Abstract: According to one aspect, an integrated circuit includes: an electronic module configured to generate a voltage at an output, and an electronic control circuit coupled to an output of the electronic module, the electronic control circuit comprising an emissive electronic component. The electronic control circuit is configured to cause the emissive electronic component to emit light radiation as a function of a value of the voltage at the output of the electronic module relative to a value of an operating voltage of the electronic module, and the operating voltage is specific thereto during normal operation of this electronic module. The light radiation emitted by the emissive electronic component is configured to diffuse to an outer face of the integrated circuit.

Abstract: A circuit receives an input signal having a first level and a second level. A logic circuit includes a finite state machine circuit, an edge detector circuit, and a timer circuit. The finite state machine circuit is configured to set a mode of operation of the circuit. The edge detector circuit is configured to detect a transition between the first and second level. The timer circuit is configured to determine whether the first or second level is maintained over an interval, which starts from a transition detected by the edge detector circuit. The finite state machine circuit is configured to change the mode of operation based on the timer circuit determining that the first or second level has been maintained over the interval.

Abstract: An embodiment method of operating an imaging device including a sensor array including a plurality of pixels, includes: capturing a first low-spatial resolution frame using a subset of the plurality of pixels of the sensor array; generating, using a processor coupled to the sensor array, a first depth map using raw pixel values of the first low-spatial resolution frame; capturing a second low-spatial resolution frame using the subset of the plurality of pixels of the sensor array; generating, using the processor, a second depth map using raw pixel values of the second low-spatial resolution frame; and determining whether an object has moved in a field of view of the imaging device based on a comparison of the first depth map to the second depth map.

Abstract: An integrated circuit package includes a support substrate having a front side and a back side and an optical integrated circuit die having a back side mounted to the front side of the support substrate and having a front side with an optical sensing circuit. A glass optical element die has a back side mounted to the front side of the optical integrated circuit die over the optical sensing circuit. The mounting of the glass optical element die is made by a layer of transparent adhesive which extends to the cover the optical sensing circuit and a portion of the front side of the optical integrated circuit die peripherally surrounding the optical sensing circuit. An encapsulation material body encapsulates the glass optical element die and the optical integrated circuit die.

Abstract: A phase change filter is formed by an arrangement of dots, wherein each dot is made of a phase change material. A heating layer of electrically conductive material extends under the arrangement of dots. Current passing through the heating layer changes the dots between two states to alter attenuation of light passing through the filter.

Abstract: The present disclosure is directed to arranging user data memory cells and test memory cells in a configurable memory array that can perform both differential and single ended read operations during memory start-up and normal memory use, respectively. Different arrangements of the user data memory cells and the test memory cells in the memory array result in increased effectiveness of memory array, in terms of area optimization, memory read accuracy and encryption for data security.

Abstract: Disclosed herein is a method of operating a system in a test mode. When the test mode is an ATPG test mode, the method includes beginning stuck-at testing by setting a scan control signal to a logic one, setting a transition mode signal to a logic 0, and initializing FIFO buffer for ATPG test mode. The FIFO buffer is initialized for ATPG test mode by setting a scan reset signal to a logic 0 to place a write data register and a read data register associated with the FIFO buffer into a reset state, enabling latches of the FIFO buffer using an external enable signal, removing the external enable signal to cause the latches to latch, and setting the scan reset signal to a logic 1 to release the write data register and the read data register from the reset state, while not clocking the write data register.

Abstract: A semiconductor region includes an isolating region which delimits a working area of the semiconductor region. A trench is located in the working area and further extends into the isolating region. The trench is filled by an electrically conductive central portion that is insulated from the working area by an isolating enclosure. A cover region is positioned to cover at least a first part of the filled trench, wherein the first part is located in the working area. A dielectric layer is in contact with the filled trench. A metal silicide layer is located at least on the electrically conductive central portion of a second part of the filled trench, wherein the second part is not covered by the cover region.

Abstract: An oscillator circuit includes a total of N (N?2) class-D oscillator circuits stacked together between a supply voltage node and a reference voltage node. The output ports of adjacent class-D oscillator circuits in the disclosed oscillator circuit are coupled together by capacitors to ensure frequency and phase synchronization for the frequency signals generated by the class-D oscillator circuits. Compared with a reference oscillator circuit formed of a single class-D oscillator circuit, the oscillation amplitude of each of the class-D oscillator circuits in the disclosed oscillator circuit is 1/N of that of the reference oscillator circuit, and the current consumption of the disclosed oscillator circuit is 1/N of that of the reference oscillator circuit.

Abstract: A method of manufacturing an electronic module includes providing a base substrate having a first surface, providing a first supporting element having a first portion with an inclined top surface, and affixing the first supporting element to the first surface such that the inclined top surface is inclined with respect to the base substrate. A first reflector is coupled to the inclined top surface such that a rear surface of the first reflector is in physical contact with the inclined top surface of the first portion of the first supporting element, and a spacer structure is configured to form an interface for mounting lateral walls to the base substrate. A cap is positioned over and supported by the lateral walls to thereby define a chamber. The emitter, as well as a detector, are coupled to the first surface of the base substrate.

