Abstract: A calibration method of a temperature sensor is provided. The temperature sensor having a current source and a ring oscillator generating a square pulse signal with a temperature-dependent square pulse frequency. The acquisition of a first square pulse frequency measurement at a first temperature from the square pulse signal forms a first measurement point. A second square pulse frequency measurement at a second temperature from the second square pulse signal forms a second measurement point. The determination of the relation data being representative of an affine relation between square pulse frequency measurements and temperatures. The affine relation being defined by a used proportionality coefficient modified with respect to a measured proportionality coefficient of a measured affine relation linking the first measurement point and the second measurement point.

Abstract: A ring resonator electro-optical device includes a first silicon nitride waveguide and a second annular silicon waveguide that comprises a first section running under a second section of the first waveguide. The second waveguide also includes an annular silicon strip having a cross-section increasing in the first section from a minimum cross-section located under the second section.

Abstract: A waveform generator includes a system control unit and signal channels controlled by the system control unit and configured to supply driving signals for driving a respective transducer of an array of transducers. Each signal channel includes a sequential access memory having rows, where each row contains an instruction word configured to generate a respective step of a waveform to be generated. A memory output of the sequential access memory is defined by an output row at a fixed location. The waveform to be generated is defined by a block of instruction words. Each signal channel also includes an internal control unit that is configured to sequentially move the content of the sequential access memory, based on the instruction word currently at the memory output, so that sequences of instruction words are provided at the output row.

Abstract: A lead frame for an integrated electronic device includes a die pad made of a first metallic material. A top coating layer formed by a second metallic material is arranged on a top surface of the die pad. The second metallic material has an oxidation rate lower than the first metallic material. The top coating layer leaves exposed a number of corner portions of the top surface of the die pad. A subsequent heating operation, for example occurring in connection with wirebonding, causes an oxidized layer to form on the corner portions of the top surface of the die pad at a position in contact with the top coating layer.

Abstract: An over-voltage protection circuit and methods of operation are provided. In one embodiment, a method includes monitoring a voltage at an output of a rectifier, a voltage at an output of a voltage regulator, or a combination thereof. The method further includes determining the over-voltage condition based on the monitoring; and in response to determining the over-voltage condition, regulating the voltage at the output of the rectifier in accordance with a voltage difference between the voltage at the output of the rectifier and the voltage at the output of the voltage regulator.

Abstract: A semiconductor substrate includes a buried semiconductor layer and semiconductor wells. A device for detecting a possible thinning of the semiconductor substrate via the rear face thereof is formed on and in the semiconductor wells. The device is a non-inverting buffer including an input terminal and an output terminal, the device being powered between a supply terminal and a reference terminal where the buried semiconductor layer provides the supply terminal. A control circuit delivers an input signal in a first state to the input terminal and outputs a control signal indicating a detection of a thinning of the substrate if a signal generated at the output terminal in response to the input signal is in a second state different from the first state.

Abstract: The present description concerns a device of protection against electrostatic discharges including: at least one first rectifying element including an anode connected to a first terminal and a cathode connected to a first node of the device; at least one second rectifying element including an anode connected to a second node of the device and a cathode connected to the first terminal; and at least one Zener diode or at least one Shockley diode series-connected with a capacitive element between the first and second nodes.

Abstract: A method of performing an authentication process to authenticate an electric motor unit includes establishing, by an external controller, secure encrypted communication with motor electronics of the electric motor unit, and sending, by the external controller, an authentication request to the motor electronics over the secure encrypted communication. The method further includes receiving, by the external controller, an authentication response from the motor electronics, verifying, by the external controller, a motor of the electronic motor unit as an authorized part based on the authentication response, and enabling control of the motor by the external controller only after successful authentication.

Abstract: According to one aspect, a method for recording biometric data of a holder on a card including a microcontroller configured to communicate via a secure communication channel with a remote server comprising an account linked to the card holder, the method comprising: authenticating the holder on an application of a device configured to communicate with said server and said card, then authenticating the server by the card via the secure communication channel by means of the application of said device, then recording the biometric data of the holder by a fingerprint reader of the card controlled by the microcontroller of the card if the server is authenticated by the card.

Abstract: Provided is a time interleaving circuit to mitigate glitches. A first loading stage outputs first data representative of first serialized data. A second loading stage generates second serialized data. The second loading stage receives the first data output by the first loading stage. In response to the first data having a first state, the time interleaving circuit inverts the second serialized data to generate second data representative of the second serialized data. In response to the first data having a second state, the time interleaving circuit outputting the second data without inverting the second serialized data. Exclusive disjunction logic receives the second data and operates on the first data and the second data to generate output data.

