Abstract: First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.

Abstract: A cutting blade is fixed on a shaft that rotates about its shaft center, and that is linearly advanced by an advancing movement. The shaft's center further revolves with a small radius of revolution at a rapid predetermined rate of revolution greater than the rate of advancing movement. Thus the blade is pressed against and cuts a substrate and produces chips, and the blade is intermittently disengaged from the substrate whereby the chips move in the direction in which the blade rotates to be removed from between the cutting edge of the blade and the substrate. This reduces working resistance, enhances working efficiency, and prevents the blade surface from having significant frictional heat. Furthermore, the generated frictional heat can readily dissipate and the blade can thus have a long life.

Abstract: A substrate with a plurality of semiconductor chips mounted thereon is set in a die. The die is then clamped. The die thus clamped forms a space, into which resin is introduced. In doing so, a member is provided to fill a gap between an upper surface of each chip and the die. The member is elastic and thus elastically deforms when the die is clamped. Thus from the elastic member to each chip's upper surface a substantially uniform pressure is exerted. The elastic member is a film extending substantially parallel to each chip's upper surface and contacts the upper surface as the member is tensioned in its in-plane direction. The above resin introduction step can prevent the semiconductor chip from having an upper surface with resin flash.

Abstract: A polishing apparatus includes a polishing pad rotated by a surface plate rotating shaft about a surface plate axis, a slurry conduit supplying slurry to an upper surface of the polishing pad, a substrate holding mechanism holding a substrate, a substrate rotating shaft rotating the substrate holding mechanism about a substrate axis, and a rotating mechanism rotating the substrate axis or the surface plate axis about an eccentric axis. The angular velocity of rotation about the eccentric axis is set larger than the angular velocity of rotation about the substrate axis or the surface plate axis. Thus, the effective contact area between a small area on the substrate and the polishing pad is increased, biased wear of abrasive grains on the polishing pad is prevented, clogging of the polishing pad is suppressed, and new abrasive grains and new chemicals can be supplied with high efficiency to each area of the substrate. Thus, the polishing rate is improved.

Abstract: First, an intermediate plate and a lower mold are clamped. Thus, a release film is sandwiched between a mold surface of the intermediate plate and a mold surface of the lower mold. In this state, the clamping of an upper mold and the intermediate plate begins. Thus, an enclosed space is formed. Thereafter, the enclosed space is forcibly evacuated. At this time, the upper mold and the intermediate plate is gradually clamped. As a result, the enclosed space is filled with a molten resin and the resin encapsulation mold is completed. According to this method, the release film is prevented from moving into the enclosed space. Thus, deformation or severing of a wire is avoided when the resin encapsulation molding is performed.

Abstract: A space portion is present between the upper surface of a semiconductor chip of a semiconductor chip mounted substrate fitted into a cavity (concave portion for setting) of a lower mold section and the top surface of a cavity of an upper mold section. The upper and lower mold sections are closed while a resin member having a thickness larger than the height of the space portion is inserted in the space portion. At this time, clamping force between the upper and lower mold sections is applied to the semiconductor chip through the resin member. The resin member is deformed in response to the shape of the space portion. Underfill is molded between the semiconductor chip and the substrate while the resin member adheres to both of the upper surface of the semiconductor chip and the top surface of the cavity of the upper mold section.

Abstract: A lead frame is placed on a lower mold with its non-mounting surface facing upward. An unused portion of a resin tape is supplied between the upper mold and the lower mold. The resin tape is sucked to the upper mold and preheated. A molten resin is injected into a cavity for curing, with the upper and lower molds closed together, and with the lead frame positioned loosely without being tightly clamped between the upper and lower molds. The injected resin presses the lead frame against the resin tape on the upper mold surface. Thus, resin sealing is performed. In this method, the resin tape is kept in close contact with the non-mounting surface of the lead frame and held in a space of the lead frame for resin sealing, so that formation of a cured resin on the bottom surface of the package can be prevented.

