Patents Assigned to Tatsuta Electric Wire and Cable Co., Ltd.
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Patent number: 10403418Abstract: Cost reduction in a multicore cable is realized by reduction in the frequency of damaging a coaxial cable upon removal of a covering layer. A multicore cable 10 includes multiple coaxial cables 11 arranged in parallel, and ground members 15, 16 conductively connected with the coaxial cables 11. Each coaxial cable includes an internal conductor 11a, an internal insulating layer 11b covering an outer peripheral surface of the internal conductor 11a, an external conductor 11c covering an outer peripheral surface of the internal insulating layer 11b, a covering layer 11d covering an outer peripheral surface of the external conductor 11c, a removed portion 11e formed in such a manner that part of the covering layer 11d in a circumferential direction is removed such that the external conductor 11c is exposed, and a conductive member 21 filling the removed portion 11e. The ground member 15 is conductively connected with the conductive member 21 filling the removed portion 11e.Type: GrantFiled: February 21, 2017Date of Patent: September 3, 2019Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Yoshihiko Aoyagi, Yoshinori Kawakami, Kiyotaka Urashita
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Patent number: 10374350Abstract: Provided is a connector including a connector terminal to which a mating terminal pin is connected and a connector housing configured to house the connector terminal therein. The connector housing has a tubular inner surface surrounding the connector terminal. The connector terminal includes elastic contact pieces arranged at intervals around a central axis of the tubular inner surface. Each elastic contact piece includes a contact portion extending along the central axis and being curved and a distal end portion located outward in a direction orthogonal to the central axis of the contact portion. The contact portion, when subjected to a pressing force from the mating terminal pin toward the tubular inner surface, is shaped into a flat form as a result of the distal end portion moving along the tubular inner surface. Also provided are an electric wire with the connector and a medical device sensor.Type: GrantFiled: June 27, 2018Date of Patent: August 6, 2019Assignee: TATSUTA Electric Wire & Cable Co., Ltd.Inventors: Syoji Nakazono, Kiyotaka Urashita
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Patent number: 10347998Abstract: Provided is a crimp terminal including an electric wire connector connectable to an electric wire. The electric wire connector includes a body, a plurality of first crimping pieces extending from a first end of the body, and at least one second crimping piece extending from a second end thereof. The first and second crimping pieces are alternately arranged while being displaced from each other. When the crimping pieces are crimped to connect a core wire of the electric wire, a clearance between one first crimping piece and the second crimping piece formed at a position closest to an insulating member of the electric wire is larger than a clearance between a remaining first crimping piece and the second crimping piece formed at another position. Also provided are an electric wire with the crimp terminal, and a medical device sensor including the electric wire with the crimp terminal.Type: GrantFiled: June 27, 2018Date of Patent: July 9, 2019Assignee: TATSUTA Electric Wire & Cable Co., Ltd.Inventors: Syoji Nakazono, Kiyotaka Urashita
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Publication number: 20190115521Abstract: An object of the present invention is to provide a thermoelectric transducer capable of achieving excellent output. The present invention provides a thermoelectric transducer including a strip, the strip having a specific configuration and flexibility.Type: ApplicationFiled: January 31, 2017Publication date: April 18, 2019Applicant: Tatsuta Electric Wire & Cable Co., Ltd.Inventor: Naoto TAKEMURA
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Patent number: 10259952Abstract: Provided herein is a conductive coating material that can be spray coated to form a shielding layer having desirable shielding performance, and desirable adhesion to a package. A shielded package producing method using the conductive coating material is also provided. The conductive coating material comprises at least (A) 100 parts by mass of a binder component containing 5 to 30 parts by mass of a solid epoxy resin that is solid at ordinary temperature, and 20 to 90 parts by mass of a liquid epoxy resin that is liquid at ordinary temperature, (B) 200 to 1800 parts by mass of metallic particles, and (C) 0.3 to 40 parts by mass of a curing agent. The conductive coating material has a viscosity of 3 to 30 dPa·s.Type: GrantFiled: September 15, 2015Date of Patent: April 16, 2019Assignee: Tatsuta Electric Wire & Cable Co., Ltd.Inventors: Hiroaki Umeda, Kazuhiro Matsuda
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Publication number: 20190047001Abstract: A spray nozzle, a film forming device, and a film forming method, each facilitate formation of a film in a small region. A spray nozzle includes: a gas entrance section in which a passage of a carrier gas gradually becomes smaller along a flow of the carrier gas; a passage enlargement section in which a passage of the carrier gas gradually becomes larger along a flow of the carrier gas; an opening formation section which has one or more openings via which a passage of the carrier gas and an external space communicate with each other; and a gas exit section in which a passage of the carrier gas gradually becomes smaller along a flow of the carrier gas.Type: ApplicationFiled: March 17, 2017Publication date: February 14, 2019Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventor: Masaki HIRANO
