Abstract: Provided is a resin molding apparatus that can reduce a variation in a thickness of a resin to be molded. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that one mold cavity block is moved to a preset height position using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a resin is injected into one mold cavity, and thereafter resin molding can be performed by changing a depth of the one mold cavity using the one mold wedge mechanism and the one mold cavity block driving mechanism.

Abstract: Provided is a resin molding apparatus that can suppress a molding problem caused by a variation in a thickness of an object to be molded or suppress a variation in a thickness of a resin molded part, and can perform a mold releasing operation. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that a height position of one mold cavity block is set using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a mold releasing operation can be performed using the one mold wedge mechanism and the one mold cavity block driving mechanism.

Abstract: Provided a method for supplying a resin by which appropriate replacement of a cartridge enables resin supply to be performed appropriately. The method for supplying a resin includes: a primary resin supplying step of supplying a liquid resin contained in a first cartridge to a supply target, the first cartridge having a remaining amount of liquid resin smaller than a target supply amount appropriate for one-time resin supply to the supply target; a cartridge replacing step of replacing, after the primary resin supplying step, the first cartridge with a second cartridge already subjected to dripping out; and a secondary resin supplying step of supplying a liquid resin contained in the second cartridge to the supply target after the cartridge replacing step.

Abstract: A resin molding apparatus capable of suppressing an occurrence of defects related to resin filling. The resin molding apparatus includes: a molding mold which forms a cavity; a pot which is arranged in the molding mold and is capable of accommodating a resin material, and in which an opening portion opening directly to the cavity is formed; and a plunger which is arranged to be slidable in the pot, and transfers the resin material accommodated in the pot toward the cavity via the opening portion by extruding the resin material. An inner diameter of the opening portion is formed to be the same as an outer diameter of the plunger or larger than the outer diameter of the plunger.

Abstract: The present invention relates to a conveyance device with which a subject to be molded can be positioned relative to a forming die. This conveyance device conveys a subject to be molded to one die from among forming dies to which a resin material is supplied from a resin injection part and comprises a retaining unit which retains and delivers the subject to be molded to the one die, a first movement mechanism which moves the subject to be molded having been delivered to the one die in a first direction toward the resin injection part, and a second movement mechanism which moves the subject to be molded having been delivered to the one die in a second direction differing from the first direction.

Abstract: The present invention is a transfer device for unloading a resin molded article from one mold provided with a resin injection unit, the resin molded article being unloaded by the transfer device from one mold provided with a resin injection unit having a member projecting between at least part of the resin molded article and another mold, wherein the resin injection unit has a member projecting between at least part of the resin molded article and the other mold, and the transfer device is equipped with a holding member for holding the resin molded article and a horizontal movement mechanism that causes the holding member holding the resin molded article to move in the horizontal direction to separate the resin molded article from the resin injection unit.

Abstract: A resin-molding device capable of preventing a resin-molded product from being non-uniform in thickness. A resin-molding device includes: a first and second platen (outside-loaded platen) which are two plate-shaped members arranged parallel to each other to allow a molding die to be arranged in a die arrangement section which is a central region between the platens; a force applier (toggle link and tie bars) for applying a force to the platens from loading points located outside the die arrangement section; a heating mechanism (lower and upper heater plates) provided between the outside-loaded platen and the molding die; and a heat-insulating member (lower and upper heat-insulating members) formed by a plurality of elastic pillar members arranged between the outside-loaded platen and the heating mechanism, the pillar members configured so that the amount of deformation of each pillar member increases from the center of the die arrangement section toward the loading point.

Abstract: A tableting punch or a die includes a base material and a tableting surface layer on the base material. The tableting surface layer includes crystalline yttrium oxide containing nitrogen and a group 4A element.

Abstract: A resin-molding device capable of preventing a resin-molded product from being non-uniform in thickness. A resin-molding device includes: a first and second platen (outside-loaded platen) which are two plate-shaped members arranged parallel to each other to allow a molding die to be arranged in a die arrangement section which is a central region between the platens; a force applier (toggle link and tie bars) for applying a force to the platens from loading points located outside the die arrangement section; a heating mechanism (lower and upper heater plates) provided between the outside-loaded platen and the molding die; and a heat-insulating member (lower and upper heat-insulating members) formed by a plurality of elastic pillar members arranged between the outside-loaded platen and the heating mechanism, the pillar members configured so that the amount of deformation of each pillar member increases from the center of the die arrangement section toward the loading point.

