Abstract: Provided are (i) a solder connection structure for enhancing solder wettability and (ii) a film forming method, carried out so as to enhance solder wettability, for forming a metal film on an aluminium base material. A solder connection structure to be connected with a member via a solder material, includes: an aluminium substrate; and a metal film provided on the aluminium substrate. The metal film is formed by a cold spray method in which a mixed powder material is used. The mixed powder material is a mixture of Ni powder and Sn powder.

Abstract: The present invention provides a resin impregnated material and a composite material having excellent dielectric properties, high heat resistance, low stress property and the like at the same time, and a copper-clad laminate using the same. The resin impregnated material is formed by impregnating a porous fluororesin with a curable resin composition containing: (A) a bismaleimide compound represented by General Formula (I); and (B) a radical polymerization initiator. In General formula (I), X represents an aliphatic, alicyclic, or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain; Y represents an aliphatic, alicyclic or aromatic hydrocarbon group; and n represents a number in the range of 1 to 20.

Abstract: A shield wire is formed of eight twisted insulated core wires 1, an inclusion 2 between these respective insulated core wires 1, a tape 3 laterally wound around an outer periphery of a core formed of the insulated core wires and inclusion, a drain wire 4 disposed on an outer surface of the tape, a conductive fiber braided body 5 formed on an outer peripheral surface of the tape so as to interpose the drain wire, a sheath 6 that forms an outer peripheral surface of the braided body, and an adhesive layer 7 between the braided body and sheath. A braided body 5? is adhesively integrated to the sheath 6? by an adhesive layer; thus, the braided body 5? is stripped with the sheath. This eliminates a need for a removal work of the braided body after stripping the sheath, thus ensuring good workability of the terminal processing.

Abstract: Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film (1) is provided on a flexible printed wiring board (8), which has a base film (5) having a signal circuit (6a) formed thereon, and an insulating film (7) that is provided on the whole upper surface of the base film (5) such that the insulating film covers the signal circuit (6a). The shield film 1 has an electroconductive adhesive layer 15 provided throughout a surface of the insulating film 7, and a metal layer 11 provided throughout a surface of the electroconductive adhesive layer 15.

Abstract: A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of the base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 ?m thick.

Abstract: A shape-retaining film which allows a flexible wiring board to retain its shape after the flexible wiring board is deformed by bending or the like, and a shape-retaining flexible wiring board including the shape-retaining film, is disclosed herein. A shape-retaining film includes a plastic-deformable metal layer and an adhesive layer which is formed on one surface side (lower side) of the metal layer 3 and is joined with a flexible wiring board. The shape-retaining film makes it possible to retain the shape of a deformed flexible wiring board. With this arrangement, the occurrence of a repellent force in the deformed flexible wiring board is prevented.

Abstract: A core wire of a coaxial cable is easily placed and soldered onto a conductive joint portion. Conductive joint portions 2 are formed at a predetermined interval on a substrate 1. A solder resist portion 5 is formed on each side of the conductive joint portion 2. A core wire 41 of a coaxial cable 4 is housed between two of the solder resist portions 5. A core wire 41 is placed on an upper surface 2a of the conductive joint portion 2. In this state, the core wire 41 is, by solder 3, connected to the upper surface 2a of the conductive joint portion 2.

Abstract: An infusion speed measurement instrument 1 includes: a housing 12 which includes a fitting recessed part 10 in which a side wall 2a of a drip chamber 2 hung in an up-down direction is detachably fitted and a positioning contact part 11 which is in contact with a lower surface 23a of a flange part 23 of the drip chamber 2 fitted in the fitting recessed part 10; an infusion fluid detector 13 which is provided in the housing 12 and is configured to detect infusion fluid 4 dropping from a pipe 32 of the drip chamber 2 which is fitted in the fitting recessed part 10 while being in contact with the positioning contact part 11 at the flange part 23.

Abstract: A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of a base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 ?m thick.

