Abstract: An encryption method includes accessing a look-up table (LUT) to implement countermeasures against side-channel attacks, such as embedding masks. The LUT is initialized by writing initialization values in the LUT by applying an address-mask to input data that identify a location of said LUT and a data-mask to data to be stored at a location of the LUT. The method includes carrying out an initialization of the LUT that includes providing at least one second address-mask and one second data-mask; and computing corresponding initialization values as a function of a logic combination of the aforesaid first address-mask and second address-mask and of a logic combination of the aforesaid first data-mask and second data-mask. In the resulting table the address data are masked only by the second address-mask and the data are masked only by the second data-mask. The structure of the LUT may allow convenient implementation by initializing all the values of the LUT in parallel in one cycle.

Abstract: An array of Geiger-mode avalanche photodiodes is formed in a die and includes: an internal dielectric structure, arranged on the die; and an external dielectric region arranged on the internal dielectric structure. The external dielectric region is formed by an external material that absorbs radiation having a wavelength that falls in a stop-band with low wavelength and transmits radiation having a wavelength that falls in a pass-band with high wavelength, at least part of the pass-band including wavelengths in the infrared. The internal dielectric structure is formed by one or more internal materials that substantially transmit radiation having a wavelength that falls in the stop-band and in the pass-band and have refractive indices that fall in an interval having an amplitude of 0.4. In the stop-band and in the pass-band the external dielectric region has a refractive index with the real part that falls in the above interval.

Abstract: An integrated circuit is fabricated on a semiconductor material die and adapted to be at least partly tested wirelessly. Circuitry for setting a selected radio communication frequency to be used for the wireless test of the integrated circuit is integrated on the semiconductor material die.

Abstract: A method includes generating a control signal for controlling a switch element, and determining at each switching cycle alternation of an ON interval with storage of energy in the inductor element starting from an input voltage, and an OFF interval with transfer of the energy stored in an inductor element into a storage element on which an output voltage is present. The method includes when the inductor current reaches the first threshold value before the end of a first interval, determining the end of the ON interval at the end of the first interval. The method includes following detection of the ON interval having a duration equal to the first interval, the detection being indicative of a possible short-circuit condition at output, determining the OFF interval having a second duration equal to a lengthened interval longer than the first duration.

Abstract: An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are incorporated. This results in superior thermal conductivity. The spatial orientation of the graphene flakes is controlled, for example by adhering polar molecules to the graphene flakes and exposing the flakes to an external force field, so that the graphene flakes have desired orientations under the integrated circuit chip, alongside of the integrated circuit chip and above the integrated circuit chip.

Abstract: A semiconductor device includes a quadrilateral package with a first pair of opposed sides and a second pair of opposed sides. Both sides of the first pair of opposed sides are provided with electrical contact leads. Only one side of the second pair of opposed sides is provided with electrical contact leads. The side of the second pair of opposed sides without electrical contact leads is a leadless side. That side is not a molded side of the package, but rather is defined by a cut surface.

Abstract: According to an embodiment, an operational amplifier includes a first amplifier stage coupled between an input node and an intermediate node, a second amplifier stage coupled between the intermediate node and an output node, a compensation capacitor having a first terminal coupled to the intermediate node and a second terminal, and a compensation amplifier coupled between the output node and the second terminal. The compensation amplifier has a positive gain greater than one.

Abstract: A device for measuring an electrical impedance of biologic tissue may include electrodes configured to contact the biologic tissue and generate a differential voltage thereon. The device may include a first circuit coupled to the electrodes and configured to force an oscillating input signal therethrough, and a differential amplitude modulation (AM) demodulator coupled to the plurality of electrodes. The differential AM demodulator may be configured to demodulate the differential voltage, and generate a base-band signal representative of the demodulated differential voltage. The device may further include an output circuit downstream from the differential AM demodulator and may be configured to generate an output signal representative of the electrical impedance as a function of the base-band signal.

Abstract: An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.

Abstract: A device voltage shifter includes a first voltage reference node, a second voltage reference node, an output node and a clamp node. A first high-voltage switching transistor of the voltage shifter has a first conduction terminal coupled to the first voltage reference node and a second conduction terminal coupled to the clamp node. A second high-voltage switching transistor of the voltage shifter has a first conduction terminal coupled to the clamp node and a second conduction terminal coupled to the second voltage reference node. A third high-voltage switching transistor of the voltage shifter has a first conduction terminal coupled to the first voltage reference node, a control terminal coupled to the clamp node, and a second conduction terminal coupled to the output node. A voltage regulator of the voltage shifter is coupled between the output node and the clamp node.

