Abstract: An imaging sensor includes a pixel array containing photodiodes, the photodiodes being isolated from one another by full thickness deep trench isolations. Row control circuitry controls which rows of the pixel array operate in an imaging mode and which rows of the pixel array operate in an energy harvesting mode, on a row-by-row basis. Switch circuitry selectively connects different groups of photodiodes in rows operating in the energy harvesting mode into forward biased series configurations between a voltage output line and a ground line, or into forward biased parallel configurations between the voltage output line and the ground line. In the forward biased series configurations, the cathode of at least one photodiode of a given group of photodiodes is directly electrically connected to ground.

Abstract: The present description concerns a method comprising: the loading, from a non-volatile memory of a circuit to a computation circuit, of a first security parameter of the circuit and of a first error-correcting code stored in association with the first security parameter; the verification, by the computation circuit, of the first security parameter and of the first error-correcting code to determine whether one or a plurality of the bits of the security parameter are erroneous; and if it is determined that two bits of the security parameter are erroneous, the loading of a default value of the first parameter into a register.

Abstract: The present disclosure relates to a method for communicating between an electronic tag and a computer connected to the internet, wherein the electronic tag: encrypts at least part of the information to be transmitted, using a data format preserving algorithm; generates a URL comprising at least the encrypted part of the information; and transmits the URL to an NFC reader.

Abstract: An electronic device receives wireless signals encoded with data in an amplitude-shift keying format. The electronic device passes the wireless signals through a low-pass filter. The low-pass filter has a cutoff frequency between a first frequency associated with data values of a first type and a second frequency associated with data values of a second type. The low-pass filter has the effect of changing the wireless signal from the amplitude-shift keying format to an on-off keying format without losing the data. The electronic device decodes the data from the wireless signal in the on-off keying format.

Abstract: An optical proximity sensor comprises a solid-state photo-electric converter, a biasing circuit for biasing the solid-state photo-electric converter, and a drive circuit. The drive circuit is configured to control the biasing circuit to apply to the photo-electric converter a bias signal modulated between a first value and a second value, the second value different from the first value, wherein a modulated optical signal is emitted by the solid-state photo-electric converter towards a target object. The drive circuit is configured to receive an electrical output signal from the solid-state photo-electric converter, the electrical output signal being a function of a modulated optical signal received at the solid-state photo-electric converter as a result of reflection of the emitted modulated optical signal at the target object.

Abstract: A time-interleaved analog to digital converter (TI-ADC) includes a first sub-ADC configured to sample and convert an input analog signal to generate a first digital signal and a second sub-ADC configured to sample and convert said input analog signal to generate a second digital signal. Sampling by the second sub-ADC occurs with a time skew mismatch. A multiplexor interleaves the first and second digital signals to generate a third digital signal. A time skew mismatch error determination circuit processes the first and second digital signals to generate a time error corresponding to the time skew mismatch. A slope value of said third digital signal is determined and multiplied by the time error to generate a signal error. The signal error is summed with the third digital signal to generate a digital output signal which eliminates the error due to the time skew mismatch. This correction is performed in real time.

Abstract: A method for operating a touch sensing panel includes a touchscreen controller determining a first plurality of excitation signals in accordance with a first plurality of codes, wherein a sum of the first plurality of codes is a sequence of numbers having a same absolute value and signs alternating between adjacent numbers in the sequence of numbers. The method further includes the touchscreen controller transmitting each of the first plurality of excitation signals to a respective transmitting (TX) touch sensor of the touch sensing panel simultaneously during a first time frame. The method further includes the touchscreen controller determining touch strengths in accordance with a first plurality of output signals received by a plurality of receiving (RX) touch sensors of the touch sensing panel during the first time frame.

Abstract: A package includes an upper level mounted to a lower level. The upper level includes a stack formed by insulating layers and conductive elements and includes a first conductive track of an antenna. A plastic element rests on the stack. A first cavity is defined in the plastic element. A second conductive track of the antenna is located on a wall of the plastic element (for example, in or adjacent to the first cavity). A second cavity is also defined in the plastic element surrounding the first cavity. A third conductive track of the antenna is located on a wall of the plastic element (for example, in the second cavity). A third cavity is delimited between the upper and lower levels and an integrated circuit chip is mounted within the third cavity and electrically connected to the antenna.

Abstract: A detection method of a user of an apparatus is provided in which the apparatus is coupled to a charge variation sensor having a control unit and an electrode to detect an electric/electrostatic charge variation of the user. The detection method includes acquiring, through the electrode, a charge variation signal indicative of the presence of the user. A filtered signal is generated by filtering the charge variation signal. A feature signal is generated as a function of the filtered signal. A movement signal indicative of a movement of the user is generated as a function of the feature signal. A presence signal indicative of the presence of the user is generated as a function of the movement signal.