Abstract: An embodiment method of accessing a memory for reading and/or writing data comprises generating a memory transaction request comprising a burst of memory access requests towards a set of memory locations in the memory, the memory locations having respective memory addresses. The method further comprises transmitting via an interconnect bus to a memory controller circuit coupled to the memory a first signal conveying the memory transaction request and a second signal conveying information for mapping the burst of memory access requests onto respective memory addresses of the memory locations in the memory. The method further comprises computing, as a function of the information conveyed by the second signal, respective memory addresses of the memory locations, and accessing the memory locations to read data from the memory locations and/or to write data into the memory locations.

Abstract: A driving circuit including a reference voltage generator to generate a reference voltage based on an operating frequency of a complementary circuit; a comparator including a first input configured to receive a drain-to-source voltage of a field effect transistor; and a second input to receive the reference voltage; and a signal generator to deliver a driving signal to a gate terminal of the field effect transistor to drive the field effect transistor to an ON state after the drain-to-source voltage of the first low side field effect transistor becomes less than the reference voltage and to an OFF state after the drain-to-source voltage of the field effect transistor becomes greater than the reference voltage.

Abstract: A circuit device includes a directional coupler with a first port receiving a radiofrequency signal, a second port outputting a signal in response to signal received by the first port, and a third port outputting a signal in response to a reflection of the signal at the second port. An impedance matching network is connected between the second port and an antenna. The impedance matching network includes fixed inductive and capacitive components and a single variable inductive or capacitive component. A diode coupled to the third port of the coupler generates a voltage at a measurement terminal which is processed in order to select and set the inductance or capacitance value of the variable inductive or capacitive component.

Abstract: A bipolar junction transistor includes an extrinsic collector region buried in a semiconductor substrate under an intrinsic collector region. Carbon-containing passivating regions are provided to delimit the intrinsic collector region. An insulating layer on the intrinsic collector region includes an opening within which an extrinsic base region is provided. A semiconductor layer overlies the insulating layer, is in contact with the extrinsic base region, and includes an opening with insulated sidewalls. The collector region of the transistor is provided between the insulated sidewalls.

Abstract: A continuous time, sigma-delta analog-to-digital converter circuit includes a sigma-delta modulator circuit configured to receive an analog input signal. A single bit quantizer of the modulator generates a digital output signal at a sampling frequency. A data storage circuit stores bits of the digital output signal and digital-to-analog converter (DAC) elements are actuated in response to the stored bits to generate an analog feedback signal for comparison to the analog input signal. A filter circuit includes polyphase signal processing paths and a summation circuit configured to sum outputs from the polyphase signal processing paths to generate a converted output signal. A fan out circuit selectively applies the stored bits from the data storage circuit to inputs of the polyphase signal processing paths of the filter circuit.

Abstract: A wireless power receiver includes a rectifier with first and second inputs coupled to first and second terminals of a receiver coil, and having a first output coupled to ground and a second output at which a rectified voltage is produced. A first switch is coupled between the second input and ground, and is controlled by a first gate voltage generated at a first node. A second switch is coupled between the first node and ground, and is controlled by a second gate voltage. The first gate voltage closes the first switch to couple the second input to ground when the rectified voltage is less than a threshold voltage, boosting the rectified voltage. The second gate voltage closes the second switch to cause the second gate voltage to be pulled to ground when the rectified voltage is greater than the threshold voltage, limiting the boosting of the rectified voltage.

Abstract: A time-interleaved analog to digital converter (TI-ADC) includes a first sub-ADC configured to sample and convert an input analog signal to generate a first digital signal and a second sub-ADC configured to sample and convert said input analog signal to generate a second digital signal. Sampling by the second sub-ADC occurs with a time skew mismatch. A multiplexor interleaves the first and second digital signals to generate a third digital signal. A time skew mismatch error determination circuit processes the first and second digital signals to generate a time error corresponding to the time skew mismatch. A slope value of said third digital signal is determined and multiplied by the time error to generate a signal error. The signal error is summed with the third digital signal to generate a digital output signal which eliminates the error due to the time skew mismatch. This correction is performed in real time.

Abstract: A memory array includes a plurality of bit-cells arranged as a set of rows of bit-cells intersecting a plurality of columns. The memory array also includes a plurality of in-memory-compute (IMC) cells arranged as a set of rows of IMC cells intersecting the plurality of columns of the memory array. Each of the IMC cells of the memory array includes a first bit-cell having a latch, a write-bit line and a complementary write-bit line, and a second bit-cell having a latch, a write-bit line and a complementary write-bit line, wherein the write-bit line of the first bit-cell is coupled to the complementary write-bit line of the second bit-cell and the complementary write-bit line of the first bit-cell is coupled to the write-bit line of the second bit-cell.

Abstract: A substrate of a lead frame is made of a first material. The substrate is covered by a barrier film made of a second material, different from the first material. The barrier film is then covered by a further film made of the first material. A first portion of the lead frame is encapsulated within an encapsulating body in a way which leaves a second portion of lead frame extending out from and not being covered by the encapsulating body. A first portion of the further film which is not covered by the encapsulating body is then stripped away to expose the barrier film at the second portion of the lead frame. A second portion of the further film is left remaining encapsulated by the encapsulating body. The exposed barrier film at the second portion of the lead frame is then covered with a tin or tin-based layer.

Abstract: An electronic device includes an electronic die in a package and a heat diffusion element. The heat diffusion element is made of a thermally-conductive material and is formed of a single block (unitary body) that includes: a main portion resting on at least a portion of an upper surface of the electronic die; at least one secondary portion flush with an upper surface of the package; and at least one intermediate portion coupling the main portion to the at least one secondary portion.