Abstract: A test and measurement instrument having a signal generator circuit and a waveform monitor circuit for monitoring a waveform received at a device under test (DUT). The signal generator circuit generates a waveform based on an input from a user, while the waveform monitor circuit sends captured signals to a processor to determine a waveform received at the DUT. The waveform monitor captures a signal at a first test point and a second test point, via a switch, and the processor receives the captured signals and using linear equations determines both an incident waveform and a reflected waveform from the DUT.

Abstract: A method determines scattering parameters, S-parameters, for a device under test for a first frequency range. The method includes receiving S-parameters for the device under test for a second frequency range, the second frequency range greater than the first frequency range. Generally, the S-parameters for the device under test for the second frequency range can be determined using known methods. The method further includes measuring an actual response of the device under test, determining a desired signal of the device under test, and determining the S-parameters for the device under test for the first frequency range based the S-parameters for the second frequency range, actual response of the device under test and the desired signal of the device under test.

Abstract: An equivalent-time sampling test and measurement instrument for acquiring a repeating pattern signal under test at or near a maximum sampling speed of the test and measurement instrument. The test and measurement instrument includes a first input configured to receive repeating pattern information about a signal under test, a second input configured to receive the signal under test, one or more processors configured to determine an optimized trigger holdoff period that is set based on a minimum trigger holdoff period of a test and measurement instrument, and an acquisition unit configured to acquire a portion of the signal under test every optimized trigger holdoff period.

Abstract: A test and measurement device measures an insertion loss of a material under test. The test and measurement device includes a reference device in contact with a first surface of a material under test, the reference device including a reflective component and an absorbing component. A testing device is in contact with a second surface of the material under test, opposite the first surface. The testing device includes a first transmitter to output a first signal at a predetermined frequency to the reflective component of the reference device through the material under test, a first receiver to receive a first reflected signal from the reflective component, a second transmitter output a second signal at the predetermined frequency to the absorbing component of the reference device through the material under test, and a second receiver to receive a second reflected signal from the material under test.

Abstract: An apparatus configured to acquire S-parameters of a communications channel includes a physical interface configured to transmit and receive signals through a communications channel under test, a processor, configured to execute instructions that, when executed cause the processor to: send a first data pattern from the transmitter through the communications channel at a first data rate; acquire a first waveform corresponding to the first data pattern and determine a first pulse response; calculate a first transfer function from the first pulse response; send a second data pattern from the transmitter through the communications channel at a second data rate; acquire a second waveform corresponding to the second data pattern and determine a second pulse response; calculate a second transfer function from the second pulse response; and combine the first and second transfer functions to determine an S-parameter of the communications channel.

Abstract: A method for electrically connecting a test and measurement instrument to a via of a printed circuit board, PCB, the method comprising: dispensing a UV-curable conductive adhesive into a back-drilled hole formed in the PCB, the back-drilled hole extending to the via, such that the dispensed adhesive contacts the via; curing the dispensed adhesive by applying a UV light source to the dispensed adhesive; and connecting a test and measurement instrument to the cured adhesive using a conductive member.

Abstract: An apparatus for coupling a test and measurement instrument to a device under test comprises a clip structured to be attached between two conductive portions of the device under test, and an insert structured to be removably installed in the clip. The insert is configured to provide a current path between the two conductive portions of the device under test. In embodiments, the insert comprises a resistive element, which may be a round rod resistor. Additional embodiments may be described and/or claimed herein.

Abstract: A test and measurement system for parallel waveform analysis acquires waveforms resulting from performing tests on a device under test (DUT) and performs, at least partially in parallel, respective analyses of the waveforms resulting from performing tests on the DUT. The system also acquires a first waveform resulting from performing a first test with an oscilloscope on a DUT and performs analysis of the first waveform at least partially in parallel with acquiring a second waveform. Additionally, the system tracks a plurality of testing assets using inventory information of a plurality of testing equipment on the network and enables remote users to access equipment logs and results of the respective analyses of the waveforms stored on a cloud computing system for performance of analytics.

Abstract: Methods of triggering a test and measurement instrument having a plurality of inputs include the step of generating a trigger signal in response to every occurrence of any one of a plurality of specified trigger events. A first specified trigger event occurs in at least a first one of the inputs and a second specified trigger event occurs in at least a second one of the plurality of inputs. A specified trigger event may include at least one selected input from the plurality of inputs and a selected activity type. Some methods include configuring each of a plurality of event activity detectors to produce a pulse in a logic signal in response to every occurrence of one of the specified trigger events. The plurality of logic signals are combined in a logical OR circuit to generate the trigger signal. Trigger circuits configured according to these methods are also disclosed.

Abstract: Disclosed is a differential test probe tip. The probe tip comprises a socket of electrically conductive material at a proximate end of the probe tip. The socket includes a concavity to receive a signal pin. The probe tip also comprises a reference body of conductive material surrounding the socket. The probe tip further comprises a insulating spacer element of non-conductive material surrounding the reference body at the proximate end of the probe tip. The insulating spacer element includes a signal port to receive the signal pin into the socket. The insulating spacer element further includes a reference port to receive a reference pin and maintain the reference pin in electrical communication with a proximate end of the reference body.

