Abstract: A secure element device that is configured to be cryptographically bound to a host device includes a secure element host key slot configured to store host key information that allows only the host device to control the secure element, a secure memory storing binding information, and limited functionality allowing the binding information to be read from the secure memory by the host device during a binding process. The binding information is cryptographically correlated with the host key information. The host key information is generated by the host device using the binding information read from the secure element and a secret key. The secure element device further includes general functionality only accessible to the host device using the host key information that is generated by the host device. The secure memory includes prevention measures impeding unauthorized entities from obtaining information from the secure memory.

Abstract: Semiconductor chips to be singulated to individual semiconductor devices are arranged onto respective adjacent areas of a mounting substrate such as a pre-molded leadframe. The mounting substrate is made of a laminar, electrically conductive sculptured structure with molded electrically insulating material. Electrically conductive side formations in the adjacent areas of the mounting substrate include first and second pads at front and back surfaces, respectively, of the mounting substrate. The first contact pads at the front surface of the substrate include narrowed portions having side recesses. The second contact pads at the back surface of the substrate include widened portions having side extensions adjacent the side recesses. The electrically insulating material extends into the side recesses to provide anchoring formations of the insulating material to the electrically conductive sculptured structure of the mounting substrate.

Abstract: A semiconductor chip is arranged over a substrate in the form of a leadframe. A set of current-carrying formations configured as conductive ribbons are coupled to the semiconductor chip. The substrate does not include electrically conductive formations for electrically coupling the conductive ribbons to each other. Electrical contacts are formed via wedge bonding, for instance, between adjacent ones of the conductive ribbons so that a contact is provided between the adjacent ones of the conductive ribbons in support of a multi-formation current-carrying channel.

Abstract: A semiconductor chip is arranged on a first surface of a die pad in a substrate (leadframe) including an array of electrically conductive leads. An encapsulation of laser direct structuring (LDS) material encapsulates the substrate and the semiconductor chip. The encapsulation has a first surface, a second surface opposed to the first surface and a peripheral surface. The array of electrically conductive leads protrude from the peripheral surface with areas of the second surface of the encapsulation arranged between adjacent leads. LDS structured areas of the second surface located between adjacent leads in the array of electrically conductive leads provide a further array of electrically conductive leads exposed at the second surface. First and second electrically conductive vias extending through the encapsulation material as well as electrically conductive lines over the encapsulation material provide an electrical bonding pattern between the semiconductor chip and selected ones of the leads.

Abstract: An embodiment inertial measurement system includes: at least one motion sensor to output motion data with an output data rate (ODR) period; and a control unit coupled to the motion sensor to control operation thereof based on a power mode switching, according to which each ODR period includes: a first phase, in which the motion sensor is controlled in a condition of low power consumption; and a subsequent measurement phase, in which the motion sensor is controlled to perform measurements for generation of measurement data. The control unit adaptively adjusts the duration of the ODR period based on at least one check related to the measurement data generated during the measurement phase.

Abstract: Disclosed herein is a time of flight sensing module that includes a reflected laser light detector formed on a printed circuit board, and a plurality of laser modules positioned about a periphery of the reflected laser light detector. Each laser module includes an interposer substrate vertically spaced apart from the printed circuit board, at least one laser diode carried by the interposer substrate, and a diffuser spaced apart from the interposer substrate and over the at least one laser diode. A lens may be positioned over the reflected laser light detector, and the plurality of laser modules are positioned about the periphery of the lens.

Abstract: In accordance with an embodiment, a physically unclonable function device includes a set of floating gate transistor pairs, floating gate transistors of the set of floating gate transistor pairs having a randomly distributed effective threshold voltage belonging to a common random distribution; a differential read circuit configured to measure a threshold difference between the effective threshold voltages of floating gate transistors of floating gate transistor pairs of the set of floating gate transistor pairs, and to identify a floating gate transistor pair in which the measured threshold difference is smaller than a margin value as being an unreliable floating gate transistor pair; and a write circuit configured to shift the effective threshold voltage of a floating gate transistor of the unreliable floating gate transistor pair to be inside the common random distribution.

Abstract: An embodiment device includes an optical source configured to transmit an optical pulse and an optical sensor configured to receive a reflection of the optical pulse. The device further includes a processor configured to determine a parameter based on the reflection, the parameter indicative of a distance between the device and a target; and a controller configured to generate a first control signal based on the parameter, the first control signal being configured to control an operation of the optical source.

Abstract: A cavity type semiconductor package with a substrate and a cap is disclosed. The semiconductor package includes a first semiconductor die coupled to the substrate and a layer of flexible material on a surface of the cap. A trace is on the layer of flexible material. The cap is coupled to the substrate with the layer of flexible material and the trace between the cap and the substrate. A second semiconductor die is coupled to the layer of flexible material and the trace on the cap. The cap further includes an aperture to expose the second semiconductor die to the ambient environment. The layer of flexible material absorbs stress during operation cycles of the package induced by the different coefficient of thermal expansions of the cap and the substrate to reduce the likelihood of separation of the cap from the substrate.

Abstract: A method includes determining a number of drive pulses of equal width and amplitude that would drive LEDs with a total charge during a frame. If the width of the drive pulses is greater than a minimum-width and less than a maximum-width, the LEDs are driven with the drive pulses. If the width of the drive pulses is less than the minimum-width and an amplitude of the drive pulses is greater than a minimum-amplitude, decrement the amplitude of the drive pulses and recalculate the width of the drive pulses so each drive pulse has the decremented amplitude and recalculated width. If the amplitude of the drive pulses is equal to the minimum-amplitude, reduce the number of drive pulses and recalculate the width and amplitude of the reduced number of drive pulses. If the amplitude of the drive pulses is equal to the minimum-amplitude, the LEDs are not driven.