Abstract: A packaged semiconductor device includes a substrate having a first surface and a second surface opposite the first surface. At least one semiconductor die is mounted at the first surface of the substrate. Electrically-conductive leads are arranged around the substrate, and electrically-conductive formations couple the at least one semiconductor die to selected leads of the electrically-conductive leads. A package molding material is molded onto the at least one semiconductor die, onto the electrically-conductive leads and onto the electrically-conductive formations. The package molding material leaves the second surface of the substrate uncovered by the package molding material. The substrate is formed by a layer of electrically-insulating material.

Abstract: A semiconductor device includes: a substrate; a transduction microstructure integrated in the substrate; a cap joined to the substrate and having a first face adjacent to the substrate and a second, outer, face; and a channel extending through the cap from the second face to the first face and communicating with the transduction microstructure. A protective membrane made of porous polycrystalline silicon permeable to aeriform substances is set across the channel.

Abstract: Provided is a voltage level shifter that operates in sub-threshold voltages. The level shifter includes a level shifting stage. The level shifting stage receives a first signal from a first voltage domain and outputs a second signal to a second voltage domain. The level shifter includes a first auxiliary stage. In response to the first signal having a first voltage level corresponding to a first logical state and a first node of the level shifting stage having a supply voltage level, the first auxiliary stage sources current to a second node of the level shifting stage. Sourcing the current to the second node accelerates a transition of the first node to a reference voltage. The level shifting stage outputs a second signal to a second voltage domain.

Abstract: An AFSM core includes a destination state-cell generating a destination state-signal, and a source state-cell generating a source state-signal and causing transition of the source state-signal in response to an acknowledgement indicating transition of the destination state-signal. The acknowledgment is communicated through a delay. A state-overlap occurs between transition of the destination state-signal and transition of the source state-signal. An output-net includes a balanced logic-tree receiving inputs, including the destination state-signal, from the core, and an additional logic-tree cascaded with the balanced logic-tree to form an unbalanced logic-tree so an input to the additional logic-tree is provided by output from the balanced logic-tree and another input receives the source state-signal. Tree propagation time occurs between receipt of a transition in the destination state-signal by the balanced logic-tree and a resulting transition of the output from the balanced logic-tree.

Abstract: An integrated circuit (IC) includes: a first functional analog pin or pad; a first analog test bus coupled to the first functional analog pin or pad; first and second analog circuits coupled to the first analog test bus; and a test controller configured to: when the IC is in a functional operating mode, connect an input or output of the first analog circuit to the first analog test bus so that the input or output of the first analog circuit is accessible by the first functional analog pin or pad, and keep disconnected an input or output of the second analog circuit from the first analog test bus, and when the IC is in a test mode, selectively connect the input or output of the first and second analog circuits to the first analog test bus to test the first and second analog circuits using the first analog test bus.

Abstract: The present disclosure relates to a method wherein a random value, generated by a random number generator, is stored, by a finite state machine coupled to the generator by a first dedicated bus, in a memory area of a non-volatile fuse-type memory of an integrated circuit, the memory area being only accessible by the finite state machine.

Abstract: A processor includes a synchronous circuit including a plurality of processing stages, wherein each processing stage includes a selection data bus; and an asynchronous circuit coupled to each selection data bus, wherein the asynchronous circuit includes an asynchronous state machine whose states correspond to a process phase or a plurality of circuits, wherein the asynchronous circuit further includes a selectable delay circuit whose delay is determined by a present state of the asynchronous state machine, and wherein the asynchronous circuit is configured for generating a plurality of processing stage clock signals each having a selectable delay provided by the selectable delay circuit.

Abstract: In an embodiment a system on chip includes at least one master device, at least one slave device, a connection interface configured to route signals between the at least one master device and the at least one slave device, the connection interface configured to operate according to configuration parameters, and a configuration bus connected to the connection interface, wherein the configuration bus is configured to deliver new configuration parameters to the connection interface so as to adapt operation of the connection interface.

Abstract: Disclosed herein is an electronic device including a switched capacitor circuit generating a boosted voltage from a battery voltage and a monolithic transmitter integrated within a single integrated circuit substrate. The monolithic transmitter includes a bridge powered between the boosted voltage and a reference voltage and is operated based upon bridge control signals generated by a digital core within the monolithic transmitter. A tank capacitor and a coil are series connected between output nodes of the bridge. During operation, the monolithic transmitter causes generation of a time-varying magnetic field about the coil, in turn inducing eddy currents in a workpiece disposed within the time-varying magnetic field to thereby heat the workpiece.

Abstract: A first latching circuit has a reset function controlled by a reset signal and configured to latch a logic state in response to a first edge of a clock signal to generate a first output signal. A second latching circuit has a reset function controlled by that reset signal and configured to latch a logic state in response to a second edge of that clock signal to generate a second output signal. The first and second edges are opposite edges. A combinatorial logic circuit logically combines the first and second output signals to generate a logic output signal. A third latching circuit has a reset function controlled by that reset signal and configured to latch the logic output signal in response to the second edge of that clock signal to generate a reset synchronization control signal.