Patents Assigned to STMicroelectronics
  • Patent number: 8442100
    Abstract: A transmission and reception apparatus includes a transmitter, a receiver and a galvanically isolated interface arranged between the transmitter and the receiver. The transmitter, receiver and interface are arranged so as to form a two-level isolated digital channel and the transmitter includes a block adapted to send a clock signal to the receiver. The receiver includes a circuit adapted to synchronize the receiver and the transmitter using the received clock signal and a circuit adapted to memorize information related to the synchronization in a storage element to hold the synchronization while the receiver is receiving the digital data. The transmitter block is adapted to send the digital data signal after the synchronization of the receiver and transmitter.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: May 14, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventors: Salvatore Giombanco, Giovanni Lombardo, Salvatore Tumminaro, Filippo Marino
  • Patent number: 8442122
    Abstract: A method of encoding scalable video data streams and an encoder configured to generate an encoded scalable video data stream is provided. The encoder includes a mode controller configured to store a plurality of encoding modes, select a sub-set of the plurality of encoding modes and select a first encoding mode. The encoder generates the encoded scalable video data stream dependent on the first encoding mode.
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: May 14, 2013
    Assignee: STMicroelectronics NV
    Inventors: Damien Lefol, David Bull, Nishan Canagarajah
  • Patent number: 8441272
    Abstract: A MEMS probe adapted to contact a corresponding terminal of an integrated circuit, integrated on at least one chip of a semiconductor material wafer during a test phase of the wafer is provided. The probe includes a support structure comprising a first access terminal and a second access terminal; the support structure defines a conductive path between said first access terminal and said second access terminal. The probes further-includes a probe region connected to the support structure adapted to contact the corresponding terminal of the integrated circuit during the test phase for providing at least one test signal received from the first access terminal and the second access terminal to the integrated circuit through at least one portion of the conductive path, and/or providing at least one test signal generated by the integrated circuit to at least one between the first access terminal and the second access terminal trough at least one portion of the conductive path.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: May 14, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 8441382
    Abstract: A current-steering digital-to-analog converter may include a plurality of current cells. Each current cell may comprise a dual bias switched cascode output current source/sink, a bias source, complementary bias switching elements coupled between the bias source and the bias inputs of the switched cascode output current source/sink, and complementary switching signals coupled to the control inputs of the complementary bias switching element.
    Type: Grant
    Filed: March 14, 2011
    Date of Patent: May 14, 2013
    Assignee: STMicroelectronics Pvt. Ltd.
    Inventors: Puneet Mahajan, Anand Singh Rawat, Anil Kumar
  • Patent number: 8441712
    Abstract: A display system for a portable device is switchable by electrical addressing. The display system can absorb ambient light and reflect at least a portion of the absorbed light to render an image on a surface of the display. The display includes a plurality of pixel electrodes. Each of the plurality of pixel electrodes includes linkers with acceptor molecules and donor molecules that form groups having respective color properties. In an off-state, a respective pixel is configured to reflect white light. In an on-state, a respective pixel is configured to reflect light according to the molecular grouping of the acceptor-donor group.
    Type: Grant
    Filed: October 15, 2010
    Date of Patent: May 14, 2013
    Assignee: STMicroelectronics, Inc.
    Inventor: Michele Palmieri
  • Patent number: 8440470
    Abstract: The disclosure relates to a fabrication process of a biosensor on a semiconductor wafer, comprising steps of: making a central photosensitive zone comprising at least one pixel-type biological analysis device comprising a photosensitive layer, and a first peripheral zone surrounding the central photosensitive zone, comprising electronic circuits. The first peripheral zone is covered by a hydrophilic coating, and the central photosensitive zone is covered with a hydrophobic coating. A barrier of a bio-compatible resin is formed on the second peripheral zone.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: May 14, 2013
    Assignees: STMicroelectronics (R&D) Limited, Universite Paul Cezanne Aix Marseille III
    Inventors: Jeffrey M. Raynor, Michaël Maurin, Mitchel O'Neal Perley, Pierre-Francois Lenne, Herve Rigneault, Renaud Vincentelli
  • Patent number: 8441874
    Abstract: A memory circuit includes a memory cell configured to be re-writable. A write enable circuit is configured to enable writing a signal via a pair of bit lines to the memory cell depending on a write signal. A charge supply circuit is configured to supply a charge to at least one of the pair of bit lines. A charge supply controller is configured to control the charge supply circuit to disable the supply of charge and couple the write enable circuit to at least one of the pair of bit lines after a first determined period following the reception of the write signal.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: May 14, 2013
    Assignee: STMicroelectronics International N.V.