Abstract: An optical beam steering device and a method for beam steering are described. The optical beam steering device including: a laser source coupled to an optical phased array (OPA) The OPA includes: a beam splitter network optically coupled to the laser source and configured to split a laser beam generated by the laser source into N outputs to generate an output optical beam; a first network of first phase shifters configured to steer the output optical beam in a first direction away from a longitude direction; and a second network of second phase shifters configured to steer the output optical beam in a second direction away from the longitude direction, the second direction being opposite to the first direction.

Abstract: An operation of calibrating the object using a reference reader is performed, the calibration operation including an operation of placing the reference reader at various distances away from the object that correspond to various values of a parameter within the object that is representative of the intensity of the signal received by the object, and, for each distance, an operation of determining an internal phase-shift compensation in the object with respect to a nominal internal phase shift, making it possible to obtain a load modulation amplitude that is higher, in terms of absolute value, than a threshold, and an operation of storing a lookup table of the various values of the parameter and the corresponding internal phase-shift compensations.

Abstract: A transmitter circuit receives a PWM input signal and a clock signal. A logic circuit generates a control signal as a function of the clock signal. The control signal is normally set to high, and is periodically set to low for a transmission time interval when an edge is detected in the clock signal. The transmission time interval is shorter than a half clock period of the clock signal. A tri-state transmitter receives the PWM input signal and the control signal, and produces first and a second output signals at first and second transmitter output nodes, respectively. The output signals have a voltage swing between a positive voltage and a reference voltage. An output control circuit is sensitive to the control signal and is coupled to the first and second transmitter output nodes.

Abstract: An integrated circuit includes an input pad and a Schmitt trigger coupled to the input pad. The Schmitt trigger includes a main PMOS branch that charges an intermediate node of the Schmitt trigger responsive to voltage transitions at the input node. The Schmitt trigger includes a charging assistance circuit that helps to rapidly charge the intermediate node of the Schmitt trigger. The charging assistance circuit includes a parallel PMOS branch in parallel with the main PMOS branch.

Abstract: A support substrate has a mounting face and a connection face opposite to the mounting face. An electronic chip is mounted to the mounting face and a matrix of connectors is mounted to the connection face. The support substrate includes an interconnection structure formed by a pair of conductive interconnection tracks that electrically connect the electronic chip to the matrix of connectors and circulate differential signals. The two interconnection tracks of the pair of conductive interconnection tracks extend facing each other at different depths of the support substrate. An isolation structure in the support substrate laterally isolates the pair of conductive interconnection tracks. Isolation plates above and below the pair of conductive interconnection tracks provide further isolation.

Abstract: A pixel includes a sensing element and red, green and blue first light emitters. The number of light emitters of each green, red and blue color is equal in each pixel. The pixel may further include a second light emitter which emits light that is different from blue light, green light or red light.

Abstract: A metal layer is deposited on a wafer that has silicon carbide, wherein the metal layer forms a contact face. A laser annealing is performed at the contact face using a laser beam application that causes the metal layer to react with the wafer and form a silicide layer. The laser beam has a footprint having a size. To laser anneal the contact face, a first portion of the contact face is irradiated, the footprint of the laser beam is moved by a step smaller than the size of the footprint, and a second portion of the contact face is irradiated, thereby causing the first portion and the second portion of the contact face to overlap.

Abstract: Data structure and microcontroller architecture performing binary multiply-accumulate operations using multiple partial copies of weights. Destination-register location, source-register location, and weight-register location are received. Using the weight-register location, a sub-set of the weight bits is copied a select number of times based on a filter index value that is received. Each copy of the sub-set of weights is executed in parallel. Using the source-register location, a sub-set of the input bits is selected based on the size of the sub-set of weights, wherein the sub-set of input bits is shifted one bit from a previous sub-set of input bits. XOR operation is performed on each corresponding bit in the copy of the sub-set of weights with each corresponding bit in the selected sub-set of input bits. In a corresponding destination sub-location, output of each XOR operation is aggregated with each other and with current value of the corresponding destination sub-location.

Abstract: A microelectromechanical gyroscope includes a support structure, a driving mass movable according to a driving axis; and an oscillating microelectromechanical loop. The microelectromechanical loop has a resonance frequency and a loop gain and includes the driving mass, a sensing interface that senses a position of the driving mass, and a gain control stage that maintains a modulus of the loop gain at a unitary value at the resonance frequency. The gain control stage includes a sampler and an transconductance operational amplifier in an open-loop configuration. The sampler acquires samples of a loop signal from the sensing interface in a first operative condition and transfers them to the transconductance operational amplifier in a second operative condition. The sampler decouples the transconductance operational amplifier from the sensing interface in the first operative condition and in the second operative condition.

Abstract: A circuit includes an amplifier, a bias voltage node, and a first set of switches configured, based on a first reset signal having a first value, to couple first and second input nodes to the bias voltage node and to couple first and second output nodes of the amplifier. First and second feedback branches each include a respective RC network including a plurality of capacitances. The first and second feedback branches further include a second set of switches intermediate input nodes and the capacitances, and a third set of switches intermediate input nodes and the plurality of capacitances. These switches selectively couple the capacitances to the input nodes and output nodes, based on a second reset signal having a first value. The second reset signal keeps the first value for a determined time interval exceeding a time interval in which the first reset signal has the first value.