with the third structure. The first, second and third structure are provided with respective sets of sensing electrodes, configured to be displaced along a second axis perpendicular to the first axis in response to rotations of the substrate about a third axis perpendicular to the first axis and to the second axis.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: August 10, 2021
    Assignees: STMICROELECTRONICS S.R.L., STMICROELECTRONICS, INC., STMICROELECTRONICS INTERNATIONAL N.V.
    Inventors: Carlo Valzasina, Huantong Zhang, Matteo Fabio Brunetto, Gert Ingvar Andersson, Erik Daniel Svensson, Nils Einar Hedenstierna
  • Patent number: 11081778
    Abstract: A method and apparatus for performing a low-power presence check are provided. In the method and apparatus, a controller detects a presence of a tag by at least causing the antenna to generate a magnetic field over a first time period for detecting the tag, measuring an antenna voltage over a second time period, causing the antenna to cease generating a magnetic field over a third time period longer than the first time period and comparing the antenna voltage to an antenna reference voltage to determine whether the tag is present. The controller detects the presence of the tag in response to receiving a command from a host device for performing the low-power presence check. The command may be a one-time command for every presence check stage or a command that is repeatedly received each time the controller detects the presence of the tag.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: August 3, 2021
    Assignee: STMicroelectronics, Inc.
    Inventors: Pierre Rizzo, Christophe Henri Ricard
  • Patent number: 11073602
    Abstract: A user identification based control system includes a time of flight ranging sensor configured to sense a distance to a person, where the time of flight ranging sensor is positioned so the sensed distance is a function of a height of the person. Processing circuitry is coupled to the time of flight ranging sensor and configured to identify the person based upon sensed distance and to generate control signals to control peripheral components based upon the identity of the person. The time of flight ranging sensor may also be used to sense speed of the person for identification purposes. In general, the time of flight ranging sensor is positioned a known height over a surface on which the person is present, such as in the doorway or on a ceiling of a room.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: July 27, 2021
    Assignee: STmicroelectronics, inc.
    Inventors: Xiaoyong Yang, Rui Xiao
  • Patent number: 11069682
    Abstract: A multi-fin FINFET device may include a substrate and a plurality of semiconductor fins extending upwardly from the substrate and being spaced apart along the substrate. Each semiconductor fin may have opposing first and second ends and a medial portion therebetween, and outermost fins of the plurality of semiconductor fins may comprise an epitaxial growth barrier on outside surfaces thereof. The FINFET may further include at least one gate overlying the medial portions of the semiconductor fins, a plurality of raised epitaxial semiconductor source regions between the semiconductor fins adjacent the first ends thereof, and a plurality of raised epitaxial semiconductor drain regions between the semiconductor fins adjacent the second ends thereof.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: July 20, 2021
    Assignee: STMICROELECTRONICS, INC.
    Inventors: Qing Liu, Prasanna Khare, Nicolas Loubet
  • Patent number: 11069601
    Abstract: The present disclosure is directed to leadless semiconductor packages with improved wettable flanks that encourage the formation of solder fillets when the leadless semiconductor package is mounted to a substrate. The solder fillets are consistently formed and are easily detectable by inspection systems, such as automated optical inspection (AOI) systems.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: July 20, 2021
    Assignee: STMicroelectronics, Inc.
    Inventors: Ian Harvey Arellano, Aaron Cadag, Ela Mia Cadag