Abstract: The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP) or a package containing a semiconductor die, with a die embedded within a substrate that is surrounded by an elastomer. The package includes nonconductive layers on surfaces of the substrate and the elastomer as well as conductive layers and conductive vias that extend through these layers to form electrical connections in the package. The package includes surfaces of the conductive material, which may be referred to as contacts. These surfaces of the conductive material are exposed on both sides of the package and allow the package to be mounted within an electronic device and have other electronic components coupled to the package, or allow the package to be included in a stacked configuration of semiconductor dice or packages.

Abstract: A passive cable adaptor for connecting a data source device with a display device is described. The adaptor has a packet-based interface connector at one end, the connector having a positive main link pin, a negative main link pin, a positive auxiliary channel pin, and a negative auxiliary channel pin. At the other end is a micro serial interface connector, wherein multimedia content is transmitted over the cable adaptor and electrical power is supplied over the cable adaptor simultaneously. The cable adaptor has an auxiliary and hot plug detect (HPD) controller utilized to map the auxiliary channel and HPD signals of the packet-based digital display to the micro serial interface ID signal.

Abstract: An electronic device receives wireless signals encoded with data in an amplitude-shift keying format. The electronic device passes the wireless signals through a low-pass filter. The low-pass filter has a cutoff frequency between a first frequency associated with data values of a first type and a second frequency associated with data values of a second type. The low-pass filter has the effect of changing the wireless signal from the amplitude-shift keying format to an on-off keying format without losing the data. The electronic device decodes the data from the wireless signal in the on-off keying format.

Abstract: System, method, and circuitry for utilizing a synchronization message to create fixed transmission windows for multiple priority data in half-duplex communication systems. A first computing device includes a first master controller and a first slave radio, and a second computing device includes a second slave controller and a second master radio. The first controller and the second radio may share a transmit mode during a transmission window, and the first radio and the second controller radio may share a receive mode during that same transmission window, which are defined by the synchronization message. The first controller can transmit outbound data to the first radio, the second radio can transmit outbound data to the second controller, and the second radio can transmit inbound data to the first radio during this transmission window.

Abstract: System, method, and circuitry for utilizing a transmit token to create a floating transmission window for multiple priority data in half-duplex communication systems. A first computing device selects audio data and control data to transmit to a second computing device based on a first low priority for audio data relative to a second high priority for control data and on buffer statuses. In response to the first computing device determining that the first computing device possesses a transmit token, the first computing device transmits the selected audio data and the selected control data to the second computing device. The first computing device then transmits the transmit token to the second computing device. The first computing device then waits for the transmit token to be returned before transmitting more data to the second computing device.

Abstract: A microelectromechanical system (MEMS) gyroscope includes a driving mass and a driving circuit that operates to drive the driving mass in a mechanical oscillation at a resonant drive frequency. An oscillator generates a system clock that is independent of and asynchronous to the resonant drive frequency. A clock generator circuit outputs a first clock and a second clock that are derived from the system clock. The drive loop of the driving circuit including an analog-to-digital converter (ADC) circuit that is clocked by the first clock and a digital signal processing (DSP) circuit that is clocked by the second clock.

Abstract: An interconnect structure for use in coupling transistors in an integrated circuit is disclosed, including various configurations in which ferroelectric capacitors exhibiting negative capacitance are coupled in series with dielectric capacitors. In one embodiment, the negative capacitor includes a dielectric/ferroelectric bi-layer. When a negative capacitor is electrically coupled in series with a conventional dielectric capacitor, the series combination behaves like a stable ferroelectric capacitor for which the overall capacitance can be measured experimentally, and tuned to a desired value. The composite capacitance of a dielectric capacitor and a ferroelectric capacitor having negative capacitance coupled in series is, in theory, infinite, and in practice, very large. A series combination of positive and negative capacitors within a microelectronic interconnect structure can be used to make high capacity DRAM memory cells.

Abstract: A vacuum channel transistor having a vertical gate-all-around (GAA) architecture provides high performance for high-frequency applications, and features a small footprint compared with existing planar devices. The GAA vacuum channel transistor features stacked, tapered source and drain regions that are formed by notching a doped silicon pillar using a lateral oxidation process. A temporary support structure is provided for the pillar during formation of the vacuum channel. Performance of the GAA vacuum channel transistor can be tuned by replacing air in the channel with other gases such as helium, neon, or argon. A threshold voltage of the GAA vacuum channel transistor can be adjusted by altering dopant concentrations of the silicon pillar from which the source and drain regions are formed.

Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.

Abstract: A method to determine a relative delay between a current-overshoot signal and a write data signal for a hard disk drive preamplifier, the method including using a memory element to strobe a test current-overshoot signal with a test data signal; counting a number of strobed transitions of the test current-overshoot signal; adjusting the delay based on the number of strobed transitions; setting a phase difference between the current-overshoot signal and the write data signal according to the delay; and using the memory element to strobe the current-overshoot signal with the write data signal.

Abstract: The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.