Abstract: An IC may include a semiconductor substrate having circuitry formed in the substrate, an interconnect layer above the semiconductor substrate and having an antenna coupled to the circuitry, and a seal ring around a periphery of the interconnect layer. The IC may include an electrically insulating trench extending vertically into the semiconductor substrate and extending laterally across the semiconductor substrate from adjacent one side to adjacent another side.

Abstract: An electronic device may include a transducer configured to generate an electrical output responsive to an input, and a data storage element configured to change state responsive to the transducer. The electronic device may include a power circuit configured to turn on and supply power responsive to the data storage element changing state, and a processing circuit configured to be powered by the power circuit.

Abstract: A buried cavity is formed in a monolithic body to delimit a suspended membrane. A peripheral insulating region defines a supporting frame in the suspended membrane. Trenches extending through the suspended membrane define a rotatable mobile mass carried by the supporting frame. The mobile mass forms an oscillating mass, supporting arms, spring portions, and mobile electrodes that are combfingered to fixed electrodes of the supporting frame. A reflecting region is formed on top of the oscillating mass.

Abstract: A receiver for digital signals includes a radiofrequency stage. A feedback loop controls a variable attenuation resistance applied to a modulated radiofrequency signal passing through the radiofrequency stage as a function of a comparison of an amplitude of the modulated radiofrequency signal with a reference value. A baseband stage includes an RC network cascaded to the radiofrequency stage and coupled to a baseband detector that generates the baseband signal. The feedback loop includes a circuit for detecting a range of variation of the comparison. The value of the variable resistance is controlled as a function of an end value (e.g., maximum or minimum) of the detected range of variation.

Abstract: An oscillating structure with piezoelectric actuation includes first and second torsional elastic elements constrained to respective portions of a fixed supporting body and defining an axis of rotation. A mobile element is positioned between, and connected to, the first and second torsional elastic elements by first and second rigid regions. A first control region is coupled to the first rigid region and includes a first piezoelectric actuator. A second control region is coupled to the second rigid region and includes a second piezoelectric actuator. The first and second piezoelectric actuators are configured to cause local deformation of the first and second control regions to induce a torsion of the first and second torsional elastic elements.

Abstract: An embodiment of an electronic system may be provided so as to have superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in PCBs coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced.

Abstract: A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.

Abstract: Methods of forming micro-electromechanical device include a semiconductor substrate, in which a first microstructure and a second microstructure of reference are integrated. The first microstructure and the second microstructure are arranged in the substrate so as to undergo equal strains as a result of thermal expansions of the substrate. Furthermore, the first microstructure is provided with movable parts and fixed parts with respect to the substrate, while the second microstructure has a shape that is substantially symmetrical to the first microstructure but is fixed with respect to the substrate. By subtracting the changes in electrical characteristics of the second microstructure from those of the first, variations in electrical characteristics of the first microstructure caused by changes in thermal expansion or contraction can be compensated for.

Abstract: A digital representation of a waveform is generated based on signals received during a recording period. The received signals include a digital clock signal providing a determined number of clock pulses during the recording period, a plurality of binary digital signals defining, for each clock pulse of the determined number of clock pulses, a waveform state associated with the clock pulse. A digital representation of the waveform is generated and storing. The waveform has a duration based on the recording period and a profile based on the defined waveform states associated with the clock pulses of the determined number of clock pulses.

Abstract: A driving module of a resonant converter receives an enabling signal and a voltage across a switch of a secondary side, and generates a control signal for first and second switches of the secondary side. The driving module cyclically controls switches of a primary full-bridge switching stage and both switches of the secondary side. After a fixed time, the driving module turns off the low-side switch and turns on the high-side switch, waits for a rising edge of the enabling signal, waits for zero current in the secondary side switches, turns off the first switch via the control signal after a variable delay relative to the rising edge of the enabling signal, keeps the second switch on, waits for zero voltage across the first switch, switches back on the first switch via the control signal when the voltage measured across the first switch drops below a variable threshold.