Abstract: An electromagnetic wave shielding film includes an insulating protective layer, and a release film covering a surface of the insulating protective layer. The release film has a transmittance of 20-80% at a wavelength of 535 nm, a tight attachment confirmability index Ia of 11 or more, the tight attachment confirmability index Ia being represented by expression 1, and a presence visibility index Iv of 11 or more, the presence visibility index Iv being represented by expression 2. Ia=(?L*12+?a*12+?b*12)0.5??(expression 1) Iv=(?L*22+?a*22+?b*22)0.

Abstract: A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including 5 to 30 parts by mass of solid epoxy resin that is solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin that is liquid at normal temperature, (B) 200 to 1800 parts by mass of silver-coated copper alloy particles in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A), and (C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).

Abstract: The present invention provides a connector that can be easily and properly connected to a sheet-like electrically conductive member that is provided with a plurality of electrically conductive portions arranged at different height positions in the thickness direction. A connector 1 includes a plurality of contacts 2, a body housing 5 that holds the contacts 2, and a cover housing 7 that is attached to the body housing 5. The body housing 5 has a plurality of holding portions 51 that hold the contacts 2. The holding portions 51 are provided in the body housing 5 so as to hold the contacts 2 at different height positions in the thickness direction of the body housing 5. A plurality of electrically conductive portions 101 come into contact with the contacts 2 in a state where an electrically conductive member 100 is sandwiched between the cover housing 7 and the body housing 5.

Abstract: An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.

Abstract: Provided is an optical fiber coupler capable of suppressing variation of polarization state of light passing through a coupler portion. The optical fiber coupler includes: a substrate having a groove; a coupler portion which is inserted into the groove and to which a middle portion of each of optical fibers is joined; and an adhesive for bonding the coupler portion to the substrate. Shore D hardness of the adhesive is 10 to 35. By setting the Shore D hardness of the adhesive to 10 to 35, it is possible to suppress the variation of the polarization state of the light passing through the coupler portion.

Abstract: Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. A heat dissipation material having adhesive is obtained by coating a portion or the whole of the heat dissipation material with a heat dissipation material adhering composition including a resin component containing an epoxy resin, a curing agent, and an inorganic filler, and having a complex viscosity at 80° C. of 1×103 Pa·s to 5×106 Pa·s.

Abstract: A shield package is disclosed including: a package in which an electronic component is mounted on a substrate, the electronic component being sealed with sealing material; and a shield layer including a first layer and a second layer that are sequentially laminated on the package, in which the first layer made from a conductive resin composition having 100 parts by mass of a binder component, 400 parts by mass to 1800 parts by mass of metal particles, and 0.3 part by mass to 40 parts by mass of a curing agent, the metal particles include at least spherical metal particles and flaky metal particles, and the second layer made from a conductive resin composition containing a binder component, metal particles haying an average particle diameter of 10 nm to 500 nm, metal particles having an average particle diameter of 1 ?m to 50 ?m, and a radical polymerization initiator.

Abstract: To provide a liquid leakage detection device in which restriction of of a patient is alleviated as compared with the related art while receiving an injection. A liquid leakage detection device 2 detects that an injection solution to be injected into a blood vessel 4 leaks to the outside of the blood vessel 4. The liquid leakage detection device 2 includes a plurality of thermocouples 18 attached to a body surface around a puncture site 16 of an injection needle 12 for injecting the injection solution, an acquisition device 34 which acquires a value indicating a body surface temperature at an attachment point of each of the thermocouples 18 based on an output of each of the thermocouples 18, and a determination device 14 which determines that the injection solution leaks to the outside of the blood vessel when the acquired value deviates from a normal temperature of the body surface temperature at the attachment point.

Abstract: An affixation film 101 for a printed wiring board includes a circuit pattern concealing layer 112, and an adhesive layer 111 put on top of the circuit pattern concealing layer 112. An opposite surface of the circuit pattern concealing layer 112 from the adhesive layer 111 has an Rku of 2.5-3.0.