Abstract: A microelectromechanical system (MEMS) accelerometer sensor has a mobile mass and a sensing capacitor. To self-test the sensor, a test signal having a variably controlled excitation voltage and a fixed pulse width is applied to the sensing capacitor. The leading and trailing edges of the test signal are aligned to coincide with reset phases of a sensing circuit coupled to the sensing capacitor. The variably controlled excitation voltage of the test signal is configured to cause an electrostatic force which produces a desired physical displacement of the mobile mass. During a read phase of the sensing circuit, a variation in capacitance of sensing capacitor due to the actual physical displacement of the mobile mass is sensed for comparison to the desired physical displacement.

Abstract: A method includes receiving, at a master agent, announcements from candidate consumer agents indicating the presence of the candidate consumer agents. Each announcement includes display parameters for a display of the corresponding candidate consumer agent. The method further includes receiving at the master agent content parameters from a producer agent, the content parameters defining characteristics of content to be provided by the consumer agent. A mosaic screen is configured based on the received announcements and the content parameters. This configuring of the mosaic screen includes selecting ones of the consumer agents for which an announcement was received and generating content distribution parameters based on the content parameters and the display parameters of the selected ones of the consumer agents. The generated content distribution parameters are provided to the consumer agent.

Abstract: A device includes processing circuitry and sensor communication interface circuitry. The processing circuitry, in operation, generates one or more parameters of a regression model based on a plurality of data sets. Each data set includes an application time stamp and a sensor time stamp. Based on the one or more parameters, the processing circuitry estimates application time stamps associated with received sensor data samples. The received sensor data samples have associated sensor time stamps. The sensor communication interface circuitry is coupled to the processing circuitry. The sensor communication interface circuitry, in operation, communicatively couples the processing circuitry to a sensor. Data samples of the sensor are received by the processor via the sensor communication interface circuitry.

Abstract: A method and device for unlatching a door from a frame, using a keyless door latch system, is provided. In one embodiment, a secondary unlocking component receives a signal and derives power from the signal to provide a power source for the keyless door latch system. A microcontroller generates a control signal and an actuator, in response to receiving the control signal, actuates the secondary unlocking component, which allows an energy source, from an exterior of the door, to be transferred to the keyless door latch system for the unlatching of the door.

Abstract: The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP) or a package containing a semiconductor die, with a die embedded within a substrate that is surrounded by an elastomer. The package includes nonconductive layers on surfaces of the substrate and the elastomer as well as conductive layers and conductive vias that extend through these layers to form electrical connections in the package. The package includes surfaces of the conductive material, which may be referred to as contacts. These surfaces of the conductive material are exposed on both sides of the package and allow the package to be mounted within an electronic device and have other electronic components coupled to the package, or allow the package to be included in a stacked configuration of semiconductor dice or packages.

Abstract: The present disclosure is directed to semiconductor packages manufactured utilizing a leadframe with varying thicknesses. The leadframe with varying thicknesses has a reduced likelihood of deformation while being handled during the manufacturing of the semiconductor packages as well as when being handled during a shipping process. The method of manufacturing is not required to utilize a leadframe tape based on the leadframe with varying thicknesses. This reduces the overall manufacturing costs of the semiconductor packages due to the reduced materials and steps in manufacturing the semiconductor packages as compared to a method that utilizes a leadframe tape to support a leadframe. The semiconductor packages may include leads of varying thicknesses formed by utilizing the leadframe of varying thicknesses to manufacture the semiconductor packages.

Abstract: Digital signal processing circuitry, in operation, determines, based on accelerometer data, a carry-position of a device. Double-tap detection parameters are set using the determined carry-position. Double-taps are detected using the set double-tap detection parameters. In response to detection of a double-tap, control signals, such as a flag or an interrupt signal, are generated and used to control operation of the device. For example, a device may enter a wake mode of operation in response to detection of a double-tap.

Abstract: Disclosed herein is a system for detecting rotational speed and early failures of an electronic device. The system includes a rotating disk affixed to a rotating shaft of the electronic device. The rotating disk has projections extending from its periphery. A time of flight ranging system determines distance to the projections extending from the rotating disk. Processing circuitry determines a rotational speed of the rotating shaft from the determined distances to the projections extending from the rotating disk, and detects whether the electronic device is undergoing an early failure from the determined distances to the projections extending from the rotating disk. Rotational speed is determined from the time between successive peaks in the determined distances, and early failures (for example, due to wobble of the shaft) are determined where the peaks vary unexpectedly in magnitude.

Abstract: A semiconductor package device having a porous copper adhesion promoter layer is provided. The porous copper adhesion promoter layer developed via de-metallization of the intermetallic compound layer grown after the thermal treatment of a thin metal layer plated on the copper base material. The highly selective de-metallization of the intermetallic compound layer ensures that the plated surfaces are not affected and does not create wire-bondability issues. The porous copper layer solves the delamination between the carrier and the epoxy molding compound by providing mechanical interlock features. Further, increasing the surface area of contact between the carrier and the epoxy molding compound improves the mechanical interlock features.