    Inventors: Rakesh Kumar Sinha, Dhori Kedar Janardan, Sachin Gulyani
  • Patent number: 8441092
    Abstract: A semiconductor thermoelectric cooler is configured to direct heat through channels of the cooler. The thermoelectric cooler has multiple electrodes and a first dielectric material positioned between side surfaces of the electrodes. A second dielectric material, different from the first dielectric material, is in contact with top surfaces of the electrodes. The first dielectric material extends above the top surface of the electrodes, separating portions of the second dielectric material, and is in contact with a portion of the top surfaces of the electrodes. The first dielectric material has a thermal conductivity different than a thermal conductivity of the second dielectric material. A ratio of the first dielectric material to the second dielectric material in contact with the top surface of the electrodes may be selected to control the heat retention. The semiconductor thermoelectric cooler may be manufactured using thin film technology.
    Type: Grant
    Filed: December 6, 2010
    Date of Patent: May 14, 2013
    Assignee: STMicroelectronics Pte. Ltd.
    Inventors: Ravi Shankar, Olivier Le Neel
  • Patent number: 8441863
    Abstract: An electrically programmable non-volatile memory device includes a plurality of memory cells, a plurality of lines for selectively biasing the memory cells, reconnection circuitry for reconnecting a pair of selected lines having different voltages, and a controller for controlling the memory device. The reconnection means includes a discharge circuit for discharging one of the selected lines being at the higher voltage in absolute value, an equalization circuit for equalizing the selected lines, a comparator circuit for measuring an indication of a voltage difference between the selected lines, and an evaluation circuit responsive to an enabling signal from the controller for activating the discharge circuit until an absolute value of the voltage difference exceeds a threshold value and for disabling the discharge circuit and enabling the equalization circuit when the absolute value of the voltage difference reaches the threshold value.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: May 14, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventors: Maurizio Francesco Perroni, Giuseppe Castagna
  • Publication number: 20130115935
    Abstract: An NFC controller analyzes incoming commands, by name, and decides, according a predefined name table, to which secure element the actual command and following commands are sent for processing.
    Type: Application
    Filed: November 2, 2012
    Publication date: May 9, 2013
    Applicant: STMicroelectronics Design and Application GmbH
    Inventor: STMicroelectronics Design and Application GmbH
  • Publication number: 20130113017
    Abstract: A protection device includes a triac and triggering units. Each triggering unit is formed by a MOS transistor configured to operate at least temporarily in a hybrid operating mode and a field-effect diode. The field-effect diode has a controlled gate that is connected to the gate of the MOS transistor.
    Type: Application
    Filed: September 27, 2012
    Publication date: May 9, 2013
    Applicant: STMicroelectronics S.A.
    Inventor: STMicroelectronics S.A.
  • Publication number: 20130113562
    Abstract: A current reuse device including a first stage provided with a first input for a first input signal and a first output for a first output signal; a second stage comprising a second input for a second input signal and a direct current terminal operating as a ground terminal for alternate signals; a first inductor connected to a first output and to the direct current terminal so that the first and second stages share a direct current; a second inductor reciprocally coupled to the first inductor and connected to the second input in order to generate the second input signal as a function of the first output signal.
    Type: Application
    Filed: September 5, 2012
    Publication date: May 9, 2013
    Applicant: STMicroelectronics S.r.l.
    Inventors: Vittorio GIAMMELLO, Egidio RAGONESE, Giuseppe PALMISANO
  • Publication number: 20130112974
    Abstract: A method for determining, in a first semiconductor material wafer having at least one through via, mechanical stress induced by the at least one through via, this method including the steps of: manufacturing a test structure from a second wafer of the same nature as the first wafer, in which the at least one through via is formed by a substantially identical method, a rear surface layer being further arranged on this second wafer so that the via emerges on the layer; measuring the mechanical stress in the rear surface layer; and deducing therefrom the mechanical stress induced in the first semiconductor material wafer.
