Abstract: A method of managing an integrated circuit memory includes identifying a set of allocated regions and a set of empty regions spanning a memory space of an integrated circuit card, selecting the biggest empty region of the set of empty regions, determining that an allocated memory block of an allocated region immediately adjacent to the biggest empty region is larger than the biggest remaining empty region of the memory space, storing the allocated memory block in a temporary list of skipped memory blocks, removing the allocated memory block from the set of allocated memory regions, and swapping the allocated memory block with a remaining empty region to widen the biggest empty region.

Abstract: An embodiment method for operating an electronic device includes transmitting, from a controller, a tearing effect (TE) signal to a touchscreen over a first period of time, the first period of time occurring during a first frame and having a duration that is shorter than a period of the first frame, the TE signal being configured to restrict image data from being displayed on the touchscreen during the first period of time; displaying the first frame of a plurality of frames of the image data on a display of the touchscreen over a second period of time within the period of the first frame other than during the first period of time; and detecting, at the controller, a first touch by performing a first self-sensing scan during the first period of time.

Abstract: An optical sensor includes pixels. Each pixel has a photodetector. A readout circuit performs a process over an exposure time where the photodetector is connected to a reverse bias voltage supply to reset a voltage across the photodetector, and the photodetector is disconnected from the reverse bias voltage supply until that the voltage across the photodetector decreases in response to received ambient light. An ambient light level is then determine an based on a number of times the voltage across the photodetector is reset over the exposure time.

Abstract: A voltage converter delivers an output voltage between a first and a second node. The voltage converter includes a capacitor series-coupled with a resistor between the first and second nodes. The resistor is coupled in parallel with a bidirectional switch receiving at its control terminal a positive bias voltage referenced to the second node.

Abstract: A system on chip includes a non-volatile memory and a processor configured to execute an operating system which receives data according to a first communication protocol and program installation software that communicates with the non-volatile memory according to a second communication protocol. The operating system functions to: determine whether data received according to the first communication protocol is program data, make the program data available to the installation software, and inform the installation software that program data has been received. The installation software then stores the program data in the non-volatile memory.

Abstract: A MEMS inclinometer includes a substrate, a first mobile mass and a sensing unit. The sensing unit includes a second mobile mass, a number of elastic elements, which are interposed between the second mobile mass and the substrate and are compliant in a direction parallel to a first axis, and a number of elastic structures, each of which is interposed between the first and second mobile masses and is compliant in a direction parallel to the first axis and to a second axis. The sensing unit further includes a fixed electrode that is fixed with respect to the substrate and a mobile electrode fixed with respect to the second mobile mass, which form a variable capacitor.

Abstract: In an embodiment, a circuit includes a first branch coupled between a first node and a second node, the first branch including a first ceramic capacitor, the first ceramic capacitor including terminals configured to receive a first voltage applied therebetween. The circuit further includes a second branch coupled between the first node and a third node, the second branch including a second ceramic capacitor that is substantially identical to the first ceramic capacitor, the second ceramic capacitor including terminals configured to receive a second voltage applied therebetween. The circuit further includes a control circuit configured to modify the second voltage until a first current passing through the second node is substantially equal to a second current passing through the third node.

Abstract: A device includes a set of processing circuits arranged in subsets, a set of data memory banks coupled to a memory controller, a control unit, and an interconnect network. The processing circuits are configurable to read first input data from the data memory banks via the interconnect network and the memory controller, process the first input data to produce output data, and write the output data into the data memory banks via the interconnect network and the memory controller. The hardware accelerator device includes a set of configurable lock-step control units which interface the processing circuits to the interconnect network. Each configurable lock-step control unit is coupled to a subset of processing circuits and is selectively activatable to operate in a first operation mode, or in a second operation mode.

Abstract: An integrated device includes: a semiconductor structural layer, including silicon carbide and having a first conductivity type; a power device integrated in the structural layer; and an edge termination structure, extending in a ring around the power device and having a second conductivity type. The edge termination structure includes a plurality of ring structures each arranged around the power device and in contiguous pairs. At least a first one of the ring structures comprises a transition region contiguous to a second one of the ring structures. The transition region includes connection regions, having the second conductivity type, connected to the second one of the ring structures and alternating with charge control regions having the first conductivity type.

Abstract: The present description concerns a method of assembly of a first assembly layer comprising a first copper region at a first surface and of a second assembly layer comprising a second region made of oxide or of an oxidized metal at a second surface, wherein the first and second surfaces are assembled by means of a hybrid bonding such that the entire first copper region is placed into contact with the oxide or the oxidized metal of the second region.

