Patents Assigned to STMicroelectronics S.r.l.
  • CONTROL CIRCUIT FOR A FLYBACK CONVERTER, RELATED INTEGRATED CIRCUIT, ELECTRONIC FLYBACK CONVERTER AND METHOD
    Publication number: 20210257914
    Abstract: A control circuit for a driving an electronic switch associated with a switching node of a flyback converter includes a comparison circuit configured to generate a switch-off signal by comparing a current measurement signal with a current measurement threshold signal. A valley detection circuit is configured to generate a trigger in a trigger signal when a valley signal indicates a valley in a voltage at the switching node of the flyback converter, and a blanking circuit is configured to generate a switch-on signal by combining the trigger signal with a timer signal provide by a timer circuit. The timer signal indicates whether a blanking time-interval has elapsed.
    Type: Application
    Filed: February 11, 2021
    Publication date: August 19, 2021
    Applicant: STMicroelectronics S.r.l.
    Inventor: Fabio CACCIOTTO
  • Anti-aging architecture for power MOSFET device
    Patent number: 11094807
    Abstract: A power MOS stage includes a first power MOS device and a second power MOS devices connected in parallel between a first node and a second node, the first power MOS device having a first voltage rating and the second power MOS device having a second voltage rating that is lower than the first voltage rating. A driver circuit is configured to drive control nodes of the first and second power MOS devices in a sequential manner when actuating the power MOS stage by actuating the first power MOS device before actuating the second power MOS device. The control nodes of the first and second power MOS devices are further driven in a sequential manner when deactuating the power MOS stage by deactuating the second power MOS device before deactuating the first power MOS device.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: August 17, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventors: Alberto Cattani, Alessandro Gasparini
  • Time measurement circuit, system having a PWM signal generator circuit and a time measurement circuit, and corresponding integrated circuit
    Patent number: 11095291
    Abstract: A time measurement includes a multiphase clock generator and a phase sampling circuit. The multiphase clock generator generates a sequence of a given number n of phase shifted clock phases, wherein one of the phase shifted clock phases represents a reference clock signal. The phase sampling circuit is configured to generate a phase value indicative of a number of fractions 1/n of the clock period of the clock phases elapsed between an edge of the reference clock signal and an instant when an asynchronous event signal is set. The phase sampling circuit includes first through fourth sub-circuits, which respectively generate or determine first through fourth control signals.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: August 17, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventor: Domenico Tripodi
  • Hardware secure element, related processing system, integrated circuit, device and method
    Patent number: 11093658
    Abstract: A hardware secure element includes a processing unit and a receiver circuit configured to receive data comprising a command field and a parameter field adapted to contain a plurality of parameters. The hardware secure element also includes at least one hardware parameter check module configured to receive at an input a parameter to be processed selected from the plurality of parameters, and to process the parameter to be processed to verify whether the parameter has given characteristics. The hardware parameter check module has associated one or more look-up tables configured to receive at an input the command field and a parameter index identifying the parameter to be processed by the hardware parameter check module, and to determine for the command field and the parameter index a configuration data element.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: August 17, 2021
    Assignees: STMicroelectronics S.r.l., STMicroelectronics Application GMBH
    Inventors: Roberto Colombo, Nicolas Bernard Grossier, Giovanni Disirio
  • Amplification interface, and corresponding measurement system and method for calibrating an amplification interface
    Patent number: 11095261
    Abstract: An amplification interface includes a drain of a first FET connected to a first node, a drain of a second FET connected to a second node, and sources of the first and second FETs connected to a third node. First and second bias-current generators are connected to the first and second nodes. A third FET is connected between the third node and a reference voltage. A regulation circuit drives the gate of the third FET to regulate the common mode of the voltage at the first node and the voltage at the second node to a desired value. A current generator applies a correction current to the first and/or second node. A differential current integrator has a first and second inputs connected to the second and first nodes. The integrator supplies a voltage representing the integral of the difference between the currents received at the second and first inputs.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: August 17, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventors: Calogero Marco Ippolito, Michele Vaiana, Angelo Recchia
  • HIGH VOLTAGE STARTUP BOOSTER
    Publication number: 20210249953
    Abstract: An electronic device includes a circuit board that manages supply of electricity to the electronic device. The circuit board includes an integrated circuit and an external capacitor coupled to a supply terminal of the circuit board. During a startup operation of the integrated circuit, the integrated circuit supplies a first charging current to charge the capacitor to a supply voltage value. The circuit board includes a boost circuit that receives a portion of the first charging current and outputs a second charging current that augments charging of the capacitor. The second charging current is an amplification of the first charging current. The integrated circuit enables operation of the electronic device after the capacitor is charged to the supply voltage value.
