Abstract: A circuit includes a first pair of transistors connected in parallel between a first node and a second node with a diode-connected transistor coupled to the second node. A second pair of transistors has current terminals connected at a third node. A first and second current sink transistors are connected in a current mirror configuration with the diode-connected transistor and further coupled to the third node. A first differential amplifier has an output coupled to control terminals of the first and third transistors and an input coupled to a further current node of the third transistor. A second differential amplifier has an output coupled to control terminals of the second and fourth transistors and an input coupled to a further current node of the fourth transistor.

Abstract: A completion-detector circuit for detecting completion of the transfer of asynchronous data on a communication channel with signal lines organized according to a delay-insensitive encoding (e.g., dual-rail, m-of-n, Berger encoding) comprises: logic circuitry for detecting the data on the aforesaid signal lines configured for: i) producing a first signal indicating the fact that the asynchronous data on the signal lines are stable; ii) producing a second signal indicating the fact that the signal lines are de-asserted; and an asynchronous finite-state machine supplied with the first signal and the second signal for producing a signal of detection of completion of transfer of the asynchronous data, the detection signal having: a first value, when the first signal is asserted; and a second value, when the second signal is asserted; and being on hold when neither one nor the other of said first signal and said second signal is asserted.

Abstract: A wafer-level package for a MEMS integrated device, envisages: a first body integrating a micromechanical structure; a second body having an active region integrating an electronic circuit, coupled to the micromechanical structure; and a third body defining a covering structure for the first body. The second body defines a base portion of the package and has an inner surface coupled to which is the first body, and an outer surface provided on which are electrical contacts towards the electronic circuit; a routing layer has an inner surface set in contact with the outer surface of the second body and an outer surface that carries electrical contact elements towards the external environment. The third body defines a covering portion for covering the package and is directly coupled to the second body for closing a housing space for the first body.

Abstract: A manual pointing device for a computer system, the device having at least one key that can be actuated manually by a user, a click-event detection module coupled to the key to detect actuation thereof on first, second, and third detection axes via an inertial sensing circuit elastically coupled to a casing with a board, the inertial-sensor circuit structured to be carried on the board so as to oscillate and to rotate about the second detection axis.

Abstract: An integrated circuit on a substrate including at least one peripheral portion that surrounds an active area and is realized close to at least one scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in its peripheral portion on different planes starting from the substrate and realizes an integrated antenna for the circuit.

Abstract: A semiconductor device that includes a semiconductor body, having a front side and a back side opposite to one another in a first direction of extension; a drift region, which extends in the semiconductor body, faces the front side, and has a first type of conductivity and a first value of doping; a body region, which has a second type of conductivity opposite to the first type of conductivity, extends in the drift region, and faces the front side of the semiconductor body; a first control terminal, which extends on the front side of the semiconductor body, at least partially overlapping, in the first direction of extension, the body region; and a second control terminal, which extends to a first depth in the semiconductor body, inside the body region, and is staggered with respect to the first control terminal.

Abstract: An embodiment of a RF identification device is formed by a tag and by a reader. The tag is formed by a processing circuit and a first antenna, which has the function both of transmitting and of receiving data. The reader is formed by a control circuit and by a second antenna, which has the function both of transmitting and of receiving data. The processing circuit is formed by a resonance capacitor, a modulator, a rectifier circuit, a charge-pump circuit and a detection circuit. The antenna of the tag and the processing circuit are integrated in a single structure in completely monolithic form. The first antenna has terminals connected to the input of the rectifier circuit, the output of which is connected to the charge-pump circuit. The charge-pump circuit has an output connected to the detection circuit.

Abstract: An embodiment of a die comprising: a semiconductor body including a front side, a back side, and a lateral surface; an electronic device, formed in said semiconductor body and including an active area facing the front side; a vertical conductive connection, extending through the semiconductor body and defining a conductive path between the front side and the back side of the semiconductor body; and a conductive contact, defining a conductive path on the front side of the semiconductor body, between the active area and the vertical conductive connection, wherein the vertical conductive connection is formed on the lateral surface of the die, outside the active area.

Abstract: An embodiment of a photomultiplier device is formed by a base substrate of insulating organic material forming a plurality of conductive paths and carrying a plurality of chips of semiconductor material. Each chip integrates a plurality of photon detecting elements, such as Geiger-mode avalanche diodes, and is bonded on a first side of the base substrate. Couplings for photon-counting and image-reconstruction units are formed on a second side of the base substrate. The first side of the base substrate is covered with a transparent encapsulating layer of silicone resin, which, together with the base substrate, bestows stiffness on the photomultiplier device, preventing warpage, and covers and protects the chips.

Abstract: A modulated digital input signal is passed through a conditioning circuit to generate a first input signal. An error amplifier circuit receives the first input signal and a second input signal, and controls the operation of a MOS transistor to generate an output signal that is current modulated. The output signal is sensed to generate a feedback signal. A switching circuit selectively applies the feedback signal as the second input signal in response to a transition of the modulated digital input signal from a first logic state to a second logic state. The switching circuit alternatively selectively applies a fixed reference signal as the second input signal to the error amplifier in response to a transition of the modulated digital input signal from the second logic state to the first logic state.

