Abstract: A system and method utilized to receive an integrated circuit (IC) design and generating a graph based on a plurality of sub-circuits of the IC design. Further, one or more candidate sub-circuits are determined from the plurality of sub-circuits based on the graph. Additionally, one or more sub-circuits are identified from the one or more candidate sub-circuits based on a number of transistors and a number of edges within each of the plurality of sub-circuits. An indication of the identified one or more sub-circuits is provided.

Abstract: A method for assigning connections between IO pad pins and connectors on an integrated circuit (IC) die. A pattern (300) including a physical layout of connectors (302) and pad pins (304) is associated with a mapping of connections between the connectors (302) and the pad pins (304). A processor (204) identifies instances (402, 404) of the pattern (300) within a design image (400) of an integrated circuit (IC) die using a machine learning model. The design image (400) includes a physical layout of connectors (414) and pad pins (416). For each identified instance (402, 404) of the pattern (300) within the design image (400), the mapping of connections is assigned to respective connectors (414) and pad pins (416) in the identified instance (402, 404).

Abstract: An input buffer circuit includes a tracking circuit that produces a tracking signal and an inverter including a cascade of low voltage switching devices coupled to an output of the tracking circuit. The tracking signal follows a first signal during a first time period and a second signal during a second time period. The tracking circuit is configured to reduce an input high voltage/input low voltage (VIH/VIL) spread.

Abstract: A system performs logic simulation of a circuit design specified using a hardware description language such as Verilog. The system performs constraint solving based on an expression specified in the specification of the circuit design. The system identifies required bits for each variable in the expression. The number of required bits is less than the number of bits specified in the variable declaration. The system performs bit-level constraint solving by performing a bit operation on the set of required bits and a simplified processing of the remaining bits of the variable. Since the original circuit design is preserved with the original bit-widths for simulation, those required bits are used on the fly internally during constraint solving. Furthermore, dynamic bit reductions on arithmetic operations are performed on the fly. The system improves computational efficiency by restricting bit operations to fewer bits of variables and operators of the expression.

Abstract: Disclosed are systems, methods and computer readable mediums for intelligent and directed dynamic application security testing. The systems, methods and computer-readable mediums can be configured to receive an attack location and an attack type for a web-application, transmit the attack location and attack type to a ID-DAST platform, receive from the ID-DAST platform a payload, attack the web-application using the payload, and receive results of the attack.

Abstract: Energy consumption is reduced within an Internet of Things (IoT) device, without degrading operating performance of the corresponding internal circuitry. A first internal supply voltage (VDDa) used to supply the internal circuitry is reduced from a VDD supply voltage to a lower voltage during an idle state, thereby reducing leakage currents in the internal circuitry. The first internal supply voltage (VDDa) may be reduced to a voltage that is one threshold voltage (Vtp) lower than the VDD supply voltage. A second internal supply voltage (VSSa) used to supply the internal circuitry is increased from the VSS supply voltage to a voltage higher than the VSS supply voltage during the idle state, thereby further reducing leakage currents in the internal circuitry. The second internal supply voltage (VSSa) may be increased to a voltage that is one threshold voltage (Vtn) higher than the VSS supply voltage.

Abstract: Sets of objects may be received which are desired to be stored using a nested hash map, where the nested hash map may include multiple levels, and where each set of objects in the sets of objects may correspond to a level in the nested hash map. The nested hash map may be created from a bottom level of the nested hash map to a top level of the nested hash map, which may include: creating a first hash map at a first level of the nested hash map, creating a first shared pointer which points to the first hash map, and creating a second hash map at a second level which is immediately above the first level, where the second hash map maps at least one object to the first shared pointer.

Abstract: A method includes acquiring a vector data signal associated with a circuit design, performing a timing update to determine timing information for the circuit design, and identifying a glitch in the circuit design based on a shifted vector waveform. The timing information includes a signal delay associated with a cell of the circuit design. The shifted vector waveform is generated by shifting the vector data signal based on the timing information.

Abstract: A dual-rail memory includes, in part, a memory array that operates using a first supply voltage, and a periphery circuit that operates using a second supply voltage. The periphery circuit includes, in part, a clock generation circuit and a comparator. The dual-rail memory also includes a level shifter that varies the voltage level of a number of signals of the memory between the first and second supply voltages. The clock generation circuit is adapted, among other operations, to generate a read clock signal in response to a read request signal. The level shifter is adapted to supply a reference wordline read signal in response to the read clock signal. The comparator is adapted to select a delay between the read clock signal and the reference wordline read signal in response to a difference between the first and second supply voltages.

Abstract: A routing process applied to design integrated circuits uses keep-through regions. Keep-through regions specify areas which metal shapes may overlap but where metal shapes may not have line ends. The keep-through regions are generated based on end-of-line rules applicable to routing of the design. These keep-through regions are then used in determining the layout of interconnects for the design.

Abstract: A system and method of detecting defects in an analog circuit is provided. A method includes identifying a channel connected block (CCB) from a netlist, creating defect for the CCB to be injected during a simulation, obtaining a first measurement of an output node of the CCB by performing a first analog circuit simulation for the CCB based on providing excitations as inputs to the CCB and obtaining a second measurement of the output node of the CCB by performing a second analog circuit simulation for the CCB based on providing the excitations as the inputs to the CCB and injecting the defect. The method can further include determining a defect type based on the first measurement and the second measurement.

