Abstract: A sensing structure for use in testing integrated circuits on a substrate. The sensing structure includes at least two sensing regions connectable to a probe and at least one first sensing element. Each of the at least one first sensing elements is directly connected to two sensing regions such that for each sensing region a different value of an electrical parameter is measurable between the sensing region and a first reference potential so as to reliably determine a drift direction of a probe.

Abstract: A MOS transistor includes a semiconductor layer with a drain region and a body region. A first insulating layer is disposed over the semiconductor layer, a gate-precursor layer is disposed over the first insulating layer, a second insulating layer disposed over the first insulating layer and a third insulating layer disposed over the second insulating layer. A source opening extends through the third insulating layer, the second insulating layer, the gate-precursor layer, and the first insulating layer. An implant through the source opening forms a source-precursor region in the semiconductor layer. The source opening is then lined and an body contact opening is made through the liner, the source-precursor region and into the body region. An implant through the body contact opening forms the body contact region below the source-precursor. The body contact opening is then filled with a metal.

Abstract: An electronic system to discharge a transformer in case of a failure during a charging phase of the transformer. The system includes the transformer having a primary winding with a first terminal connected to a battery voltage and with a second terminal for generating a primary voltage signal, includes a switch serially connected to the primary winding and having a control terminal carrying a control voltage signal for opening or closing the switch and includes an electronic circuit. The electronic circuit further includes a current generator and a voltage clamping.

Abstract: Disclosed embodiments are directed to methods, systems, and circuits of generating compact descriptors for transmission over a communications network. A method according to one embodiment includes receiving an uncompressed descriptor, performing zero-thresholding on the uncompressed descriptor to generate a zero-threshold-delimited descriptor, quantizing the zero-threshold-delimited descriptor to generate a quantized descriptor, and coding the quantized descriptor to generate a compact descriptor for transmission over a communications network. The uncompressed and compact descriptors may be 3D descriptors, such as where the uncompressed descriptor is a SHOT descriptor. The operation of coding can be ZeroFlag coding, ExpGolomb coding, or Arithmetic coding, for example.

Abstract: Capacitance sensing circuits and methods are provided. The capacitance sensing circuit includes a capacitance-to-voltage converter configured to receive a signal from a capacitance to be sensed and to provide an output signal representative of the capacitance, an output chopper configured to convert the output signal of the capacitance-to-voltage converter to a sensed voltage representative of the capacitance to be sensed, an analog accumulator configured to accumulate sensed voltages during an accumulation period of NA sensing cycles and to provide an accumulated analog value, an amplifier configured to amplify the accumulated analog value, and an analog-to-digital converter configured to convert the amplified accumulated analog value to a digital value representative of the capacitance to be sensed. The analog accumulator may include a low pass filter having a frequency response to filter wideband noise.

Abstract: An embodiment is directed to extended test coverage of complex multi-clock-domain integrated circuits without forgoing a structured and repeatable standard approach, thus avoiding custom solutions and freeing the designer to implement his RTL code, respecting only generally few mandatory rules identified by the DFT engineer. Such an embodiment is achieved by introducing in the test circuit an embodiment of an additional functional logic circuit block, named “inter-domain on chip clock controller” (icOCC), interfaced with every suitably adapted clock-gating circuit (OCC), of the different clock domains. The icOCC actuates synchronization among the different OCCs that source the test clock signals coming from an external ATE or ATPG tool and from internal at-speed test clock generators to the respective circuitries of the distinct clock domains. Scan structures like the OCCs, scan chain, etc., may be instantiated at gate pre-scan level, with low impact onto the functional RTL code written by the designer.

Abstract: A solid state memory including a processor and a method for protecting the digital contents of the solid state memory. The microprocessor inserts at least an interruption during a copying or a reading of the digital contents and proceeds with the copying or reading only subsequent to a verification of a PIN or other user action. In particular, the verification provides control to ensure that the PIN is inserted manually. Access may be prevented if a time elapsed between the interruption and inputting of a PIN is shorter than a threshold time representing a speed of manual input, or if the PIN does not correspond to a sequence of requests for access to selectable files, which may be virtual files. The interruption may comprise substituting altered or cryptographic data if verification fails, or reproduction of an audio or visual message to be understood by the user.

Abstract: A multi-pixel photodetector array may include a semiconductor substrate having a back side and a front side, Geiger mode avalanche photodiodes (GM-APDs) on the semiconductor substrate, each including an anode contact, and a common cathode for the GM-APDs and having a first connection lead on the backside of the semiconductor substrate. The multi-pixel photodetector array may include a second connection lead, and a common anode on the front side of the semiconductor substrate and configured to couple in common the anode contacts of the GM-APDs to the second connection lead. Each GM-APD may be configured to generate, when a photon impinges thereon, a current pulse of different shape for discrimination by an external circuit connected to the common cathode and the common anode.

Abstract: An electronic system includes an electronic device of through-hole mounting type comprising an insulating body for embedding at least a chip on which electronic components are integrated, a plurality of conductive leads projecting from the insulating body for said mounting, and a dissipation plate exposed from the insulating body for transferring heat from said electronic component in operation towards the outside of the insulating body. The electronic system includes a heat sink in contact with said dissipation plate for dissipating said heat. The heat sink comprises a first dissipation element, a second dissipation element, and clamping means for clamping the first dissipation element and the second dissipation element together against the insulating body of said electronic device.