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Patent number: 10206289Abstract: Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wire 41 is placed on a preliminarily-soldered conductive joint portion 2. Then, the conductive joint portions 2 and the core wires 41 are covered with an optically-transparent sheet 30. Thus, the state in which the core wire 41 is placed on the conductive joint portion 2 is held. In this state, the optically-transparent sheet 30 is irradiated with light. A preliminary solder 3 is heated and melted to join the core wire 41 and the conductive joint portion 2 together.Type: GrantFiled: October 29, 2015Date of Patent: February 12, 2019Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Yoshihiko Aoyagi, Yoshinori Kawakami, Yoshio Hirano, Kiyotaka Urashita, Ryota Fujikawa, Nobuhiro Fujio
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Patent number: 10196545Abstract: There is provided a shielding film that simultaneously satisfies excellent high-speed transmission characteristics and excellent flame retardancy. A shielding film according to the present invention includes: a metal layer; and a conductive adhesive layer arranged on one side of the metal layer. The conductive adhesive layer contains a cured product of an epoxy resin and a carboxyl group-containing elastomer, an organic phosphorus-based flame retardant, and a conductive filler; the metal layer has a thickness of from 0.3 ?m to 7 ?m; and a conductive adhesive forming the conductive adhesive layer contains 10 parts by weight to 50 parts by weight of the organic phosphorus-based flame retardant and 10 parts by weight to 80 parts by weight of the conductive filler with respect to 100 parts by weight of a total of the epoxy resin and the carboxyl group-containing elastomer.Type: GrantFiled: May 23, 2016Date of Patent: February 5, 2019Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Kouji Takami, Yoshihisa Yamamoto, Kenji Kamino
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Patent number: 10178766Abstract: A stretchable cable 1 includes a sheet-shaped stretchable base material 2 exhibiting elasticity and elongated in one direction, and a stretchable wiring 3 formed on one surface of the stretchable substrate 2 and exhibiting elasticity. The stretchable base material 2 is made of a material exhibiting elasticity. The stretchable wiring 3 is made of a conductive composition including elastomer and a conductive filler filling the elastomer.Type: GrantFiled: March 14, 2016Date of Patent: January 8, 2019Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Akio Takahashi, Tsunehiko Terada
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Publication number: 20190003059Abstract: The present invention provides a metal-ceramic base material and the like which allow a ceramic base material and a desired metal material to be easily joined. A metal-ceramic base material (30) to be joined to a metal material (40), includes: a ceramic base material (20); and a metal film (25) provided on the ceramic base material (20), the metal film (25) being formed by thermal spray of a mixed powder material containing aluminum, alumina, and nickel, at least part of the nickel being exposed on a surface of the metal film (25).Type: ApplicationFiled: April 16, 2018Publication date: January 3, 2019Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventor: Masaki HIRANO
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Publication number: 20180361708Abstract: Provided are (i) a solder connection structure having improved solder wettability and including an aluminum base material and (ii) a film forming method for forming, on the aluminum base material, a metal film having high solder wettability. A solder connection structure (50) includes (i) an aluminum substrate (30), (ii) an Ni film (35) formed on the aluminum substrate by a cold spray method, and (iii) a mixed metal film (40) provided on the Ni film, the mixed metal film (40) being formed by the cold spray method with use of a mixed powder material, the mixed powder material being a mixture of Ni powder (41) and Sn powder (42).Type: ApplicationFiled: December 22, 2016Publication date: December 20, 2018Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventor: Masaki HIRANO
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Patent number: 10159142Abstract: A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding.Type: GrantFiled: June 1, 2016Date of Patent: December 18, 2018Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Yuusuke Haruna, Hiroshi Tajima, Masahiro Watanabe, Yukari Kobayashi, Kiyoharu Sekiguchi, Yoshihiro Hosoya
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Publication number: 20180355487Abstract: Provided are: a film material for use in a cold spray device; and a cold spray method, each of the film material and the cold spray method enabling an improvement in rate of adhesion of a spray material to a base material. A film material for use in a cold spray device (100) and to be sprayed onto a base material (20) includes a spray material and flux powder.Type: ApplicationFiled: April 13, 2018Publication date: December 13, 2018Applicant: Tatsuta Electric Wire & Cable Co., Ltd.Inventor: Masaki HIRANO
