Abstract: A PLL circuit includes a fractional-N divider generating a feedback signal, a first phase-frequency detector that compares the feedback signal to a reference signal to generate first up/down control signals that control a charge pump to generate a charge pump output current. A noise cancelation circuit includes a synchronization circuit that generates first and second synchronized feedback signals from the PLL circuit output and the feedback signal, where the first and second synchronized feedback signals are offset by an integer number of cycles of the PLL circuit output. A second phase-frequency detector circuit compares the first and second synchronized feedback clock signals to generate second up/down control signals whose pulse widths differ by the integer number of PLL cycles. A current digital to analog converter circuit is controlled in response to the second up/down control signals to apply noise canceling sourcing and sinking currents to the charge pump output current.

Abstract: The present disclosure is directed to an integrated circuit that includes a non-volatile memory (NVM). The integrated circuit includes a bias generator that produces stable wordline and bitline voltages for a reliable read operation of the NVM. This disclosure is directed to low voltage memory operations of memory read, erase verify, and program verify. The present disclosure is directed to non-volatile memory circuits that can also operate at low supply voltages in digital voltage supply range.

Abstract: A charge pump includes an intermediate node capacitively coupled to receive a first clock signal oscillating between a ground and positive supply voltage, the intermediate node generating a first signal oscillating between a first and second voltage. A level shifting circuit shifts the first signal in response to a second clock signal to generate a second signal oscillating between first and third voltages. A CMOS switching circuit includes a first transistor having a source coupled to an input, a second transistor having a source coupled to an output and a gate coupled to receive the second signal. A common drain of the CMOS switching circuit is capacitively coupled to receive the first clock signal. When positively pumping, the first voltage is twice the second voltage and the third voltage is ground. When negatively pumping, the first and third voltages are of opposite polarity and the second voltage is ground.

Abstract: A semiconductor device includes: a substrate; a transduction microstructure integrated in the substrate; a cap joined to the substrate and having a first face adjacent to the substrate and a second, outer, face; and a channel extending through the cap from the second face to the first face and communicating with the transduction microstructure. A protective membrane made of porous polycrystalline silicon permeable to aeriform substances is set across the channel.

Abstract: A multiplexer includes an input, an output, and a main switch configured to pass a signal from the input to the output. The multiplexer includes two bootstrap circuits that collectively maintain a constant voltage between terminals of the main switch during alternating phases.

Abstract: An integrated circuit includes a non-volatile memory, a charge pump that generates high voltages for programming operations of the non-volatile memory array, and a charge pump regulator that controls a slew rate of the charge pump. The charge pump regulator generates a sense current indicative of the slew rate and adjusts a frequency of a clock signal provided to the charge pump based on the sense current.

Abstract: An integrated circuit includes a charge pump. The charge pump includes a plurality of charge pump stages and a plurality of switches. The switches can operated to selectively couple the charge pump stages in various arrangements of series and parallel connections based on a currently selected operational mode of the charge pump. The charge pump assists in performing read and write operations for a memory array of the integrated circuit.

Abstract: A read signal generator generates read signals to control read operations of a memory array. The read signal generator can be selectively controlled to generate an oscillating signal having a period that corresponds to a feature one of the read signals. The oscillating signal is passed to a frequency divider that divides the oscillating signal and provides the divided oscillating signal to an output pad. The frequency of the oscillating signal can be measured at the output pad. The frequency of the oscillating signal, and the duration of the read signal feature can be calculated from the frequency of the oscillating signal. The read signal feature can then be adjusted if needed.

Abstract: An integrated circuit includes a pulse width modulator. The pulse width modulator includes a multiplexer that receives a plurality of data delay signals. Each of the data delay signals is based on a data signal and a respective clock phase signal. The multiplexer includes a first multiplexer stage and a second multiplexer stage. The first multiplexer stage receives all of the data delay signals and has a relatively large delay. The second multiplexer stage receives to output signals from the first multiplexer stage and has a relatively small delay. The second multiplexer stage outputs a pulse width modulation signal that can have a pulse width corresponding to the offset between two adjacent clock phase signals.

Abstract: Circuits and methods for testing voltage monitor circuits are provided. In one embodiment, a method includes setting voltage monitor circuits to test mode; setting, a monitor reference in each voltage monitor circuit, to a respective targeted threshold voltage using a corresponding trim code; ramping, a voltage provided to a subset of voltage monitor circuits, from a first voltage to a second voltage using a test voltage supply, voltages between the first voltage and the second voltage corresponding with targeted threshold voltages of the subset of voltage monitor circuits; determining, for each voltage monitor circuit in the subset of voltage monitor circuits, a voltage value of the test voltage supply resulting in a change in a logic state at an output of a corresponding voltage monitor circuit.

Abstract: An integrated circuit includes a memory array and a read voltage regulator that generates read voltages from the memory array. The read voltage regulator includes a replica memory cell and the replica bitline current path. The replica memory cell is a replica of memory cells of the memory array. The replica bitline current path is a replica of current paths associated with deadlines of the memory array. The read voltage regulator generates a read voltage based on the current passed through the replica bitline current path. This read voltage is then supplied to the wordlines of the memory array during a read operation.