Abstract: The present invention molds, with simple processes, a tube which has a smaller outer diameter and is hardly bent in a folded manner. The present invention includes (i) a primary molding step of forming a primary molded body by carrying out resin molding while a reinforcing member and a core pin (4) are placed in a cavity of a first mold made up of a lower mold (30) and an upper mold (40) for primary molding and (ii) a secondary molding step of covering the reinforcing member by carrying out resin molding while the primary molded body is placed in a cavity of a second mold that has an inner diameter larger than an inner diameter of the cavity of the first mold.

Abstract: In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using alloying paste as the conductive paste in which at least part of the metal powder is melted and the metal powders adjacent to each other are alloyed, using a pre-preg having a ratio A/B of at least 10 before subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature profile rising from 60° C. to 200° C.

Abstract: A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of a base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 ?m thick.

Abstract: An infusion speed measurement instrument 1 includes: a housing 12 which includes a fitting recessed part 10 in which a side wall 2a of a drip chamber 2 hung in an up-down direction is detachably fitted and a positioning contact part 11 which is in contact with a lower surface 23a of a flange part 23 of the drip chamber 2 fitted in the fitting recessed part 10; an infusion fluid detector 13 which is provided in the housing 12 and is configured to detect infusion fluid 4 dropping from a pipe 32 of the drip chamber 2 which is fitted in the fitting recessed part 10 while being in contact with the positioning contact part 11 at the flange part 23.

Abstract: Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film (1) is provided on a flexible printed wiring board (8), which has a base film (5) having a signal circuit (6a) formed thereon, and an insulating film (7) that is provided on the whole upper surface of the base film (5) such that the insulating film covers the signal circuit (6a). The shield film 1 has an electroconductive adhesive layer 15 provided throughout a surface of the insulating film 7, and a metal layer 11 provided throughout a surface of the electroconductive adhesive layer 15.

Abstract: A method of manufacturing a multilayer board, including: forming a hole through a pre-preg by laser, filling the hole with conductive paste containing a resin component and metal powder, and arranging copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, wherein in the conductive paste at least surface layers of the different metal powders are melted and alloyed, the pre-preg has a ratio A/B of at least 10 before being subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature rising from 60 to 200 degree C., and preheating the pre-preg before the drilling step to reduce the ratio A/B to below 10.

Abstract: In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using alloying paste as the conductive paste in which at least part of the metal powder is melted and the metal powders adjacent to each other are alloyed, using a pre-preg having a ratio A/B of at least 10 before subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature profile rising from 60° C. to 200° C.

Abstract: Disclosed is a three-wavelength optical multiplexer which is compact, and which multiplexes light having different wavelength incident to three single-mode optical fibers, particularly light of red, green, and blue at transmittance above a certain reference.

Abstract: Disclosed is a three-wavelength optical multiplexer which is compact, and which multiplexes light having different wavelength incident to three single-mode optical fibers, particularly light of red, green, and blue at transmittance above a certain reference.

Abstract: An optical drop cable includes optical fiber cores, tension-resistant members, and a single-material outer sheath covering the cores and the tension-resistant members. The bark of a young tree has elasticity, so that if cicadas lay eggs in the bark, the holes in which eggs are laid close and the eggs will not hatch. Cicadas cannot stick their ovipositors into bark having abrasion resistance. Thus, the outer sheath is made of polyurethane resin having rebound resilience equivalent to that of the bark of a young tree, and having high abrasion resistance. By making the outer sheath from such resin having elasticity and abrasion resistance, holes in which eggs are laid close, thus making hatching of the eggs impossible, or cicadas cannot stick their ovipositors into the outer sheaths. Black cicadas will therefore not lay eggs in the outer sheath, preventing damage to or breakage of the optical fiber.

Abstract: An optical signal amplifying apparatus feeding back surrounding light to perform negative feedback optical amplification of a semiconductor optical amplifier is provided that enables a coupling structure to be simplified and miniaturized between the semiconductor optical amplifier and an optical fiber transmitting the output light from the semiconductor optical amplifier by using a fiber grating device.