Abstract: Memory devices and methods of manufacturing such devices are provided herein. In at least one embodiment, a memory device includes a plurality of phase-change memory cells. An electrically-insulating layer covers lateral walls of each of the phase-change memory cells, and a thermally-insulating material is disposed on the electrically-insulating layer and covers the lateral walls of the phase-change memory cells.

Abstract: Methods of operating a switching device are provided. The switching device is formed in an interconnect, the interconnect including a plurality of metallization levels, and has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.

Abstract: Unclonable function circuitry includes a plurality of pairs of phase-change memory cells in a virgin state, and sensing circuitry coupled to the plurality of pairs of phase-change memory cells in the virgin state. The sensing circuitry identifies a subset of the plurality of pairs of phase-change memory cells in the virgin state based on a reliability mask. Signs of differences of effective resistance values of the identified subset of the plurality of pairs of phase-change memory cells in the virgin state are sensed by the sensing circuitry. The sensing circuitry generates a string of bits based on the sensed signs of differences in the effective resistance values of the identified subset of the plurality of pairs of phase-change memory cells in the virgin state. Processing circuitry coupled to the unclonable function circuitry, in operation, executes one or more operations using the generated string of bits.

Abstract: The present description concerns a device including phase-change memory cells, each memory cell including a first resistive element in lateral contact with a second element made of a phase-change material.

Abstract: The present disclosure relates to a method for powering an electronic device. The electronic device includes at least one universal integrated circuit card or at least one secure element; at least one power supply circuit for said card or secure element; and at least one near field communication module. When the near field communication module changes from a standby or inactive state to an active state, the following successive operations are performed: —the components and circuits of said electronic device are started; —programs of the electronic device and said secure card or element are started at the same time.

Abstract: The present disclosure relates to a cryptographic method comprising: multiplying a point belonging to a mathematical set with a group structure by a scalar by performing: the division of a scalar into a plurality of groups formed of a same number w of digits, w being greater than or equal to 2; and the execution, by a cryptographic circuit and for each group of digits, of a sequence of operations on point, the sequence of operations being identical for each group of digits, at least one of the operations executed for each of the groups of digits being a dummy operation.

Abstract: In an embodiment a device includes a supply node configured to receive a supply voltage, an output node configured to provide an output voltage, a plurality of switching stages coupled to the supply node and to the output node, a sensing circuit coupled to the supply node and configured to provide at least one sensing signal based on the supply voltage and a driver circuit coupled to the sensing circuit and to the plurality of switching stages, wherein the driver circuit is configured to provide the drive signal based on at least one sensing signal exceeding or failing to exceed at least one reference voltage level and to selectively bypass a selected number of the plurality of switching stages based on the drive signal thereby varying an output voltage level at the output node.

Abstract: The present description concerns an electronic device including: a first input configured to receive a clock signal, coupled by a first input buffer to a first circuit; and at least an output coupled by an output buffer to the first circuit, the output buffer being synchronized on first edges of the clock signal, wherein the first input buffer includes a data input coupled to the first input and is configured to maintain the value on its output constant whatever the value on its data input during a duration following each first edge of the clock signal.

Abstract: A semiconductor region includes an isolating region which delimits a working area of the semiconductor region. A trench is located in the working area and further extends into the isolating region. The trench is filled by an electrically conductive central portion that is insulated from the working area by an isolating enclosure. A cover region is positioned to cover at least a first part of the filled trench, wherein the first part is located in the working area. A dielectric layer is in contact with the filled trench. A metal silicide layer is located at least on the electrically conductive central portion of a second part of the filled trench, wherein the second part is not covered by the cover region.

Abstract: The system on a chip includes at least a first digital domain configured to be reinitialized by a first reinitialization signal, a second digital domain and an interface circuit. The interface circuit includes a starting register in the first digital domain, a destination register in the second digital domain and a synchronization circuit in the first digital domain. The interface circuit is configured to transfer data from the starting register to the destination register upon command of a control signal transmitted by the synchronization circuit. The starting register and the synchronization circuit are configured to not be reinitialized by the first reinitialization signal.

Abstract: An electronic device includes a modulator-demodulator circuit, a first integrated circuit for implementing a first subscriber module; and a second integrated circuit for implementing a second subscriber identification module. A data transmit-receive terminal of the first integrated circuit and a data transmit-receive terminal of the second integrated circuit are connected to a data transmit-receive terminal of the modulator-demodulator circuit. Reset terminals of the modulator-demodulator circuit and the first integrated circuit are connected so that the modulator-demodulator circuit can control deactivation of the first integrated circuit. A reset terminal of the second integrated circuit and an input/output terminal of the first integrated circuit are connected so that the first integrated circuit can control deactivation of the second integrated circuit.