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Patent number: 10153066Abstract: A conductive paste having a viscosity suitable for filling a hole of a board, long pot life, and excellent conductivity and long-term reliability of a cured product, and a multilayer board using the same are provided. A conductive paste comprising with respect to (A) 100 parts by mass of dimer acid-modified epoxy resin, (B) from 200 to 1900 parts by mass of high melting metal powder containing silver-coated copper alloy powder and having a melting point of 800° C. or higher, (C) from 400 to 2200 parts by mass of silver-coated copper alloy powder having a melting point of 800° C. or higher, (D) from 1.0 to 20.0 parts by mass of curing agent containing a hydroxy group-containing aromatic compound, and (E) from 5.0 to 100.0 parts by mass of a flux containing polycarboxylic acid, is used as the present invention.Type: GrantFiled: February 17, 2016Date of Patent: December 11, 2018Assignee: Tatsuta Electric Wire & Cable Co., Ltd.Inventors: Hajime Nakazono, Norihiro Yamaguchi
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Publication number: 20180298185Abstract: Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. A heat dissipation material having adhesive is obtained by coating a portion or the whole of the heat dissipation material with a heat dissipation material adhering composition including a resin component containing an epoxy resin, a curing agent, and an inorganic filler, and having a complex viscosity at 80° C. of 1×103 Pa·s to 5×106 Pa·s.Type: ApplicationFiled: June 15, 2016Publication date: October 18, 2018Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Hiroaki Umeda, Kazuhiro Matsuda, Ken Yukawa
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Patent number: 10059083Abstract: The present invention provides a resin impregnated material and a composite material having excellent dielectric properties, high heat resistance, low stress property and the like at the same time, and a copper-clad laminate using the same. The resin impregnated material is formed by impregnating a porous fluororesin with a curable resin composition containing: (A) a bismaleimide compound represented by General Formula (I); and (B) a radical polymerization initiator. In General Formula (I), X represents an aliphatic, alicyclic, or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain; Y represents an aliphatic, alicyclic, or aromatic hydrocarbon group; and n represents a number in the range of 1 to 20.Type: GrantFiled: March 22, 2016Date of Patent: August 28, 2018Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Haruyuki Yoshigahara, Hiroaki Umeda, Masanori Miyamoto
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Patent number: 10051765Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 ?m to 12 ?m thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.Type: GrantFiled: February 9, 2016Date of Patent: August 14, 2018Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Hiroshi Tajima, Sirou Yamauchi, Kenji Kamino, Masahiro Watanabe
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Publication number: 20180222152Abstract: Resin-clad copper foil improves transmission characteristics by using a bismaleimide resin having a low dielectric constant and a low dielectric loss tangent. The foil can be manufactured without irradiation with ultraviolet rays. A resin composition is laminated on copper foil. The resin composition includes a bismaleimide resin represented by general formula (I), a curing agent, and a filler, the blending amount of the filler is 10 to 200 parts by mass based on 100 parts by mass of a resin component. The resin composition has a complex viscosity at 80° C. of 1×103 Pa·s to 5×105 Pa·s. In general formula (I), X represents an aliphatic, alicyclic or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain, Y represents an aliphatic, alicyclic, or aromatic hydrocarbon group, and a represents a number in a range of 1 to 20.Type: ApplicationFiled: July 14, 2016Publication date: August 9, 2018Applicants: TATSUTA ELECTRIC WIRE & CABLE CO., LTD., TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Hiroaki Umeda, Masanori Miyamoto, Kazuhiro Matsuda, Ken Yukawa, Shirou Yamauchi
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Patent number: 10015915Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 ?m to 12 ?m thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.Type: GrantFiled: October 12, 2012Date of Patent: July 3, 2018Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Hiroshi Tajima, Sirou Yamauchi, Kenji Kamino, Masahiro Watanabe
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Publication number: 20180179082Abstract: The present invention provides a spherical ferrite powder that is excellent in filling ability and moldability if used as a filler, is excellent in handling ability, and is high in resistivity; a resin compound including the ferrite powder; and a molded product made of the resin compound. The spherical ferrite powder including 15 to 30 wt % of ferrite particles having the particle diameter less than 11 ?m and have the volume average particle diameter of 10 to 50 ?m; the resin compound including the ferrite powder; and the molded product made of the resin compound are employed.Type: ApplicationFiled: August 31, 2015Publication date: June 28, 2018Applicants: POWDERTECH CO., LTD., TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Koji AGA, Tetsuya IGARASHI, Akio TAKAHASHI