Abstract: A method includes forming a layer made of a first insulating material on a first layer made of a second insulating material that covers a support, defining a waveguide made of the first material in the layer of the first material, covering the waveguide made of the first material with a second layer of the second material, planarizing an upper surface of the second layer of the second material, and forming a single-crystal silicon layer over the second layer.

Abstract: A wireless power receiver includes a rectifier with first and second inputs coupled to first and second terminals of a receiver coil, and having a first output coupled to ground and a second output at which a rectified voltage is produced. A first switch is coupled between the second input and ground, and is controlled by a first gate voltage generated at a first node. A second switch is coupled between the first node and ground, and is controlled by a second gate voltage. The first gate voltage closes the first switch to couple the second input to ground when the rectified voltage is less than a threshold voltage, boosting the rectified voltage. The second gate voltage closes the second switch to cause the second gate voltage to be pulled to ground when the rectified voltage is greater than the threshold voltage, limiting the boosting of the rectified voltage.

Abstract: In an embodiment a DC to DC conversion circuit includes a DC to DC converter connected to an input path and an output path and a current limiting circuit including a circuit configured to detect when an input or output current of the DC to DC converter exceeds or falls below a current threshold and a controller configured to store a first voltage level of an output voltage of the DC to DC converter in response to the input or output current exceeding the current threshold, to store a second voltage level of the output voltage in response to the input or output current falling below the current threshold and to set a control signal based on the first and second voltage levels.

Abstract: In an embodiment a non-volatile memory cell includes a substrate, a first body in the substrate, a second body in the substrate, a first storage transistor having a first conduction region and a second conduction region in the first body, the first and second conduction regions delimiting a first channel region in the first body, a first control gate region in the second body, an insulating region overlying the substrate, a single floating gate region extending on the substrate and embedded in the insulating region, the single floating gate region having a first portion on the first body and a second portion on the second body, the first portion and second portion being connected and electrically coupled, a first selection via extending through the insulating region and electrically coupling the first conduction region with a first conduction node, a second selection via extending through the insulating region and electrically coupling the second conduction region with a second conduction node and a first con

Abstract: An output potential level among two first levels is delivered according to an input level among two second levels. The output potential level is delivered at a first node connecting together first and second transistors electrically in series between two second nodes of application of the first levels. A first DC voltage defining a high limit for the control voltage of the first transistor is delivered by a first voltage generator powered by one of the second nodes. A second DC voltage defining a high limit for the control voltage of the second transistor is delivered by a second voltage generator controlled by a value representative of the first voltage and powered between the second nodes.

Abstract: A multiplexer includes an input, an output, and a main switch configured to pass a signal from the input to the output. The multiplexer includes two bootstrap circuits that collectively maintain a constant voltage between terminals of the main switch during alternating phases.

Abstract: A pulsed signal generator generates a pulsed signal having a pulse width configured to be equal to a given fraction of a pulse width of a reference clock. A reference current source outputs current having a reference magnitude, and a comparison current source outputs current having a magnitude that is a function of the reference magnitude and the given fraction. A comparison circuit compares a total current output by one of the reference current source and the comparison current source during pulses of the reference clock to a total current output by the other of the reference current source and the comparison current source during pulses of the pulsed signal equal in number to the pulses of the reference clock in order to determine whether the pulse width of the pulse signal is less than or equal to the given fraction of the pulse width of the reference clock.

Abstract: A MOSFET device comprising: a structural region, made of a semiconductor material having a first type of conductivity, which extends between a first side and a second side opposite to the first side along an axis; a body region, having a second type of conductivity opposite to the first type, which extends in the structural region starting from the first side; a source region, having the first type of conductivity, which extends in the body region starting from the first side; a gate region, which extends in the structural region starting from the first side, traversing entirely the body region; and a shielding region, having the second type of conductivity, which extends in the structural region between the gate region and the second side. The shielding region is an implanted region self-aligned, in top view, to the gate region.

Abstract: A leadframe includes a die pad and a set of electrically conductive leads. A semiconductor die, having a front surface and a back surface opposed to the front surface, is arranged on the die pad with the front surface facing away from the die pad. The semiconductor die is electrically coupled to the electrically conductive leads. A package molding material is molded over the semiconductor die arranged on the die pad. A stress absorbing material contained within a cavity delimited by a peripheral wall on the front surface of the semiconductor die is positioned intermediate at least one selected portion of the front surface of the semiconductor die and the package molding material.

Abstract: An integrated circuit includes a polysilicon region that is doped with a dopant. A portion of the polysilicon region is converted to a polyoxide region which includes un-oxidized dopant ions. A stack of layers overlies over the polyoxide region. The stack of layers includes: a first ozone-assisted sub-atmospheric pressure thermal chemical vapor deposition (O3 SACVD) TEOS layer; and a second O3 SACVD TEOS layer; wherein the first and second O3 SACVD TEOS layers are separated from each other by a dielectric region. A thermally annealing is performed at a temperature which induces outgassing of passivation atoms from the first and second O3 SACVD TEOS layers to migrate to passivate interface charges due to the presence of un-oxidized dopant ions in the polyoxide region.

