Abstract: A radio-frequency receiver includes built-in-self-test (BIST) circuitry which generates a self-test signal. A local oscillator signal is divided. A self-test oscillation signal is generated, based, at least in part, on the frequency-divided local oscillation signal. The self-test signal is generated based on the self-test oscillation signal. The BIST circuitry includes a divider, which divides the self-test oscillation signal. The frequency-divided local oscillation signal and the divided self-test oscillation signal are used to perform one or more of generating the self-test oscillation signal and controlling the generation of the self-test oscillation signal. The radio-frequency receiver may be an automotive radar receiver.

Abstract: A current mirror includes first and second transistors having current paths coupled to an input current line. The current paths for the first and second transistors are referenced to ground via respective first and second resistors having resistance values twice a first resistance value. The first transistor is diode connected. A third transistor has a current path coupled to an output current line and referenced to ground via a third resistor having a second resistance value equal to the first resistance value divided by a mirror factor. Control terminals of the first and third transistors are coupled together, and further coupled to a control terminal of the second transistor through a coupling resistor. A first capacitor is coupled between ground and the control terminal of the second transistor unit. A second capacitor is coupled between ground and the current path through the third transistor.

Abstract: One or more embodiments are directed to zero-rate level compensation systems. One such system includes stationary detection circuitry that receives gyroscope signals output by a gyroscope and determines whether the gyroscope is stationary based on the gyroscope signals. The stationary detection circuitry generates a stationary gyroscope signal indicating the gyroscope is stationary based on a determination that the gyroscope is stationary. A temperature sensor senses temperature and outputs temperature signals. Zero-rate level estimation circuitry receives the stationary gyroscope signal and a temperature signal associated with the stationary gyroscope signal, and iteratively estimates one or more zero-rate level compensation parameters based on the stationary gyroscope signal and the temperature signal.

Abstract: A circuit includes a switching circuit including a first switch and a second switch. A current sensing circuit is coupled to the switching circuit to sense a first current through the first switch and to generate a first sensed current signal based on the sensed first current, and configured to sense a second current through the second switch and to generate a second sensed current signal based on the sensed second current. An output circuit is coupled to the current sensing circuit and is configured to generate a failure signal based on the first sensed current signal and the second sensed current signal.

Abstract: A semiconductor device comprises: a lead-frame comprising a die pad having at least one electrically conductive die pad area an insulating layer applied onto the electrically conductive die pad area. An electrically conductive layer is applied onto the insulating layer with one or more semiconductor dice coupled, for instance adhesively, to the electrically conductive layer. The electrically conductive die pad area, the electrically conductive layer and the insulating layer sandwiched therebetween form at least one capacitor integrated in the device. The electrically conductive die pad area comprises a sculptured structure with valleys and peaks therein; the electrically conductive layer comprises electrically conductive filling material extending into the valleys in the sculptured structure of the electrically conductive die pad area.

Abstract: A charge recovery driver is for a pair of loads, and includes first and second output nodes coupled to a pair of loads. During an initial phase, the first output node is grounded and the second output node is tied to the supply voltage. During a first phase, the first output node is coupled to the first tank capacitor and the second output node is coupled to the second tank capacitor. During a second phase, the first and second output nodes are coupled to one another. During a third phase, the second output node is coupled to the first tank capacitor and the first output node is coupled to the second tank capacitor. During a fourth phase, the first output node is coupled to the supply voltage and the second output node is coupled to ground. The third, second, and first phases are then repeated in that order.

Abstract: A radiofrequency-powered device such as a wireless passive sensor node, for instance, comprises a radiofrequency energy harvesting circuit configured to be coupled to an antenna to harvest radiofrequency energy captured by the antenna from a radiofrequency signal. The radiofrequency energy harvesting circuit is configured to be coupled to an energy storage component to store therein energy harvested via the radiofrequency energy harvesting circuit. The device comprises user circuitry configured to be supplied with energy harvested via the radiofrequency energy harvesting circuit and to operate in accordance with one of a plurality of configurations as a function of configuration data supplied thereto. A receiver circuit coupled to the radiofrequency energy harvesting circuit is configured to receive a configuration data signal modulating the radiofrequency signal and supply to the user circuitry configuration data extracted from the configuration data signal received.

Abstract: A semiconductor chip is mounted on a leadframe. A first portion of an insulating package for the semiconductor chip is formed from laser direct structuring (LDS) material molded onto the semiconductor chip. A conductive formation (provided by laser-drilling the LDS material and plating) extends between the outer surface of the first portion of insulating package and the semiconductor chip. An electrically conductive clip is applied onto the outer surface of the first portion of the insulating package, with the electrically conductive clip electrically coupled to the conductive formation and the leadframe. A second portion of the insulating package is made from package molding material (epoxy compound) molded onto the electrically conductive clip and applied onto the outer surface of the first portion of the insulating package.

Abstract: A multi-phase electric motor includes a stator winding. The multi-phase electric motor is controlled by regulating a current flowing in the multi-phase electric motor in response to an applied voltage. An overload condition of the multi-phase electric motor is detected by monitoring a thermal increase of the value of a stator resistance of the stator winding of the multi-phase electric motor during a steady state condition of said multi-phase electric motor in which the current flowing in the motor has constant phase, and the motor is operating at constant load with constant speed.

Abstract: An HEMT device of a normally-on type, comprising a heterostructure; a dielectric layer extending over the heterostructure; and a gate electrode extending right through the dielectric layer. The gate electrode is a stack, which includes: a protection layer, which is made of a metal nitride with stuffed grain boundaries and extends over the heterostructure, and a first metal layer, which extends over the protection layer and is completely separated from the heterostructure by said protection layer.