Abstract: The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×104 Pa to 4.0×105 Pa.

Abstract: The present invention provides a metal-ceramic base material and the like which allow a ceramic base material and a desired metal material to be easily joined. A metal-ceramic base material (30) to be joined to a metal material (40), includes: a ceramic base material (20); and a metal film (25) provided on the ceramic base material (20), the metal film (25) being formed by thermal spray of a mixed powder material containing aluminum, alumina, and nickel, at least part of the nickel being exposed on a surface of the metal film (25).

Abstract: A light interference unit includes a branching optical element, a multiplexing optical element, and at least one fiber device. The branching optical element branches a laser light with an emission wavelength temporally swept, into a measurement light and a reference light. The multiplexing optical element multiplexes the reference light and the measurement light reflected by a measured object, and causes them to interfere. The fiber device includes a reference light device. A transmission light path length is a light path length of the reference light transmitting the reference light device, from the reference light device to the multiplexing optical element. A reflection light path length is a light path length of the reference light reflected by a separation portion of the reference light device, from the reference light device to the multiplexing optical element. The transmission light path length is equal to or more than the reflection light path length.

Abstract: The present invention provides an electric wire joining structure (80), an electric wire joining method, and a terminal (1), each of which allows a reduction in burden on an operator. The present invention includes: one or more electric wires (10); a terminal (1) including one or more insertion holes (7) for the respective one or more electric wires (10), the one or more electric wires (10) being inserted into the respective insertion holes (7); and a joining part (20) formed by thermal spraying, the joining part (20) joining the one or more electric wires (10) to the terminal (1) on a side on which the one or more electric wires (10) have passed through the respective one or more insertion holes (7).

Abstract: Provided are (i) a solder connection structure having improved solder wettability and including an aluminum base material and (ii) a film forming method for forming, on the aluminum base material, a metal film having high solder wettability. A solder connection structure (50) includes (i) an aluminum substrate (30), (ii) an Ni film (35) formed on the aluminum substrate by a cold spray method, and (iii) a mixed metal film (40) provided on the Ni film, the mixed metal film (40) being formed by the cold spray method with use of a mixed powder material, the mixed powder material being a mixture of Ni powder (41) and Sn powder (42).

Abstract: A heat dissipation substrate is disclosed including a base substrate having a first surface and a second surface, an electrically conductive path formed on the first surface, a through-hole penetrating from the first surface to the second surface, a heat dissipation member that is inserted into the through-hole and at least a part of which projects from the first surface, a thermally conductive resin constituent, covering a side surface of the heat dissipation member, that is present, without space, between an inner peripheral surface of the through-hole and an outer peripheral surface of the heat dissipation member surrounded by the inner peripheral surface, and a metal layer covering the heat dissipation member projecting from the first surface, in which an outer surface of the metal layer and an outer surface of the electrically conductive path are disposed on substantially the same plane.

Abstract: Provided is a sheet sensor comprising an anisotropically-conductive sheet exhibiting conductivity in a thickness direction and having a first surface as a contact surface for a sensing target object, and multiple conductive members electrically connected to a second surface of the anisotropically-conductive sheet and electrically insulated from each other.

Abstract: An electrode material (1) includes: a porous support (2); and silver chloride (4) supported on the porous support (2). The porous support (2) is, for example, silica. The silica may be: wet-process silica such as precipitated silica or gelation method silica; dry-process silica; or the like.

Abstract: A stretchable conductive film for textiles 1 includes a stretchable conductive layer 3, and a hot-melt adhesive agent layer 4 formed on one surface of the stretchable conductive layer 3. The stretchable conductive film for textiles 1 may also include a first peel film 2 formed on a surface of the stretchable conductive layer 3 on the opposite side from the hot-melt adhesive agent layer 4 side, and a second peel film 5 formed on a surface of the hot-melt adhesive agent layer 4 on the opposite side from the stretchable conductive layer 3 side.