Abstract: Provided is a connector terminal, including: a tubular section having a lance formed by cutting a part of a peripheral wall thereof and raising the same about its base part. At least a portion of the peripheral wall in which the lance is cut and raised is curved to bulge outward as seen from an opening direction of the tubular section. The lance has a pair of end edges opposed to each other in a width direction orthogonal to a direction in which the lance extends, and at least one of the pair of end edges at least on the side of the base part of the lance is formed to come close to an opposed one of the at least one of the end edges as it advances toward a leading end of the lance. Also provided are a connector including the connector terminal, and a size adjustment device.

Abstract: Provided is a biological electrode tool including an electrode portion (10) attached to a human body to acquire a biological signal, and a lead portion (20) for externally leading out the biological signal from the electrode portion (10). The entire areas of the upper and lower surfaces of the electrode portion (10) are covered with a nonwoven fabric (30) except for a portion that contacts the living body (13). The entire areas of the upper and lower surfaces of the lead portion (20) are also covered with nonwoven fabric except for an external lead-out end portion (14). The full circumferential peripheries of the nonwoven fabrics (30) on the upper and lower surfaces of the electrode portion (10) and the lead portion (20) are bonded except for the portion that contacts the living body (13) and the external lead-out end portion (14). Neither the electrode (11) of the electrode portion (10) nor a thin-film lead wire (21) of the lead portion (20) are exposed.

Abstract: A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including a solid epoxy resin that is a solid at normal temperature and a liquid epoxy resin that is a liquid at normal temperature, (B) 500 to 1800 parts by mass of metal particles that have a tap density of 5.3 to 6.5 g/cm3 with respect to 100 parts by mass of the binder component (A), (C) 0.3 to 40 parts by mass of a curing agent that contains at least one imidazole type curing agent with respect to 100 parts by mass of the binder component (A), and (D) 150 to 600 parts by mass of a solvent with respect to 100 parts by mass of the binder component (A).

Abstract: A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including 5 to 30 parts by mass of solid epoxy resin that is solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin that is liquid at normal temperature, (B) 200 to 1800 parts by mass of silver-coated copper alloy particles in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A), and (C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).

Abstract: A shield package is disclosed including: a package in which an electronic component is mounted on a substrate, the electronic component being sealed with sealing material; and a shield layer including a first layer and a second layer that are sequentially laminated on the package, in which the first layer made from a conductive resin composition having 100 parts by mass of a binder component, 400 parts by mass to 1800 parts by mass of metal particles, and 0.3 part by mass to 40 parts by mass of a curing agent, the metal particles include at least spherical metal particles and flaky metal particles, and the second layer made from a conductive resin composition containing a binder component, metal particles haying an average particle diameter of 10 nm to 500 nm, metal particles having an average particle diameter of 1 ?m to 50 ?m, and a radical polymerization initiator.

Abstract: An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.

Abstract: A conductive adhesive contains a thermosetting resin (A), a conductive filler (B), and a filling-performance improver (C). The thermosetting resin (A) contains a first resin component (A1) having a first functional group, and a second resin component (A2) having a second functional group that reacts with the first functional group. The filling-performance improver (C) contains an organic salt. The conductive adhesive contains from 40 to 140 parts by mass of the filling-performance improver (C) relative to 100 parts by mass of the thermosetting resin.

Abstract: The present invention molds, with simple processes, a tube which has a smaller outer diameter and is hardly bent in a folded manner. The present invention includes (i) a primary molding step of forming a primary molded body by carrying out resin molding while a reinforcing member and a core pin (4) are placed in a cavity of a first mold made up of a lower mold (30) and an upper mold (40) for primary molding and (ii) a secondary molding step of covering the reinforcing member by carrying out resin molding while the primary molded body is placed in a cavity of a second mold that has an inner diameter larger than an inner diameter of the cavity of the first mold.

Abstract: Provided is a connector terminal including a connection part having three or more conductive pieces arranged at intervals from each other around a central axis, wherein each of the three or more conductive pieces has a plate shape with its inside surface directed toward the central axis, wherein a distal end portion including a distal end of each conductive piece is inclined to be away from the central axis as it advances toward the distal end thereof, and wherein a surface of the distal end portion includes a distal end surface, an outside surface located opposite to the inside surface, and a connection surface that connects the distal end surface and the outside surface and that is inclined relative to the distal end surface and the outside surface. Also provided are a connector including the connector terminal, and a method for producing the connector terminal.

Abstract: An object of the present invention is to provide a lead wire having a conductor that is hardly pulled out from the lead wire during the peeling process or the like while being formed of carbon fibers. In the present invention, a belt-shaped conductor formed of a plurality of carbon fibers are included in a lead wire having a circular cross section.