Abstract: An electronic device includes a chip with an integrated electronic component and a terminal made of a first metal material. The device further includes a lead made of a second metal material different from the first metal material. A bonding wire made of a selected one of the first and second metal materials has opposite ends coupled with the terminal and the lead. An interface element having a first layer made of a selected one of the first and second metal materials and a second layer made of an unselected one of the first and second metal materials has the first layer coupled with the bonding wire and the second layer coupled with a component, wherein the component is ether the terminal or the lead.

Abstract: A battery charger which includes an input supply terminal configured to receive a supply signal, a battery terminal configured to be connected to a battery, at least one output terminal and an electrical path between the battery terminal and the output terminal, at least one device for the detection of one alarm condition of the battery or the battery charger. The battery charger includes circuitry configured to enable the at least one detection device at timing intervals when the battery supplies the at least one output terminal.

Abstract: In an embodiment, a first individual image and a second individual image constituting an encoded stereoscopic image, for example in JPEG format with respective levels of encoding quality and united in a multiple-image file, for example of the Multiple-Picture Object (MPO) type. The second level of encoding quality is lower than the first level of encoding quality. During decoding, the first individual image encoded with a first level of encoding quality and the second individual image encoded with a second level of encoding quality lower than the first level of encoding quality are extracted from the multiple-image file, then using information of the first extracted individual image for enhancing the second extracted individual image.

Abstract: A fluidic cartridge for detecting chemicals, formed by a casing, hermetically housing an integrated device having a plurality of detecting regions to bind with target chemicals; part of a supporting element, bearing the integrated device; a reaction chamber, facing the detecting regions; a sample feeding hole and a washing feeding hole, self-sealingly closed; fluidic paths, which connect the sample feeding and washing feeding holes to the reaction chamber; and a waste reservoir, which may be fluidically connected to the reaction chamber by valve elements that may be controlled from outside. The integrated device is moreover connected to an interface unit carried by the supporting element, electrically connected to the integrated device and including at least one signal processing stage and external contact regions.

Abstract: A semiconductor integrated device is provided with: a die having a body of semiconductor material with a front surface, and an active area arranged at the front surface; and a package having a support element carrying the die at a back surface of the body, and a coating material covering the die. The body includes a mechanical decoupling region, which mechanically decouples the active area from mechanical stresses induced by the package; the mechanical decoupling region is a trench arrangement within the body, which releases the active area from an external frame of the body, designed to absorb the mechanical stresses induced by the package.

Abstract: A testing apparatus includes a tester and a probe card system that includes a probe card connected to the tester, and an active interposer connected to the probe card and wirelessly coupled with a device to be tested. The active interposer includes pads positioned on its free surface facing the device. The pads are positioned with respect to pads of the device so that each pad of the active interposer faces a pad of the device and is separated therefrom by a dielectric. Each pair of facing pads forms an elementary wireless coupling element which allows a wireless transmission between the active interposer and the device. The active interposer also includes an amplifier circuit configured to amplify wireless signals from the device before forwarding them to the tester. The probe card system includes a transmission element able to transmit a power voltage from the tester to the device.

Abstract: An electronic device includes an electronic component having terminals including a set of first terminals and a set of second terminals, a protective package embedding the electronic component, leads exposed from the protective package including a set of first leads and a set of second leads, for each first lead a first electrical connection inside the protection package between the first lead and a corresponding one of the first terminals, and for each second lead electrical connections inside the protective package each one between the second lead and a corresponding one of the second terminals. For each second lead the electronic component includes test structures, each being coupled between a corresponding one of the second terminals connected to the second lead and a corresponding test one of the first terminals connected to a test one of the first leads.

Abstract: The present disclosure is directed to a microfluidic die having a substrate with an inlet path that is configured to move fluid into the die. The die includes a plurality of heaters formed above the substrate, each heater having a first area, a plurality of chambers formed above the plurality of heaters, and a plurality of nozzles formed above the chambers. Each nozzle having an entrance adjacent to the chamber and an exit adjacent to en external environment, the entrance having a second area, and the second having a third area, the first area being greater than the second area, and the second area being greater than the third area. A ratio of the first area to the third area being greater than 5 to 1.

Abstract: Indexing a plurality of die obtainable from a material wafer comprising a plurality of stacked material layers. Each die is obtained in a respective position of the wafer. A manufacturing stage comprises at least two steps for treating a respective superficial portion of the material wafer that corresponds to a subset of said plurality of dies using the at least one lithographic mask through the exposition to the proper radiation in temporal succession. The method may include providing a die index on each die which is indicative of the position of the respective die by forming an external index indicative of the position of the superficial portion of the material wafer corresponding to the subset of the plurality of dies including said die and may comprise a plurality of electronic components electrically coupled to each other by means of a respective common control line.

Abstract: A method includes providing at least one target bandwidth for bandwidth usage on an interconnect, the target bandwidth being for traffic associated with a traffic initiator. The method also includes measuring a served bandwidth and resetting the measuring of served bandwidth in response to an occurrence of an event.