Abstract: A lower mold has a bottom surface member and a side surface member. An upper end surface of the bottom surface member forms an inner bottom surface of a cavity and has a planar shape corresponding to an unusual planar shape of a sealing resin. A substrate is disposed on a mold surface of an upper mold such that a component to be sealed attached to the substrate faces downward, and the cavity is filled with a fluid resin. The upper mold and the lower mold are clamped, and the component is immersed in the fluid resin. The bottom surface member is raised, and the fluid resin is pressed at a prescribed resin pressure and cured to form the sealing resin. The bottom surface member and the side surface member are moved relatively, and thereby, a molded product is released from a mold surface of the lower mold.

Abstract: Provided is a resin-molding device 10 including: a first platen 11 and a second platen 12; a first molding die 161 to be attached to the first platen; a second molding die 162 to be attached to the second platen and arranged so as to face the first molding die; a die-clamping mechanism 133 for clamping the first and second molding dies together by decreasing the distance between the first and second platens, and for separating the first and molding dies from each other by increasing the distance between the first and second platens; and a flatness adjuster 14 including an adjustment member 141 for adjusting the parallelism between the die surface of the first molding die and that of the second molding die, or the flatness of a resin-molded product to be molded with the first and second molding dies.

Abstract: A glove base and glove are provided, which release moisture outside from the entire glove when the glove is configured only of a fiber glove base or when a coating is provided to a surface of the glove base. The glove base of the present invention is made of fibers and has a hand shape. Water-absorbing properties of a first fiber type exposed mainly to an inside surface of the glove base are higher than water-absorbing properties of a second fiber type exposed mainly to outside surface of the glove base. The first fiber type absorbs and moves moisture on a surface of a hand inside the glove base toward the second fiber type, and the second fiber type then moves the moisture from the first fiber type mainly in a surface direction of the glove base.

Abstract: The present invention provides a method for producing a resin-encapsulated electronic component, capable of simply and efficiently producing a resin-encapsulated electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method includes a resin-encapsulation step of encapsulating at least one electronic component in a resin. A produced resin-encapsulated electronic component includes: a substrate; the at least one electronic component; the resin; a plate-like member; and at least one bump. A wiring pattern is formed on the substrate. In the resin-encapsulation step, between a bump-formed surface in a bump-formed plate-like member obtained by forming the at least one bump in the plate-like member and a wiring pattern-formed surface in the substrate, the at least one electronic component is encapsulated in the resin, and the at least one bump is caused to be in contact with the wiring pattern.

Abstract: [Problem] To provide a glove base and glove which enhance water-absorbing properties for moisture on a surface of a hand and easily release moisture to the outside from the entire glove even if the glove is configured only of a fiber-made base or even if coating is provided to a surface of the glove. [Solution] A glove base of the present invention is a glove base made of fiber and having a hand shape, wherein water-absorbing properties of a first fiber exposed mainly to inside of the glove base are higher than water-absorbing properties of a second fiber exposed mainly to outside of the glove base, the first fiber absorbs and moves moisture on a surface of a hand on the inside to the second fiber, and the second fiber moves the moisture moved from the first fiber mainly in a surface direction.

Abstract: A cutting device includes: an imaging module for capturing first marks and third marks, to produce primary image data; and a control module for aligning, by a conveyance mechanism, a cutting jig and an object to be cut that is placed on the cutting jig. The control module compares first positional information including positional information of a specific first mark stored or first positional information with third positional information to calculate a primary displacement amount showing a relative positional displacement between a plurality of cutting grooves and the plurality of third marks, respectively. The conveyance mechanism picks up the object from the cutting jig, and the conveyance mechanism and the cutting jig are moved relative to each other based on the primary displacement amount, to move the object by the primary displacement amount to a primary target position. The cutting mechanism cuts the object along a plurality of cutting lines.

Abstract: The present invention provides a method for producing an electronic component, capable of simply and efficiently producing an electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method is a method for producing an electronic component. The electronic component includes: a substrate 21, a chip(s) 31, a resin 41, a plate-like member 11 having a surface(s), a bump(s) 12 that includes a deformable portion 12A, and a wiring pattern 22. The method includes: disposing the chip(s) 31 on the surface(s); and encapsulating the bump(s) 31 in the resin 41. The encapsulating includes: encapsulating the chip(s) 31 in the resin 41 between a bump 12-formed surface of the plate-like member 11 on which the bump(s) 12 is formed and a wiring pattern 22-formed surface of the substrate 21 on which the wiring pattern is formed; and causing the bump(s) 12 to be in contact with the wiring pattern 22.

Abstract: The present invention provides a glove having both high softness and high air tightness. A glove of the present invention has a fiber-made base having a shape of a hand of a person and a coating formed on a surface of at least a portion of the base, where a burning treatment is applied to the base, air tightness of a portion of the glove which has been applied with the burning treatment is maintained even when pressure of 9 kPa or higher is imparted to inside of the base, and the fiber-made base is formed of filament yarns.