    Type: Application
    Filed: April 29, 2021
    Publication date: August 12, 2021
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Alberto BIANCO, Giuseppe SCAPPATURA, Francesco CIAPPA
  • SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION
    Publication number: 20210249337
    Abstract: One or more embodiments are directed to quad flat no-lead (QFN) semiconductor packages, devices, and methods in which one or more electrical components are positioned between a die pad of a QFN leadframe and a semiconductor die. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and at least one electrical component that has a first contact on the die pad and a second contact on the lead. A semiconductor die is positioned on the at least one electrical component and is spaced apart from the die pad by the at least one electrical component. The device further includes at least one conductive wire, or wire bond, that electrically couples the at least one lead to the semiconductor die.
    Type: Application
    Filed: April 29, 2021
    Publication date: August 12, 2021
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Cristina SOMMA, Fulvio Vittorio FONTANA
  • MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE WITH EFFICIENT EDGE STRUCTURE
    Publication number: 20210249268
    Abstract: A manufacturing method of an electronic device includes: forming a drift layer of an N type; forming a trench in the drift layer; forming an edge-termination structure alongside the trench by implanting dopant species of a P type; and forming a depression region between the trench and the edge-termination structure by digging the drift layer. The steps of forming the depression region and the trench are carried out at the same time. The step of forming the depression region comprises patterning the drift layer to form a structural connection with the edge-termination structure having a first slope, and the step of forming the trench comprises etching the drift layer to define side walls of the trench, which have a second slope steeper than the first slope.
    Type: Application
    Filed: April 29, 2021
    Publication date: August 12, 2021
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Edoardo ZANETTI, Simone RASCUNA', Mario Giuseppe SAGGIO, Alfio GUARNERA, Leonardo FRAGAPANE, Cristina TRINGALI
  • Methods of forming and using fluid ejection devices and printheads
    Patent number: 11084283
    Abstract: Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: August 10, 2021
    Assignees: STMICROELECTRONICS S.R.L., STMICROELECTRONICS, INC.
    Inventors: Domenico Giusti, Marco Ferrera, Carlo Luigi Prelini, Simon Dodd
  • Microelectromechanical device having a structure tiltable through an actuation of the piezoelectric type
    Patent number: 11086122
    Abstract: A microelectromechanical device includes a body of semiconductor material, which forms a cavity, a mobile structure, and an actuation structure. The actuation structure includes at least one first deformable element which faces the cavity and is mechanically coupled to the body and to the mobile structure, and a piezoelectric-actuation system which can be controlled so as to deform the first deformable element and cause a consequent rotation of the mobile structure. The mobile structure includes a supporting region and at least one first pillar region, the first pillar region being mechanically coupled to the first deformable element, the supporting region being set on the first pillar region and overlying at least part of the first deformable element.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: August 10, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventors: Roberto Carminati, Massimiliano Merli, Nicolo′ Boni
  • Microelectromechanical gyroscope with rejection of disturbances and method of sensing an angular rate
    Patent number: 11085769
    Abstract: A gyroscope includes a substrate, a first structure, a second structure and a third structure elastically coupled to the substrate and movable along a first axis. The first and second structure are arranged at opposite sides of the third structure with respect to the first axis A driving system is configured to oscillate the first and second structure along the first axis in phase with one another and in phase opposition with the third structure. The first, second and third structure are provided with respective sets of sensing electrodes, configured to be displaced along a second axis perpendicular to the first axis in response to rotations of the substrate about a third axis perpendicular to the first axis and to the second axis.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: August 10, 2021
    Assignees: STMICROELECTRONICS S.R.L., STMICROELECTRONICS, INC., STMICROELECTRONICS INTERNATIONAL N.V.