Abstract: A MOS transistor including a substrate, a conductive having lateral walls, drain and source regions, and spacers having an upper surface such that the spacers are buried in the substrate and are position between the conductive gate and the drain and source regions is provided. The spacers are each cuboid-shaped and have a width that is constant along the spacers height and independent from a height of the conductive gate. A device including the MOS transistor and a method of manufacture for producing a right-hand portion and a left-hand portion of a MOS transistor is also provided.

Abstract: Two sets of the DC voltages are determined from among sets of DC voltages. At a first temperature, a first voltage of one of the two sets and a first voltage of the other one of the two sets surround a detection voltage that varies substantially proportionally to temperature. The detection voltage is compared with a second voltage of one of the two sets.

Abstract: Memory devices and methods of manufacturing such devices are provided herein. In at least one embodiment, a memory device includes a plurality of phase-change memory cells. An electrically-insulating layer covers lateral walls of each of the phase-change memory cells, and a thermally-insulating material is disposed on the electrically-insulating layer and covers the lateral walls of the phase-change memory cells.

Abstract: An integrated circuit comprises a memory device including a memory plane having non-volatile memory cells and being non-observable in read mode from outside the memory device, a controller, internal to the memory device, configured to detect the memorized content of the memory plane, and when the memorized content contains locking content, automatically lock any access to the memory plane from outside the memory device, the integrated circuit then being in a locked status, and authorize delivery outside the memory device of at least one sensitive datum stored in the memory plane.

Abstract: Trenches of different depths in an integrated circuit are formed by a process utilizes a dry etch. A first stop layer is formed over first and second zones of the substrate. A second stop layer is formed over the first stop layer in only the second zone. A patterned mask defines the locations where the trenches are to be formed. The dry etch uses the mask to etch in the first zone, in a given time, through the first stop layer and then into the substrate down to a first depth to form a first trench. This etch also, at the same time, etch in the second zone through the second stop layer, and further through the first stop layer, and then into the substrate down to a second depth to form a second trench. The second depth is shallower than the first depth.

Abstract: According to one aspect, a system-on-a-chip is proposed which includes a memory storage, a computation circuit, a comparison circuit, and a validation circuit. The memory storage is configured to store an external software module. The computation circuit is configured to compute several modified software modules from the external software module and compute check values by iteration until obtaining a final check value. Each check value is computed at least from a given modified software module and a check value previously computed, starting with a predefined initial check value. The comparison circuit is configured to compare the final check value to an expected value stored in the system-on-a-chip. The validation circuit is configured to validate the external software module when the final check value is equal to the expected value.

Abstract: Unclonable function circuitry includes a plurality of pairs of phase-change memory cells in a virgin state, and sensing circuitry coupled to the plurality of pairs of phase-change memory cells in the virgin state. The sensing circuitry identifies a subset of the plurality of pairs of phase-change memory cells in the virgin state based on a reliability mask. Signs of differences of effective resistance values of the identified subset of the plurality of pairs of phase-change memory cells in the virgin state are sensed by the sensing circuitry. The sensing circuitry generates a string of bits based on the sensed signs of differences in the effective resistance values of the identified subset of the plurality of pairs of phase-change memory cells in the virgin state. Processing circuitry coupled to the unclonable function circuitry, in operation, executes one or more operations using the generated string of bits.

Abstract: In an embodiment, a voltage converter is configured to operate by a succession of operating cycles, each cycle comprising an energy accumulation phase and an energy restitution phase, wherein the converter is further configured to determine a duration of one of the phases by comparing a voltage ramp and a first reference voltage, and wherein a slope of the voltage ramp depends on a sign of a current in an inductor at an end of a previous operating cycle.

Abstract: A triple-gate MOS transistor is manufactured in a semiconductor substrate including at least one active region laterally surrounded by electrically isolating regions. Trenches are etched on either side of an area of the active region configured to form a channel for the transistor. An electrically isolating layer is deposited on an internal surface of each of the trenches. Each of the trenches is then filled with a semiconductive or electrically conductive material up to an upper surface of the active region so as to form respective vertical gates on opposite sides of the channel. An electrically isolating layer is then deposited on the upper surface of the area of the active region at the channel of the transistor. At least one semiconductive or electrically conductive material then deposited on the electrically isolating layer formed at the upper surface of the active region to form a horizontal gate of the transistor.