Abstract: A system includes a plurality of oscilloscopes, each oscilloscope having an output port and an input port, a cable connecting the output port of an initial oscilloscope of the plurality of oscilloscopes to the input port of a second oscilloscope of the plurality of oscilloscopes, the initial oscilloscope having a processing element to generate a master run clock, the second oscilloscope having a processing element including a phase-locked loop to lock a slave run clock to the master run clock, wherein the processing element of one of the oscilloscopes executes code to cause the processing element to manipulate one of the run clocks to pass trigger information to another of the plurality of oscilloscopes.

Abstract: A method of conductively bonding a test probe tip having an electrically conductive element to a device under test (DUT) having an electrical connection point, the method comprising: positioning the electrically conductive element of the test probe tip proximate to the electrical connection point of the DUT; dispensing a UV-cure conductive adhesive between the electrically conductive element and the electrical connection point of the DUT, the dispensed UV-cure conductive adhesive continuously covering at least a portion of the electrically conductive element and at least a portion of the electrical connection point of the DUT; and bonding the dispensed UV-cure conductive adhesive to the electrically conductive element and the electrical connection point of the DUT by applying UV-light from a UV-light source to the dispensed UV-cure conductive adhesive.

Abstract: A sampling gate comprising a first frequency input coupled to a first frequency path from a broadband photodiode. The sampling gate also includes a positive bias input coupled to a positive offset portion of a second frequency path from the broadband photodiode. The sampling gate also includes a negative bias input coupled to a negative offset portion of the second frequency path from the broadband photodiode. The sampling gate combines a first frequency signal from the first frequency path and a second frequency signal from the second frequency path to create a combined broadband frequency signal from the broadband photodiode.

Abstract: An apparatus configured to acquire S-parameters of a communications channel includes a physical interface configured to transmit and receive signals through a communications channel under test, a processor, configured to execute instructions that, when executed cause the processor to: send a first data pattern from the transmitter through the communications channel at a first data rate; acquire a first waveform corresponding to the first data pattern and determine a first pulse response; calculate a first transfer function from the first pulse response; send a second data pattern from the transmitter through the communications channel at a second data rate; acquire a second waveform corresponding to the second data pattern and determine a second pulse response; calculate a second transfer function from the second pulse response; and combine the first and second transfer functions to determine an S-parameter of the communications channel.

Abstract: A test and measurement instrument for generating an analog waveform, including an interpolator configured to receive a digital signal and output interpolated samples of the digital signal at a sample rate, a filter modulation controller configured to output first filter coefficients at a first time and second filter coefficients at a second time, a convolver configured to generate a convolved signal by convolving the interpolated samples of the digital signal and the first filter coefficients and convolving the interpolated samples of the digital signal and the second filter coefficients; and a digital-to-analog converter configured to convert the convolved signal to an analog signal based on a fixed, constant clock signal.

Abstract: A time-interleaved digital-to-analog converter system, comprising a digital pre-distorter configured to receive an input digital signal and an error signal and output a distorted digital signal based on the input digital signal and the error signal; a time-interleaved digital-to-analog converter having a first sample rate, the time-interleaved digital-to-analog converter configured to convert the distorted digital signal to an analog signal; and a calibration system. The calibration system includes an analog-to-digital converter having a second sample rate equal to or lower than the first sample rate, the analog-to-digital converter configured to receive the analog signal and covert the analog signal to a down-sampled digital signal, a discrete-time linear model configured to receive the input digital signal and the error signal and output a model signal, and a combiner to subtract the down-sampled digital signal from the model signal to generate the error signal.

Abstract: A multilayer circuit board having a central conductor and core layers between a first set of alternating layers and a second set of alternating layers. The central conductor includes a first compound via through the first set of alternating layers, and a second compound via through the second set of alternating layers. A gap extends from a first side of the multilayer circuit board to a second side of the multilayer circuit board. A first array of ground protrusions surrounds the gap and is arranged in a first pattern on the first side of the multilayer circuit board. A second array of ground protrusions surrounds the gap and is arranged in a second pattern on the second side of the multilayer circuit board. A ground path connects the first array of ground protrusions to the second array of ground protrusions.

Abstract: A test and measurement instrument, including one or more ports configured to receive a stream of packets from a transmitter through a network component, each packet including a timestamp; and one or more processors. The one or more processors are configured to select a buffer model, the buffer model including one or more validation thresholds for a buffer fullness, determine a network delay based on the timestamp in each packet and when the packet was received at the one or more ports, and compensate the buffer model based on the network delay to determine a buffer fullness value based on the stream of packets. The test and measurement instrument also includes a display to display an indication of whether the transmitter complies with the selected buffer model, so a user can confirm whether a transmitter being tested complies with applicable standards.

Abstract: An electronic switch includes a substrate and a rotator assembly. The rotator assembly is configured to prevent rotation between a first rotational configuration and a second rotational configuration in a first translational position of the rotator assembly, while the rotator assembly is configured to rotate between the first rotational configuration and the second rotational configuration in a second translational position of the rotator assembly. The second translational position of the rotator assembly is translationally offset from the first translational position of the rotator assembly.