Abstract: A single photon avalanche diode (SPAD) pixel circuit includes a SPAD, a clamping transistor coupled to the anode of the SPAD, and readout circuitry. The clamping transistor limits the anode voltage to a threshold below the readout circuitry's maximum operating voltage. In one embodiment, quenching and enabling transistors are implemented using single-layer gate oxide technology, while the clamping transistor uses extended drain technology. A regulation circuit generates a voltage clamp control signal for an array of pixels. Another embodiment utilizes a stacked chip design with the SPAD and a cathode-side quenching element on one chip, and the clamping transistor and readout circuitry on another. This incorporates a parasitic capacitance from deep trench isolation. Additional biasing transistors may be used for fine-tuning the clamped anode voltage.

Abstract: Test method of a vibrational MEMS structure wherein, a direct, variable modification voltage is applied to a resonance modification test structure having non-rectilinear electrodes, modifying the resonance frequency of the movable mass and the driving frequency. During the test, the movable mass is verified about stability and, if not stable, the vibrational MEMS structure is rejected.

Abstract: A semiconductor MOS device having an epitaxial layer with a first conductivity type formed by a drain region and by a drift region. The drift region accommodates a plurality of first columns with a second conductivity type and a plurality of second columns with the first conductivity type, the first and second columns alternating with each other and extending on the drain region. Insulated gate regions are each arranged on top of a respective second column; body regions having the second conductivity type extend above and at a distance from a respective first column, thus improving the output capacitance Cds of the device, for use in high efficiency RF applications.

Abstract: An image sensor includes a pixel array where each pixel is formed in a portion of a substrate electrically insulated from other portions of the substrate. Each pixel includes a photodetector; a transfer transistor; and a readout circuit comprising one or a plurality of transistors. The transistors of the readout circuit are formed inside and on top of at least one well of the portion. The reading from the photodetector of a pixel of a current row uses at least one transistor of the readout circuit of a pixel of at least one previous row, the well of the pixel of the previous row being biased with a first voltage greater than a second bias voltage of the well of the pixel of the current row.

Abstract: A pixel includes a photosensitive circuit, a sense node, a first transistor and a first capacitor. A first electrode of the first capacitor is connected to a control terminal of the first transistor. A second electrode of the first capacitor is to a node of application of a first control signal.

Abstract: In an embodiment an integrated device includes a first physical unclonable function module configured to generate an initial data group and management module configured to generate an output data group from at least the initial data group, authorize only D successive deliveries of the output data group on a first output interface of the device, D being a non-zero positive integer, and prevent any new generation of the output data group.

Abstract: An LED lighting system includes switching circuitry adjustably driving a string of LEDs and being controlled by a reference current and an enable signal. A controller generates the reference current and enable signal based upon a PWM signal such that the switching circuitry: sources a first LED current to the string of LEDs that is proportional to a duty cycle of the PWM signal when the duty cycle is greater than a threshold duty cycle to thereby perform analog dimming; and sources a second LED current to the string of LEDs that has a duty cycle proportional to the duty cycle of the PWM signal when the duty cycle of the PWM signal is less than the threshold duty cycle, such that an average LED current delivered to the string of LEDs is proportional to the duty cycle of the PWM signal to thereby perform digital dimming.

Abstract: A method includes dividing a field of view into a plurality of zones and sampling the field of view to generate a photon count for each zone of the plurality of zones, identifying a focal sector of the field of view and analyzing each zone to select a final focal object from a first prospective focal object and a second prospective focal object.

Abstract: System, method, and circuitry for generating content for a programmable computing device based on user-selected configuration information. A settings registry is generated based on the user's selections. The settings registry and the user selected configuration information is utilized to generate the content, such as code, data, parameters, settings, etc. When the content is provided to the programmable computing device, the content initializes, configures, or controls one or more software and hardware aspects of the programmable computing device, such as boot sequence configurations, internal peripheral configurations, states of the programmable computing device, transitions between states of the programmable computing device, etc., and various combinations thereof.

Abstract: A method for manufacturing an electronic chip includes providing a semiconductor layer located on an insulator covering a semiconductor substrate. First and second portions of the semiconductor layer are oxidized up to the insulator. Stresses are generated in third portions of the semiconductor layer, and each of the third portions extend between two portions of the semiconductor layer that are oxidized. Cavities are formed which extend at least to the substrate through the second portions and the insulator. Bipolar transistors are formed in at least part of the cavities and first field effect transistors are formed in and on the third portions. Phase change memory points are coupled to the bipolar transistors.