    Inventors: Carlo Valzasina, Huantong Zhang, Matteo Fabio Brunetto, Gert Ingvar Andersson, Erik Daniel Svensson, Nils Einar Hedenstierna
  • THERMOELECTRIC GENERATOR
    Publication number: 20210242387
    Abstract: A thermoelectric generator includes a substrate and one or more thermoelectric elements on the substrate and each configured to convert a thermal drop across the thermoelectric elements into an electric potential by Seebeck effect. The thermoelectric generator includes a cavity between the substrate and the thermoelectric elements. The thermoelectric generator includes, within the cavity, a support structure for supporting the thermoelectric elements. The support structure has a thermal conductivity lower than a thermal conductivity of the substrate.
    Type: Application
    Filed: January 26, 2021
    Publication date: August 5, 2021
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Paolo FERRARI, Flavio Francesco VILLA, Luca ZANOTTI, Andrea NOMELLINI, Luca SEGHIZZI
  • NDIR detector device for detecting gases having an infrared absorption spectrum
    Patent number: 11079321
    Abstract: The device is formed in a casing including a support, a spacer body, and a mirror element fixed together. A light-emitting element and a light-receiving element are arranged on a bearing surface of the support and face a reflecting surface of the mirror element. The light-emitting element is configured to generate infrared radiation, and the light-receiving element is configured to receive light radiation reflected by the reflecting surface. The spacer body has an emission opening housing the light-emitting element and a reception opening housing the light-receiving element; the reception opening comprises a radiation-limitation portion configured to enable entry of reflected light radiation having an angle, with respect to a normal to the bearing surface, of less than a preset value.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: August 3, 2021
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Maria Eloisa Castagna, Salvatore Cascino, Viviana Cerantonio, Antonello Santangelo
  • Device comprising a ring optical resonator
    Patent number: 11079232
    Abstract: A device includes an optical resonator having four ports including a first port, a second port, a third port, and a fourth port. A first electronic circuit is configured to calculate a first information representative of a power difference between optical signals supplied by two of the four ports. A method of operating a device is also disclosed.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: August 3, 2021
    Assignee: STMicroelectronics S.R.L.
    Inventors: Antonio Fincato, Enrico Stefano Temporiti Milani, Maurizio Zuffada, Angelica Simbula
  • Microelectromechanical structure with enhanced rejection of acceleration noise
    Patent number: 11079229
    Abstract: An integrated MEMS structure includes a driving assembly anchored to a substrate and actuated with a driving movement. A pair of sensing masses suspended above the substrate and coupled to the driving assembly via elastic elements is fixed in the driving movement and performs a movement along a first direction of detection, in response to an external stress. A coupling assembly couples the pair of sensing masses mechanically to couple the vibration modes. The coupling assembly is formed by a rigid element, which connects the sensing masses and has a point of constraint in an intermediate position between the sensing masses, and elastic coupling elements for coupling the rigid element to the sensing masses to present a first stiffness to a movement in phase-opposition and a second stiffness, greater than the first, to a movement in phase, of the sensing masses along the direction of detection.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: August 3, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventors: Luca Coronato, Gabriele Cazzaniga
  • MEMS pressure sensor with multiple sensitivity and small dimensions
    Patent number: 11079298
    Abstract: A MEMS pressure sensor includes a monolithic body of semiconductor material having a first face and a second face and housing a first buried cavity and a second buried cavity, arranged under the first buried cavity and projecting laterally therefrom. A first sensitive region is formed between the first buried cavity and the first face at a first depth, and a second sensitive region is formed between the second buried cavity and the first face at a second depth greater than the first depth. The monolithic body also houses a first piezoresistive sensing element and a second piezoresistive sensing element, integrated in the first and second sensitive regions, respectively.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: August 3, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventors: Enri Duqi, Lorenzo Baldo
