Abstract: A circuit includes a first transistor and a second transistor having respective control terminals coupled to receive first and second bias voltages. A first electronic switch is coupled in series with, and between current paths of the first and second transistors to provide an output current line between a circuit output node and ground. A second electronic switch is selectively activated to a conductive state in order to provide a charge transfer current path between a bias node and a charge transfer node in the output current line. A third electronic switch is selectively activated to a conductive state in order to provide a charge transfer current path between the charge transfer node and the control terminal of the second transistor.

Abstract: A testing system for carrying out electrical testing of at least one first through via forms an insulated via structure extending only part way through a substrate of a first body of semiconductor material. The testing system has a first electrical test circuit integrated in the first body and electrically coupled to the insulated via structure. The first electrical test circuit enables detection of at least one electrical parameter of the insulated via structure.

Abstract: A MEMS gyroscope is equipped with: at least a first mobile mass suspended from the top of a substrate by means of elastic suspension elements coupled to anchor points rigidly fixed to the substrate, in such a manner as to be actuated in an actuating movement along a first axis of a horizontal plane and to carry out a measurement movement along a vertical axis, transverse to the horizontal plane, in response to a first angular velocity acting about a second axis of the horizontal plane, transverse to the first axis. The elastic suspension elements are configured in such a manner as to internally compensate unwanted displacements out of the horizontal plane along the vertical axis originating from the actuating movement, such that the mobile mass remains in the horizontal plane during the actuating movement.

Abstract: An energy harvester includes an elongated tubular casing extending around a longitudinal axis between opposed first and second ends. A body is arranged in the casing. A helical electrical winding is wound around the longitudinal axis. The body is arranged to move along the longitudinal axis with alternate motion away from the first end towards the second end and away from the second end towards the first end. As a result of this alternate motion, an electromotive force is produced in the at least one helical electrical winding. Furthermore, at least one of the first and second ends includes a piezoelectric transducer that is configured to co-operate in a kinetic energy transfer relationship with the at least one body to generate an electric voltage as a result of the at least one body reaching, in the alternate motion, an end-of-travel position towards the piezoelectric transducer.

Abstract: A voltage regulator circuit includes a first voltage regulator having a first output voltage selection pin set and producing a first output voltage based on a first digital signal received at the first output voltage selection pin set, and a second voltage regulator having a second output voltage selection pin set and producing a second output voltage based on a second digital signal received at the second output voltage selection pin set. The first and second voltage regulators are operable in a voltage tracking mode with the output voltage of the second voltage regulator tracking the output voltage of the first voltage regulator when digital signals received at the selection pin sets have a same value. An overvoltage sensor detects overvoltage events at the first voltage regulator. Control circuitry selectively avoids operation in voltage tracking mode as a result of an overvoltage event detected at the first voltage regulator.

Abstract: A power stage in an electronic fuse circuit is driven by controller. The controller includes a first comparator set for output voltage control and a second comparator set for output current control. Each comparator set includes at least one comparator having a reference input, a feedback input, and one or more outputs. A driver circuit includes output terminals for driving the power stage. The driver circuit includes a switch that is selectively activated in response to outputs from the first and second comparator sets to clamp the voltage across the output terminals of the driver circuit. The clamp operation is made in response to feedback input to either of the first and second comparator sets having exceeded a certain reference.

Abstract: A MEMS tri-axial accelerometer is provided with a sensing structure having: a single inertial mass, with a main extension in a horizontal plane defined by a first horizontal axis and a second horizontal axis and internally defining a first window that traverses it throughout a thickness thereof along a vertical axis orthogonal to the horizontal plane; and a suspension structure, arranged within the window for elastically coupling the inertial mass to a single anchorage element, which is fixed with respect to a substrate and arranged within the window, so that the inertial mass is suspended above the substrate and is able to carry out, by the inertial effect, a first sensing movement, a second sensing movement, and a third sensing movement in respective sensing directions parallel to the first, second, and third horizontal axes following upon detection of a respective acceleration component.

Abstract: A converter circuit is used to selectively convert an analog input voltage into a digital output signal or a digital input signal into an analog output voltage as a function of a mode signal. The converter circuit includes a control circuit configured to generate a start-of-conversion signal. A ramp generator is configured to, when the mode signal indicates an analog-to-digital conversion, generate a timer stop signal after a time interval that is determined as a function of the value of the analog input voltage, thereby implementing an analog-to-time conversion. When the mode signal indicates a digital-to-analog conversion, ramp generator is configured to vary the ramp signal until a ramp stop signal is set and, in response to the ramp stop signal, determine the analog output voltage as a function of the ramp signal, thereby implementing a time-to-analog conversion.