Abstract: A charge pump circuit includes a first charge pump stage circuit coupled in series with a second charge pump stage circuit. A discharge circuit operates to discharge the charge pump circuit. The discharge circuit includes: a first switched circuit coupled to a first output of the first charge pump stage circuit and configured, when actuated, to discharge the first output; and a second switched circuit coupled to a second output of the second charge pump stage circuit and configured, when actuated, to discharge the second output. A discharge control circuit actuates the first switched discharge circuit to discharge the first output and then, after the first output is fully discharged, actuates the second switched discharge circuit to discharge the second output.

Abstract: The charge transfer transistors of a positive or negative charge pump are biased at their gate terminals with a control voltage that provides for an higher level of gate-to-source voltage in order to reduce switch resistance in passing a boosted (positive or negative) voltage to a voltage output of the charge pump. This control voltage is generated using a bootstrapping circuit whose polarity of operation (i.e., negative or positive) is opposite to a polarity (i.e., positive or negative) of the charge pump.

Abstract: A memory cell that performs in-memory compute operations, includes a pair of cross-coupled inverters and a pair of transistors for selective performance of read/write/hold operations associated with logic states of the pair of cross-coupled inverters. The memory cell further includes a set of transistors that are gate coupled to and symmetrically arranged about the pair of cross coupled inverters. Output nodes of the memory cell are located at terminals of the set of transistors and provide output based on logic states of the pair of cross coupled inverters and input nodes provided between pairs of the set of transistors. A memory cell array may be generated having a high density arrangement memory cells that can perform in-memory compute operations. The memory cells can be arranged as a neural network including a set of memory cell networks that provide logic output operations based on logic states of the respective memory cells.

Abstract: A testing tool includes a clock generation circuit generating a test clock and outputting the test clock via a test clock output pad, data processing circuitry clocked by the test clock, and data output circuitry receiving data output from the data processing circuitry and outputting the data via an input/output (IO) pad, the data output circuitry being clocked by the test clock. The testing tool also includes a programmable delay circuit generating a delayed version of the test clock, and data input circuitry receiving data input via the IO pad, the data input circuitry clocked by the delayed version of the test clock. The delayed version of the test clock is delayed to compensate for delay between transmission of a pulse of the test clock via the test clock output pad to an external computer and receipt of the data input from the external computer via the IO pad.

Abstract: A memory management circuit stores information indicative of reliability-types of regions of a memory array. The memory management circuitry responds to a request to allocate memory in the memory array to a process by determining a request type associated with the request to allocate memory. Memory of the memory array is allocated to the process based on the request type associated with the request to allocate memory and the stored information indicative of reliability-types of regions of the memory array. The memory array may be a shared memory array. The memory array may be organized into rows and columns, and the regions of the memory array may be the rows of the memory array.

Abstract: An integrated circuit includes a data propagation path including a flip-flop. The flip-flop includes a first latch and a second latch. The integrated circuit includes a third latch that acts as a dummy latch. The input of the third latch is coupled to the output of the first latch. The integrated circuit includes a fault detector coupled to the output of the flip-flop and the output of the third latch. The third latch includes a signal propagation delay selected so that the third latch will fail to capture data in a given clock cycle before the second latch of the flip-flop fails to capture the data in the given clock cycle. The fault detector that detects when the third latch is failed to capture the data.

Abstract: A delay chain circuit with series coupled delay elements receives a reference clock signal and outputs phase-shifted clock signals. A multiplexer circuit receives the phase-shifted clock signals and selects among the phase-shifted clock signals for output as in response to a selection signal. The selection signal is generated by a control circuit from a periodic signal having a triangular wave profile. A sigma-delta modulator converts the periodic signal to a digital signal, and an integrator circuit integrates the digital signal to output the selection signal. The selected phase-shifted clock signal is applied as the reference signal to a phase locked loop which generates a spread spectrum clock signal.

Abstract: A static random access memory (SRAM) device disclosed herein includes an array of SRAM cells powered between first and second voltages. A reference voltage generator generates a reference voltage that is proportional to absolute temperature, with a magnitude curve of the reference voltage being based upon a control word. A low dropout amplifier sets and maintains the second voltage as being equal to the reference voltage. Control circuitry generates the control word based upon process variation information about the SRAM device. In one instance, the control circuitry monitors a canary bit-cell and increments the control word, to thereby increase the magnitude curve of the reference voltage, until the canary bit-cell fails. In another instance, the control circuitry measures the oscillation frequency of a ring oscillator, and selects the control word based upon the measured oscillation frequency.

Abstract: An on chip leakage-current detection device including a first inverter where the magnitude of delay of the output signal of the first inverter is determined by a leakage current of a target device. The leakage-current detection device further includes: a capacitor that is charged by the output signal of the first inverter; a second inverter coupled to capacitor that switches states when the capacitor is charged to a switching level; an odd number of additional inverters coupled in a sequence with a second-inverter output. The output of the leakage-current detection device has a frequency proportional to the leakage of the target device.