    Type: Application
    Filed: June 15, 2012
    Publication date: May 9, 2013
    Applicants: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, STMicroelectronics (Crolles 2) SAS
    Inventors: Mohamed Bouchoucha, Pascal Chausse, Laurent-Luc Chapelon
  • Publication number: 20130112995
    Abstract: An embodiment of a method for manufacturing a semiconductor wafer includes providing a monocrystalline silicon wafer, epitaxially growing a first layer of a first material on the silicon wafer, and epitaxially growing a second layer of a second material on the first layer. For example, said first material may be monocrystalline silicon carbide, and said second material may be monocrystalline silicon.
    Type: Application
    Filed: April 29, 2011
    Publication date: May 9, 2013
    Applicant: STMicroelectronics S.r.l.
    Inventor: Giuseppe Abbondanza
  • Patent number: 8436426
    Abstract: The present disclosure is directed to a thin film resistor having a first resistor layer having a first temperature coefficient of resistance and a second resistor layer on the first resistor layer, the second resistor layer having a second temperature coefficient of resistance different from the first temperature coefficient of resistance. The first temperature coefficient of resistance may be positive while the second temperature coefficient of resistance is negative. The first resistor layer may have a thickness in the range of 50 and 150 angstroms and the second resistor layer may have a thickness in the range of 20 and 50 angstroms.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: May 7, 2013
    Assignee: STMicroelectronics PTE Ltd.
    Inventors: Olivier Le Neel, Calvin Leung
  • Patent number: 8436599
    Abstract: A method of controlling an output voltage of a pulse width modulation (PWM) converter with a PWM signal driving a power switch of the converter may include using a comparator to compare a reference voltage with a scaled output voltage of the converter, incrementing or decrementing an up/down counter at each pulse of a clock signal applied to the counter depending on a state of the comparator, and controlling the comparator to generate the PWM signal with a control voltage selected from a look-up table using a value of the counter.
    Type: Grant
    Filed: November 24, 2010
    Date of Patent: May 7, 2013
    Assignee: STMicroelectronics S.R.L.
    Inventor: Fabio Cacciotto
  • Patent number: 8437333
    Abstract: Contention based period beamforming includes the establishment of synchronized communications between a beamforming initiator and a beamforming responder to precisely define a start time for beamforming training. Synchronization between the beamforming initiator and beamforming responder begins with the sending of control information to the responder so that the start of the beamforming process will be synchronized. With beamforming training synchronized, beamforming is initiated using the sector sweep process.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: May 7, 2013
    Assignees: STMicroelectronics, Inc., STMicroelectronics Srl
    Inventors: Liwen Chu, George A. Vlantis, Vincenzo Scarpa
  • Patent number: 8436255
    Abstract: A polymeric layer encompassing the solder elements of a ball grid array in an electronics package. The polymeric layer reinforces the solder bond at the solder ball-component interface by encasing the elements of the ball grid array in a rigid polymer layer that is adhered to the package structure. Stress applied to the package through the ball grid array is transmitted to the package structure through the polymeric layer, bypassing the solder joint and improving mechanical and electrical circuit reliability. In one embodiment of a method for making the polymeric layer, solder elements bonded to external pads on a structure of the package are submerged in a fluidic form of the polymeric layer. The fluidic form is solidified and then a portion of the resulting polymeric layer is removed to make the solder elements accessible for mounting the package to a printed circuit board or other external circuit.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: May 7, 2013
    Assignee: STMicroelectronics Pte Ltd.
    Inventor: Kim-Yong Goh
  • Patent number: 8437314
    Abstract: Radio frequency (RF) architectures for spectrum access networks are provided. Embodiments of the invention generally provide a radio frequency (RF) architecture for customer premise equipment (CPE) for use in, for example, IEEE 802.22 wireless regional area networks (WRANs). In some embodiments, the CPE RF architecture includes two receive chains with a directional antenna and an omni-directional antenna, respectively. The CPE RF architecture facilitates opportunistic out-of-band spectrum sensing and WRAN signal receiving that are performed in parallel with data transmission.
    Type: Grant
    Filed: February 21, 2008
    Date of Patent: May 7, 2013
    Assignee: STMicroelectronics, Inc.
    Inventors: George A. Vlantis, Wendong Hu
  • Patent number: 8437348
    Abstract: Transmission of multicast packets over a local area network is controlled by: identifying the condition where only a single receiver exists within the local area network for a given multicast group of packets, and allowing, upon occurrence of that condition, Automatic Repeat Request of the packets multicast towards said single receiver. A preferred field of application is wireless local area networks for use in a home environment.
    Type: Grant
    Filed: October 11, 2007
    Date of Patent: May 7, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventors: Antonio Vilei, Gabriella Convertino