Abstract: An integrated circuit package includes an assembly of an electronic integrated circuit chip, an optical element and a support substrate. The support substrate includes a mounting face and has an opening sized and shaped to containing the electronic integrated circuit chip. The optical element includes a connection face connected to the mounting face of the support substrate and is positioned opposite to said opening. The electronic integrated circuit chip is connected to the connection face of the optical element such that the electronic chip is housed in said opening of the support substrate.

Abstract: A memory array includes memory cells forming a data word location accessed in response to a word line signal. A data sensing circuit configured to sense data on bit lines associated with the memory cells. The sensed data corresponds to a current data word stored at the data word location. A data latching circuit latches the sensed data for the current data word from the data sensing circuit. A data modification circuit then performs a mathematical modify operation on the current data word to generate a modified data word. The modified data word is then applied by a data writing circuit to the bit lines for writing back to the memory cells of the memory array at the data word location in response to assertion of control signal having a dynamically variable delay dependent on the current data word. The operations are advantageously performed within a single clock cycle.

Abstract: Provided is an electronic system including an electronic device and a reader. The electronic device includes a non-volatile memory; a first NFC module; and a first component adapted to receiving at least one signal sent by a sensor and adapted to converting said signal into digital data. When the electronic device receives said signal said component converts said signal into the data, and then stores said data into said non-volatile memory. The first module is adapted to supplying said reader with said data. The reader includes a second NFC module; and a second component adapted to implementing a digital filtering function. The second module is adapted to receiving said data and said second component is adapted to applying said function to said data.

Abstract: An ESD protection circuit includes a first voltage limiter having a first input terminal electrically coupled to each first signal pad of an integrated circuit by a first diode mounted in reverse bias during the integrated circuit operation. The first voltage limiter is mounted to be conductive between each first signal pad and ground during a positive ESD on the first signal pad. A second voltage limiter is electrically coupled and mounted to be conductive in the same direction as the first voltage limiter, between an external power supply pad and ground. An internal node outputs an internal power supply voltage to the domain, and is passed through by a current in response to a positive ESD on the power supply pad which is lower than the current passing through the first voltage limiter. A blocking diode is electrically connected between the first input terminal and the power supply pad.

Abstract: The present disclosure concerns a photodiode including at least one memory area, each memory area including at least two charge storage regions.

Abstract: A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

Abstract: A configurable voltage regulating circuit includes first through fourth switches. A flying capacitor is coupled between a common mode node and a pump node, and a sense resistance network is coupled between an output node and an input of an error amplifier and configured to provide a sensed output voltage. The error amplifier receives at another input a reference voltage and generates an error signal. A charging circuit supplies a charging current to the pump node, and controls the value of the charging current as a function of the error signal. A switch command signals generator generates respective first, second, third, and fourth switch signals to control the first switch, second switch, third switch, and fourth switch. The generator sets the configurable voltage regulating circuit as either a charge pump or a linear regulator based the input voltage being less than a first threshold or greater than a second threshold.

Abstract: A secure element device that is configured to be cryptographically bound to a host device includes a secure element host key slot configured to store host key information that allows only the host device to control the secure element, a secure memory storing binding information, and limited functionality allowing the binding information to be read from the secure memory by the host device during a binding process. The binding information is cryptographically correlated with the host key information. The host key information is generated by the host device using the binding information read from the secure element and a secret key. The secure element device further includes general functionality only accessible to the host device using the host key information that is generated by the host device. The secure memory includes prevention measures impeding unauthorized entities from obtaining information from the secure memory.

Abstract: Various embodiments of the present disclosure disclose decoding techniques for mitigating data corruption due to duty cycle distortion, jitter, and other distortions to a digital signal. Decoding processes, apparatuses, and systems are provided that utilize a decoding framework for improving the accuracy of output bit streams generated from digital signals. An example process receives data indicative of a digital signal, generates a signal measurement for the digital signal that includes signal length descriptive between a two rising edges of a digital signal or two falling edges of the demodulated digital signal, and generates at least one portion of an output bit stream for the digital signal based at least in part on the signal measurement.

Abstract: The present disclosure is directed to devices and methods for performing screen state detection. The screen state detection may be used in conjunction with any device with a bendable display. The device and method utilizes an electrostatic charge variation sensor to detect whether the display is in an open state or a closed state.