Abstract: A variable duty cycle switching signal at a switching frequency is applied to a switching current regulation circuit arrangement energizing a current storage circuit assembly. Switching of the variable duty cycle switching signal is controlled by an upper and a lower threshold current level. The upper and lower threshold current levels vary with time following an average current value time variation. Additionally, frequency jitter is introduced in the variable duty cycle switching signal by: defining at least a frequency modulation window around a limit frequency identifying a limit value for an acceptable EMI; and applying an amplitude modulation of the upper and/or lower threshold current levels varying with time, wherein the amplitude modulation is applied in a time interval between times when the switching frequency enters and exit the frequency window.

Abstract: A converter circuit includes a half-bridge power circuit with a first and a second switch between an input node and a current node and between the current node ground, respectively. An inductor is coupled between the current node and an output node. Logic control circuitry is configured to switch the first and second switches to a current recirculation state and to a current charge state. The logic circuitry is configured to switch the switches from the current recirculation state to the current charge state as a result of a voltage indicator signal from an output voltage comparator being asserted while starting an on-time counter signal having an expiration value, and from the current charge state to the current recirculation state as a result of the on-time counter signal having reached its expiration value in combination with the voltage indicator signal from the voltage comparator being de-asserted.

Abstract: An ambient temperature sensor is provided that may be coupled to a PCB. The ambient temperature sensor includes a package including a first cap and an insulating structure. The insulating structure is formed of thermally insulating material, and the first cap and the insulating structure delimit a first cavity. A semiconductor device is included and generates an electrical signal indicative of a temperature. The semiconductor device is fixed on top of the insulating structure and arranged within the first cavity. The package may be coupled to the PCB so that the insulating structure is interposed between the semiconductor device and the PCB. The insulating structure delimits a second cavity, which extends below the semiconductor device and is open laterally.

Abstract: A method for presence detection in an environment to be monitored, includes generating an electric charge signal in a condition of absence of presence in the environment to be monitored. An electric charge signal is generated in an operating condition in which a person may be present in the environment. The two generated signals are processed and the results of the processing are compared. Processing the signals includes representing in a biaxial reference system the value of the charge signal considered and its derivative with respect to time, and identifying a plurality of points in the reference system. By comparing the position of the points acquired during the possible human presence with those of the base shape, a variation indicating the actual human presence may be detected. In this case an alarm signal is generated.

Abstract: A drive circuit for airbag systems, for instance includes a differential transconductance amplifier having a first input node, a second input node, an output node coupled to the second input node via a feedback line; a transistor coupled between a drive node and a supply node configured to be coupled to a power supply source; a control node coupled to the control electrode of the transistor and the output node; a Zener diode arrangement having cathode and anode terminals coupled to the supply node and the first input node, respectively; a pull-up component arranged in parallel with the Zener diode arrangement; and an enable switch coupled to the first input node and referred to ground and switchable between a conductive state and a non-conductive state with the differential transconductance amplifier providing controlled current discharging/charging of the control node to make the transistor conductive/non-conductive, respectively.

Abstract: A microelectromechanical transducer includes a semiconductor body having first and second surfaces opposite to one another. A plurality of trenches extend in the semiconductor body from the first surface towards the second surface, including a first pair of trenches having a respective main direction of extension along a first axis, and a second pair of trenches having a respective main direction of extension along a second axis orthogonal to the first axis. A first piezoresistive sensor and a second piezoresistive sensor extend at the first surface of the semiconductor body respectively arranged between the first and second pair of trenches. The first piezoresistive sensor, the second piezoresistive sensor and the plurality of trenches form an active region. A first structural body is mechanically coupled to the first surface of the semiconductor body to form a first sealed cavity which encloses the active region.

Abstract: A circuit includes a first voltage divider coupled between an output node and a ground voltage, and a second voltage divider coupled between the output node and a modulation node. The first voltage divider includes the modulation node. The modulation node is configured to receive a pulse width modulation (PWM) modulated control signal having an open drain configuration. The modulation node is switchable by the PWM modulated control signal between a floating state and a grounded state. The modulation node experiences a high impedance with respect to a ground connection while in the floating state and experiences a low impedance with respect to the ground connection while in the grounded state.

Abstract: A micromechanical mirror structure includes a mirror element designed to reflect an incident light radiation and a protective structure arranged over the mirror element to provide mechanical protection for the mirror element and to increase the reflectivity of the mirror element with respect to the incident light radiation. The protective structure has a first protective layer and a second protective layer which are stacked on the mirror element. The second protective layer is arranged on the first protective layer and the first protective layer is arranged on the mirror element. The layers include a respective dielectric material and having respective refractive indexes that jointly increase the reflectivity of the mirror element in a range of wavelengths of interest.

Abstract: A device for detecting a chemical species, including a Geiger-mode avalanche diode, which includes a body of semiconductor material delimited by a front surface. The semiconductor body includes: a cathode region having a first type of conductivity, which forms the front surface; and an anode region having a second type of conductivity, which extends in the cathode region starting from the front surface. The detection device further includes: a sensitive structure arranged on the anode region and including at least one sensitive region, which has an electrical permittivity that depends upon the concentration of the chemical species; and a resistive region, arranged on the sensitive structure and electrically coupled to the anode region.

Abstract: Disclosed herein is a method, including attaching a semiconductor chip to a chip mounting portion on at least one leadframe portion, and attaching a passive component on a passive component mounting portion of the at least one leadframe portion. The method further includes forming a laser direct structuring (LDS) activatable molding material over the semiconductor chip, passive component, and the at least one leadframe portion. Desired patterns of structured areas are formed within the LDS activatable molding material by activating the LDS activatable molding material. The desired patterns of structured areas are metallized to form conductive areas within the LDS activatable molding material to thereby form electrical connection between the semiconductor chip and the passive component. A passivation layer is formed on the LDS activatable molding material.