  • Self-test circuit, and corresponding device, vehicle and method
    Patent number: 11077755
    Abstract: A circuit includes a differential stage configured to provide a differential output signal. An analog-to-digital converter is coupled to first and second output nodes of the differential stage. The analog-to-digital converter is configured to provide an output signal that is a function of the differential output signal from the differential stage. A multiplexer is configured to receive a differential input signal. The multiplexer includes a test switch switchable between a conductive state and a non-conductive state. In the conductive state, the test switch couples the first input node and the second input node of the differential stage. Test signal injection circuitry is activatable to force a differential current through the differential stage. The circuit is selectively switchable between an operational mode and a self-test mode.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: August 3, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Orazio Pennisi, Valerio Bendotti, Vanni Poletto
  • Method of operating battery management systems, corresponding device and vehicle
    Patent number: 11079442
    Abstract: A method of operating a control device includes performing an open load test or a current leakage test. The open load test includes activating a first current and then a second current and sensing with the first current and the second current activated, respectively, a first voltage drop and a second voltage drop between charge distribution pins and charge sensing pins of the control device. Respective differences are calculated between the first voltage drop and the second voltage drop sensed with the first current and the second current activated, respectively. These differences are compared with respective thresholds and an open circuit condition is declared as a result of the differences calculated reaching these thresholds.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: August 3, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Orazio Pennisi, Valerio Bendotti, Vanni Poletto, Vittorio D'Angelo
  • ELECTRONIC CIRCUIT AND CORRESPONDING METHOD OF TESTING ELECTRONIC CIRCUITS
    Publication number: 20210232174
    Abstract: A combinational circuit block has input pins configured to receive input digital signals and output pins configured to provide output digital signals as a function of the input digital signals received. A test input pin receives a test input signal. A test output pin provides a test output signal as a function of the test input signal received. A set of scan registers are selectively coupled to either the combinational circuit block or to one another so as to form a scan chain of scan registers serially coupled between the test input pin and the test output pin. The scan registers in the set of scan registers are clocked by a clock signal. At least one input register is coupled between the test input pin and a first scan register of the scan chain. The at least one input register is clocked by an inverted replica of the clock signal.
    Type: Application
    Filed: January 27, 2021
    Publication date: July 29, 2021
    Applicants: STMicroelectronics S.r.l., STMicroelectronics (Shenzhen) R&D Co. Ltd
    Inventors: Ignazio PISELLO, Yu Yong WANG, Dario ARENA, Qi Yu LIU
  • METHOD OF MANUFACTURING SEMICONDUCTOR PRODUCTS, SEMICONDUCTOR PRODUCT, DEVICE AND TESTING METHOD
    Publication number: 20210233884
    Abstract: A semiconductor product includes a layer of semiconductor die package molding material embedding a semiconductor die having a front surface and an array of electrically-conductive bodies such as spheres or balls around the semiconductor die. The electrically-conductive bodies have front end portions around the front surface of the semiconductor die and back end portions protruding from the layer of semiconductor die package molding material. Electrically-conductive formations are provided between the front surface of the semiconductor die and front end portions of the electrically-conductive bodies left uncovered by the package molding material. Light-permeable sealing material can be provided at electrically-conductive formations to facilitate inspecting the electrically-conductive formations via visual inspection through the light-permeable sealing material.
    Type: Application
    Filed: January 26, 2021
    Publication date: July 29, 2021
    Applicant: STMicroelectronics S.r.l.
    Inventor: Fulvio Vittorio FONTANA