Abstract: QCA assemblies, in which basic cells are formed on the basis of graphene in order to provide a coupling field distribution in the form of an electrostatic field, a magnetic field, and the like which allows a unique association between field distribution and logic state. Moreover, the corresponding energy structure may be selected so as to allow operation of the QCA assemblies at ambient temperature. Hence, the signal processing capabilities of QCA assemblies may be obtained at significantly reduced complexity compared to conventional quantum-based QCA assemblies, which typically operate at very low temperatures.

Abstract: A power supply circuit for an electrical appliance, including a turning-on stage configured for determining a transition from a turned-off state, in which the power supply circuit is off and does not supply electric power, to a turned-on state of the power supply circuit. The turning-on stage includes a transducer of the remote-control type configured for triggering the transition in response to the reception of a wireless signal. In some embodiments, operating power is transmitted from a remote controller to a control circuit of the electronic equipment, such that the electronic equipment can be turned on remotely but draws zero standby power.

Abstract: An energy harvesting interface receives an electrical signal from an inductive transducer and supplies a supply signal. The interface includes an input branch with a first switch and a second switch connected together in series between a first input terminal and an output terminal. The interface further includes a third switch and a fourth switch connected together in series between a second input terminal and the output terminal. A first electrical-signal-detecting device, coupled across the second switch, detects a first threshold value of an electric storage current in the inductor of the transducer. A second electrical-signal-detecting device, coupled across the fourth switch, detects whether the electric supply current that flows through the fourth switch reaches a second threshold value lower than the first threshold value. The second threshold is derived from the electric storage current.

Abstract: An electronic device includes an integrated circuit chip mounted to a heat slug. The heat slug has a peripheral region having first thickness along a first direction, the peripheral region surrounding a recess region (having a second, smaller, thickness along the first direction) that defines a chip mounting surface along a second direction perpendicular to the first direction. The recess region defines side borders and a nook extends into the heat slug along the side borders. An insulating body embeds the integrated circuit one chip and heat slug. Material of the insulating body fills the nook.

Abstract: A high voltage comparison circuit includes an input stage generating an intermediate signal as a result of a comparison between an input signal and a first voltage reference and an output stage configured to generate an output signal referenced to a second voltage reference (different from the first voltage reference) in response to the intermediate signal.

Abstract: An embodiment of an electronic communications device, including: a body of semiconductor material defining at least one integrated electronic circuit and having a top surface; an electromagnetic shield; a radiant element; and a capacitive element formed by a first electrode and a second electrode, the radiant element being set on the top surface and being ohmically coupled to the first electrode and the second electrode by means of a first connection element and a second connection element, respectively, the electromagnetic shield being set between the radiant element and the top surface and forming at least the second electrode.

Abstract: A failure diagnosis circuit includes a multiplexer and a controller. The multiplexer receives address signals, and selectively outputs one of the address signals to an addressable module in response to a selecting signal. The controller generates a first one of address signals and the selecting signal. A built-in self-test circuit generates the second address signal. The addressable module includes addressable components responsive to the address signal. The controller processes the output of the addressable module responsive to the address signal to make a failure diagnosis. The built-in self-test circuit performs signature analysis on the read out output of the addressable module.

Abstract: A die has a positional location in a wafer defined by first and second coordinates, the first and second coordinates identifying a respective horizontal and vertical location where the die was formed. An index formed on the die has a first comb structure of a first contiguous arrangement of first dots, and a second comb structure of a second contiguous arrangement of second dots. A first marker at a selected one of the first dots indicates a first digit of the first coordinate, and a first additional marker at a selected one of the first dots indicates a second digit of the first coordinate. A second marker at a selected one of the second dots indicates a first digit of the second coordinate, and a second additional marker at a selected one of the second dots indicates a second digit of the second coordinate.

Abstract: A power supply apparatus includes a power supply circuit and a power-on circuit. The power-on circuit detects a remotely transmitted control signal and causes a transition of the power supply circuit to a turned on state. The power-on circuit includes a transducer configured to provide a power-on signal in response to the remote control signal. The transducer triggers transition to the turned on state through a switch driven by the power-on signal output from the transducer and arranged to supply a power supply circuit enable signal. A DC blocking capacitor is connected between an output of the transducer and a control terminal of the switch.

Abstract: An embodiment of a consumer electronics product having a thumbnail display feature includes a system for generating and storing thumbnails having a given size from images, such as JPEG images, for which a spatial frequency domain representation is available. The system includes a zooming processor to reduce the size of the images by zooming. The zooming processor is configured to perform both spatial frequency domain zooming to approximate the desired thumbnail size and then image pixel domain zooming to fit the desired thumbnail size. The product includes cache storage configured to store a plurality of thumbnails in a file system as free blocks in the file system, so that file system data structures are left unchanged.

Abstract: An embodiment of a process for realizing a system for recovering heat is described, the process comprising the steps of: formation on a substrate of a plurality of L-shaped down metal structures; deposition of a dielectric layer on the substrate and the plurality of L-shaped down metal structures by using a screen printing approach; definition and opening in the dielectric layer of upper contacts and lower contacts of the L-shaped down metal structures; formation of a plurality of L-shaped up metal structures being connected to the plurality of L-shaped down metal structure in correspondence of the upper and lower contacts so as to form a plurality of serially connected thermocouples, each comprising at least one L-shaped down metal structure and at least one L-shaped up metal structure, being made of different metal materials and interconnected at a junction, the serially connected thermocouples thus realizing the system for recovering heat.