Abstract: An integrated circuit (IC) may include a set of instruction list engines (ILEs) that execute in parallel, where each ILE stores a subset of a set of instructions for processing a header of a frame, and where each ILE generates an ILE result based on executing the subset of the set of instructions. The IC may include a circuit to determine a result of parsing the header of the frame based on merging ILE results generated by the set of ILEs.

Abstract: A method is provided. The method includes obtaining, for a particular integrated (IC) design, register transfer level (RTL) code and unified power format (UPF) settings, generating an RTL feature array from the RTL code, arranging features based on a UPF into a UPF feature array, generating, by a processor, a combined feature array for the particular IC design by combining the RTL feature array and the UPF feature array, comparing the combined feature array for the particular IC design with another combined feature array, and reporting differences, based on the comparing, between the combined feature array and the other combined feature array to identify changes in at least one of the RTL code and the UPF settings that resulted in a change in a number of power violations.

Abstract: Systems and methods disclosed include receiving defect data from a test of a semiconductor device comprising a circuit, the circuit comprising a cell, the cell comprising a first input, a second input and an output, and modeling a first plurality of cell defect modes of the cell with a first multiple input transition cell fault model (MTCFM), the cell defect modes associated with a first signal transition on the first input, and a second signal transition on the second input or the output. Systems and method further include correlating the first plurality of cell defect modes to the defect data to produce a probability of each of the first plurality of cell defect modes matching the defect data, and providing, to a user, an indication of each of at least one of the first plurality of cell defect modes having the probability exceeding a defect probability threshold.

Abstract: A static random access memory (SRAM) system includes a plurality of SRAM storage cells, each of the plurality of SRAM storage cells coupled to a respective read bit line, and a dynamic keeper coupled to the read bit line. The dynamic keeper includes a first keeper to support a read operation at a first temperature range, and a second keeper to support the read operation at a second temperature range, and a temperature-sensitive control circuit to select the first keeper or the second keeper based on temperature.

Abstract: Disclosed herein are computer-implemented method, system, and computer-program product (computer-readable storage medium) embodiments for discovering contextualized placeholder variables in template code. Some embodiments include invoking a render call to a template engine to render an input template and then receiving a message identifying a placeholder variable within the input template in response to invoking the render call. These embodiments may further include generating multiple rendered templates by rendering the input template based at least in part on a unique value and a modified unique value for the placeholder variable. Further still, these embodiments may also include storing the placeholder variable in a security vulnerability data structure in response to detecting a change in context associated with the placeholder variable between the multiple rendered templates.

Abstract: Duty cycle adjustment circuitry includes a first stage, a second stage, and decoder circuitry. The first stage includes a first strength tuning circuit having first inverter branches, and a first fine tuning circuit having second inverter branches. The first strength tuning circuit and the first fine tuning circuit are coupled in parallel. The second stage includes a second strength tuning circuit having third inverter branches, and a second fine tuning circuit having fourth inverter branches. The second strength tuning circuit and the second fine tuning circuit are coupled in parallel. Further, the second stage is electrically coupled to the first stage. The decoder circuitry is electrically coupled to the first stage and the second stage. The decoder circuitry controls the first strength tuning circuit independently from the first fine tuning circuit to adjust the duty cycle of an input signal received by the duty cycle adjustment circuitry.

Abstract: A system performs mask rule checks (MRC) for curvilinear shapes. The width of a curvilinear shape is different along different parts of the shape. A medial axis for a curvilinear shape is determined. The medial axis is trimmed to exclude portions that are within a threshold distance from corners or too far from edges. The trimmed medial axis is used to perform width checks for mask rules. The system generates medial axis between geometric shapes and uses it to determine whether two geometric shapes are at least a threshold distance apart. The system performs acute angle checks for sharp corners. The system determines angles using lines drawn from vertices to end points on the boundary of the shape that are at a threshold distance. These angles are used for checking acute angle mask rule violations.

Abstract: A system and method for generating simulation-friendly compact physical models for passive structures is disclosed. The method includes generating an impedance map specifying impedances at a plurality of frequencies corresponding to one or more port-pairs of a circuit component using a processor to extract a plurality of impedance values between the one or more port-pairs based on a first value for each parameter of a plurality of parameters of the circuit component. The method includes generating a second circuit representation model based on updating the plurality of impedance values between the one or more port-pairs based on a second value for one or more parameters of the plurality of parameters of the circuit component, and updating the second circuit representation model by tuning the updated plurality of impedance values of the between the one or more port-pairs based on a predetermined use context of the circuit component in a circuit.

Abstract: An integrated circuit (IC) chip may include a first gate-all-around (GAA) device and a second GAA device. The first GAA device may include a first set of silicon dioxide structures around a first set of silicon channels, a first set of hafnium dioxide structures around the first set of silicon dioxide structures, and a first metal structure around the first set of hafnium dioxide structures. The second GAA device may include a second set of silicon dioxide structures around a second set of silicon channels, and a second metal structure around the second set of silicon dioxide structures. Each silicon dioxide structure in the first set of silicon dioxide structures may have a first thickness. Each silicon dioxide structure in the second set of silicon dioxide structures may have a second thickness, which is greater than the first thickness.