Abstract: A MOSFET device is integrated in a body of semiconductor material of a first conductivity type accommodating a body region, of a second conductivity type, and a source region, of the first conductivity type. A gate region extends over the top surface of the body; a source pad extends over the first top surface and is electrically coupled to the source region, a first gate pad extends over the first main surface, alongside the source pad, and is electrically coupled to the gate region; a drain pad extends over the rear surface and is electrically coupled to the body; a second gate pad extends over the rear surface, alongside the drain pad; and a conductive via extends through the body and electrically couples the gate region to the second gate pad.

Abstract: A MEMS actuator device of a piezoelectric type formed on a substrate, with a base unit including a base beam element having a main extension in a extension plane and a thickness in a thickness direction perpendicular to the extension plane, smaller than the main extension. A piezoelectric region extends over the beam element. An anchor region is rigid to the base beam element and to the substrate. A base constraint structure is connected to one end of the base beam element and is configured to allow a deformation of the base beam element in the extension plane and substantially reduce a deformation of the base beam element in the thickness direction.

Abstract: A die structure includes a first die having a first surface and a second surface opposite the first surface. The first die includes sidewalls extending between the first and second surfaces. The die structure includes conductive ink printed traces including a first group of the conductive ink printed traces on the first surface of the first semiconductor die. A second group of the conductive ink printed traces are on the second surface of the semiconductor die, and a third group of the conductive ink printed traces are on the sidewalls of the semiconductor die.

Abstract: A MOS transistor, in particular a vertical channel transistor, includes a semiconductor body housing a body region, a source region, a drain electrode and gate electrodes. The gate electrodes extend in corresponding recesses which are symmetrical with respect to an axis of symmetry of the semiconductor body. The transistor also has spacers which are also symmetrical with respect to the axis of symmetry. A source electrode extends in electrical contact with the source region at a surface portion of the semiconductor body surrounded by the spacers and is in particular adjacent to the spacers. During manufacture the spacers are used to form in an auto-aligning way the source electrode which is symmetrical with respect to the axis of symmetry and equidistant from the gate electrodes.

Abstract: A buried cavity is formed in a monolithic body to delimit a suspended membrane. A peripheral insulating region defines a supporting frame in the suspended membrane. Trenches extending through the suspended membrane define a rotatable mobile mass carried by the supporting frame. The mobile mass forms an oscillating mass, supporting arms, spring portions, and mobile electrodes that are combfingered to fixed electrodes of the supporting frame. A reflecting region is formed on top of the oscillating mass.

Abstract: An input receives a radio frequency (RF) signal having an interfering component superimposed thereon. The RF signal is mixed with a local oscillator (LO) signal and down-converted to an intermediate frequency (IF) to generate a mixed signal which includes a frequency down-converted interfering component. The mixed signal is amplified by an amplifier to generate an output signal. A feedback loop processes the output signal to generate a correction signal for cancelling the frequency down-converted interfering component at the input of the amplifier. The feedback loop includes a low-pass filter and a amplification circuit which outputs the correction signal.

Abstract: A method includes providing a semiconductor body comprising a surface with a recessed portion therein. The recessed portion includes a bottom surface. Optical waveguide cores in a first array of optical waveguide cores extend side-by-side at the bottom surface. The method further includes providing a second array of optical waveguide cores over the first array of optical waveguide cores. Optical waveguide cores in the second array of optical waveguide cores extend side-by-side. Each optical waveguide core in the second array of optical waveguide cores is in an adiabatic coupling relationship with a corresponding optical waveguide core in the first array of optical waveguide cores. The method also includes applying an optical waveguide cladding material over the second array of optical waveguide cores.

Abstract: A method of attaching a semiconductor die or chip onto a support member such as a leadframe comprises: applying onto the support member at least one stretch of ribbon electrical bonding material and coupling the ribbon material to the support member, arranging at least one semiconductor die onto the ribbon material with the ribbon material between the support member and the semiconductor die, coupling the semiconductor die to the ribbon material.

Abstract: In an embodiment, a method includes: receiving an audio frame; decomposing the received audio frame into M sub-band pulse-code modulation (PCM) audio frames, where M is a positive integer number; predicting a PCM sample of one sub-band PCM audio frame of the M sub-band PCM audio frames; comparing the predicted PCM sample with a corresponding received PCM sample to generate a prediction error sample; comparing an instantaneous absolute value of the prediction error sample with a threshold; and replacing the corresponding received PCM sample with a value based on the predicted PCM sample when the instantaneous absolute value of the prediction error sample is greater than the threshold.

Abstract: The present disclosure is directed to a leadframe package with a surface mounted semiconductor die coupled to leads of the leadframe package through wire bonding. The leads are partially exposed outside the package and configured to couple to another structure, like a printed circuit board (PCB). The exposed portions, namely outer segments, of the leads include a plating or coating layer of a material that enhances the solder wettability of the leads to the PCB through solder bonding. The enclosed portions, namely inner segments, of the leads do not include the plating layer of the outer segment and, thus, include a different surface material or surface finish.

Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.

Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.