Abstract: A sensor device includes a passive infrared sensor, a control circuit, and a lens that directs infrared radiation onto the passive infrared sensor. The lens includes an obstruction that asymmetrically blocks transmission of infrared radiation through the lens. The control circuit is configured to determine the direction of crossing of individuals passing in front of the sensor device based on sensor signals from the passive infrared sensor.

Abstract: An integrated circuit includes an input pad and a Schmitt trigger coupled to the input pad. The Schmitt trigger includes a first inverter and a second inverter. The Schmitt trigger includes a pull-up transistor coupled to an input of the second inverter and configure to supply a high reference voltage to the input of the second inverter.

Abstract: A waveguide has a first input/output for receiving/outputting a radio frequency (RF) wave and guiding the RF wave between the first input/output and a second input/output. An electronic integrated circuit chip is electrically connected at a front face to a metal level of a carrier substrate which includes a patch antenna. An electrically insulating embedding material surrounds the electronic chip and is disposed between the patch antenna and the first input/output of the waveguide which is at least in contact with the embedding material. The electronic chip cooperates electrically with the patch antenna so as to cause the patch antenna to transmit the RF wave to the first input/output through the embedding material. The electronic chip also processes an electrical signal from the patch antenna in response to the patch antenna receiving the radio frequency wave output by the first input/output via the embedding material.

Abstract: The present description concerns a switch based on a phase-change material comprising: first, second, and third electrodes; a first region of said phase-change material coupling the first and second electrodes; and —a second region of said phase-change material coupling the second and third electrodes.

Abstract: An integrated circuit package includes a support substrate having a mounting face and a lateral wall having an inner face and an outer face. The inner face delimits with the mounting face a cavity. The outer face includes a step extending outwardly of the package. An electronic chip disposed in the cavity and electrically connected to electrically-conductive contact pads. A sealing structure is bonded by a glue to an upper face of the lateral wall to seal the cavity. The glue does not spill out over the outer face of the lateral wall. Electrically-conductive connection elements are located over a lower face of the support substrate and electrically cooperate with the contact pads through an interconnection network located in the support substrate.

Abstract: An integrated circuit includes a capacitive transistor supported by a semiconductor substrate. The capacitive transistor includes: a drain and a source formed in the semiconductor substrate; a gate having a first portion extending in depth in the semiconductor substrate, and a second portion prolonging said first portion and extending over the semiconductor substrate; and a dielectric layer extending between the gate and the semiconductor substrate.

Abstract: A semiconductor region includes an isolating region which delimits a working area of the semiconductor region. A trench is located in the working area and further extends into the isolating region. The trench is filled by an electrically conductive central portion that is insulated from the working area by an isolating enclosure. A cover region is positioned to cover at least a first part of the filled trench, wherein the first part is located in the working area. A dielectric layer is in contact with the filled trench. A metal silicide layer is located at least on the electrically conductive central portion of a second part of the filled trench, wherein the second part is not covered by the cover region.

Abstract: A semiconductor chip or die is mounted at a position on a support substrate. A light-permeable laser direct structuring (LDS) material is then molded onto the semiconductor chip positioned on the support substrate. The semiconductor chip is visible through the LDS material. Laser beam energy is directed to selected spatial locations of the LDS material to structure in the LDS material a pattern of structured formations corresponding to the locations of conductive lines and vias for making electrical connection to the semiconductor chip. The spatial locations of the LDS material to which laser beam energy is directed are selected as a function of the position the semiconductor chip which is visible through the LDS material, thus countering undesired effects of positioning offset of the chip on the substrate.

Abstract: A device for testing an optical device, comprising a first structure comprising a substrate made of a first material and at least two first pillars of cylindrical shape made of a second material crossing the substrate, the second material having an optical index different from the optical index of the first material.

Abstract: The vertical-conduction electronic power device is formed by a body of wide band gap semiconductor which has a first conductivity type and has a surface, and is formed by a drift region and by a plurality of surface portions delimited by the surface. The electronic device is further formed by a plurality of first implanted regions having a second conductivity type, which extend into the drift region from the surface, and by a plurality of metal portions, which are arranged on the surface. Each metal portion is in Schottky contact with a respective surface portion of the plurality of surface portions so as to form a plurality of Schottky diodes formed by first Schottky diodes and second Schottky diodes, wherein the first Schottky diodes have, at equilibrium, a Schottky barrier having a height different from that of the second Schottky diodes.

Abstract: A circuit includes a current path and a negative bootstrap circuitry coupled to the current path. The current path is coupled between a floating voltage and a reference ground, and includes a current generator coupled through a resistor to the floating voltage at a first node of the current generator. The current generator is controlled by a pulse signal. The negative bootstrap circuitry includes a pump capacitor coupled to a second node of the current generator and to the reference ground. The pump capacitor is configured to provide a negative voltage at the second node of the current generator based on the pulse signal.