Abstract: The present invention aims to provide a ground member that can be mounted on any position, wherein misalignment is less likely to occur between conductive filler particles of the ground member and a shielding layer of a shielding film when a shielded printed wiring board including the ground member is repeatedly heated and cooled to mount components thereon. The ground member of the present invention includes: a conductive external connection member having a first main surface and a second main surface opposite to the first main surface; conductive filler particles disposed adjacent to the first main surface; and an adhesive resin for fixing the conductive filler particles to the first main surface, wherein each conductive filler particle includes a low-melting-point metal.

Abstract: A silver chloride paste contains: a binder resin; and supported silver chloride that includes (i) a support and (ii) silver chloride supported on the support. The binder resin is, for example, a polyester resin. The support is, for example, silica.

Abstract: A light interference unit includes a branching optical element, a multiplexing optical element, and at least one fiber device. The branching optical element branches a laser light with an emission wavelength temporally swept, into a measurement light and a reference light. The multiplexing optical element multiplexes the reference light and the measurement light reflected by a measured object, and causes them to interfere. The fiber device includes a reference light device. A transmission light path length is a light path length of the reference light transmitting the reference light device, from the reference light device to the multiplexing optical element. A reflection light path length is a light path length of the reference light reflected by a separation portion of the reference light device, from the reference light device to the multiplexing optical element. The transmission light path length is equal to or more than the reflection light path length.

Abstract: A terminal metal fitting 1 includes a terminal connection portion 2 connected to a partner terminal metal fitting, and a wire holding portion 3 provided at the back of the terminal connection portion 2. The wire holding portion 3 is configured to hold, in a pressure-bonded state, an insulating wire 100 configured such that a core wire is coated by an insulating coating. The wire holding portion 3 includes a bottom wall portion 31 on which the insulating wire 100 is placed, a first insulating wire swaging portion 32 formed continuously to one side edge of the bottom wall portion 31, and a second insulating wire swaging portion 33 formed continuously to the other side edge of the bottom wall portion 31. One or more claws 34 configured to bite into the insulating wire upon swaging of the insulating wire 100 are formed at at least one of the bottom wall portion 31, the first insulating wire swaging portion 32, or the second insulating wire swaging portion 33.

Abstract: A heat dissipation substrate is disclosed including a base substrate having a first surface and a second surface, an electrically conductive path formed on the first surface, a through-hole penetrating from the first surface to the second surface, a heat dissipation member that is inserted into the through-hole and at least a part of which projects from the first surface, a thermally conductive resin constituent, covering a side surface of the heat dissipation member, that is present, without space, between an inner peripheral surface of the through-hole and an outer peripheral surface of the heat dissipation member surrounded by the inner peripheral surface, and a metal layer covering the heat dissipation member projecting from the first surface, in which an outer surface of the metal layer and an outer surface of the electrically conductive path are disposed on substantially the same plane.

Abstract: Provided herein is a conductive adhesive composition containing: a thermosetting resin having a functional group reactive with an epoxy group; an epoxy resin; a conductive filler; and urethane resin particles having a mean particle diameter of 4 ?m or more and 13 ?m or less and a hardness of 55 or more and 90 or less measured by a type A durometer in conformity with JIS K6253.

Abstract: A spray nozzle can control a film region easily. A spray nozzle of an embodiment includes, a nozzle main body, a nozzle tip section connected to a tip of the nozzle main body, and at least one path changing section which is provided in a passage of the carrier gas in the nozzle tip section and changes a path of the film material.

Abstract: A coaxial cable is configured so that adhesion between an insulating layer and a shield layer can be improved without addition of an adhesive component and roughening of an adhesive surface. The coaxial cable includes a center conductor, the insulating layer covering the outer periphery of the center conductor, the shield layer covering the outer periphery of the insulating layer, and a sheath covering the outer periphery of the shield layer. An anchor layer containing resin whose glass-transition point is equal to or lower than 15° C. is provided between the insulating layer and the shield layer.

Abstract: The present invention provides a spherical ferrite powder that is excellent in filling ability and moldability if used as a filler, is excellent in handling ability, and is high in resistivity; a resin compound including the ferrite powder; and a molded product made of the resin compound. The spherical ferrite powder including 15 to 30 wt % of ferrite particles having the particle diameter less than 11 ?m and have the volume average particle diameter of 10 to 50 ?m; the resin compound including the ferrite powder; and the molded product made of the resin compound are employed.

Abstract: A conductive coating material includes at least (A) 100 parts by mass of binder component containing 5 to 30 parts by mass of solid epoxy resin which is a solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin which is a liquid at normal temperature; (B) 500 to 1800 parts by mass of metal particles; and (C) 0.3 to 40 parts by mass of hardener, in which the metal particles include (a) spherical metal particles and (b) flaky metal particles, a mass ratio of (a) the spherical metal particles to (b) the flaky metal particles is 25:75 to 75:25 (in terms of (a):(b)), and a viscosity at a liquid temperature of 25° C. of the conductive coating material is 100 to 600 m Pa·s when measured at rotation speed of 0.5 rpm with a cone-plate rotary viscometer.