Abstract: A method of processing a leadframe involves steps of transporting a leadframe to load it into a lead processing unit including plural sets of processing presses; adjusting a press pitch of the processing presses according to a work pitch of workpieces on the leadframe by rotating a nut member that is coupled to at least one of the processing presses and engaged on a non-rotating screw shaft extending in the transport direction of the leadframe, so that the nut member moves along the screw shaft and the respective processing press coupled thereto moves with the nut member; and performing a predetermined lead processing on the leadframe using the processing presses after the step of adjusting the press pitch.

Abstract: There are provided a lower sensor and an upper sensor mounted respectively on top and bottom surfaces of a sensor unit, an operation unit calculating respective measurements indicating the degree of adhesion of dirt to respective surfaces of a lower mold and an upper mold based on respective detection signals from the lower sensor and the upper sensor, and a comparator unit comparing each measurement from the operation unit with a predetermined reference value to transmit a predetermined warning signal if the measurement is equal to or smaller than the reference value. The warning signal is thus transmitted if reflected radiation that is radiation reflected from the mold surface has its intensity equal to or smaller than the reference value.

Abstract: In a resin sealing method, a plurality of semiconductor chips are placed in line on a sheet-type substrate with an adhesive tape, and electrodes provided on the semiconductor chips and the sheet-type substrate are connected with each other with wires, so that the connected substrate is fixed to a mold surface of a lower mold. Then, the lower mold and an upper mold are closed and thereafter molten resin is injected into upper cavities and lower cavities provided in line respectively and hardened. Then, the upper and lower molds are opened to take out the sheet-type substrate having the plurality of semiconductor chips sealed thereto, and the sheet-type substrate is cut along the boundaries between the semiconductor chips by dicing for completing each package. According to this method, particularly a BOC type CSP can be efficiently sealed with resin in high dimensional accuracy.

Abstract: There are provided a shaft rotating around the shaft's center in a direction in which a blade rotates, and the blade fixed to the shaft and moving at a rate of movement, wherein the shaft's center rotates at a predetermined rate of rotation with a small radius of rotation rapidly, the rate of rotation being greater than the rate of movement. Thus the blade is pressed against and thus cuts a substrate and produces chips and the blade is disengaged from the substrate and the chips thus move in the direction in which the blade rotates and the chips are thus removed from between the cutting edge of the blade and the substrate. This can provide reduced working resistance and hence enhanced working efficiency and also prevent the blade surface from having significant frictional heat. Furthermore, the generated frictional heat can readily dissipate and the blade can thus have a long life.

Abstract: A resin seal apparatus includes a movable bottom die vertically moved by an elevator mechanism, a transport mechanism horizontally moving the movable bottom die having placed thereon a printed circuit board with a semiconductor chip mounted thereon, an intermediate die abutting against a periphery of the printed circuit board when the movable bottom die is moved upward, a film of resin stretched by a film stretch mechanism over the intermediate die and the printed circuit board, a die for a chip, pressing a back surface of the semiconductor chip via the film of resin, and a top die pressing a top surface of the intermediate die via the film of resin. This apparatus allows a PCB with a semiconductor chip mounted thereon in the form of a flip chip to be sealed with resin in a reduced period of time to fabricate an electronic component.

Abstract: A resin sealing method for sealing a gap between a substrate and a semiconductor chip mounted thereon includes the following steps: applying a predetermined amount of resin at and along the circumference of the semiconductor chip in such a manner so as to maintain a space between the resin and a side face of the semiconductor chip; reducing the pressure of the atmosphere around the substrate to exhaust air from the gap; reducing the viscosity of the applied resin to partially fill the gap with resin, thereby leaving a closed cavity reduced in pressure; pressurizing the atmosphere around the substrate to compress the closed cavity due to the pressure difference from the surrounding atmosphere to entirely fill the gap with resin. The exhausting of the air is very stable, and a concentration of resin at the corner of the semiconductor chip can be suppressed, thereby avoiding the spattering of resin onto the top of the chip.

Abstract: A polishing apparatus includes a polishing pad rotated by a surface place rotating shaft, a slurry conduit supplying slurry to an upper surface of the polishing pad, a substrate holding mechanism holding a substrate, a substrate rotating shaft rotating the substrate holding mechanism about a substrate axis and a rotating mechanism rotating the substrate axis about an eccentric axis. Angular velocity of rotation of the substrate axis about the eccentric axis is set larger than angular velocity of rotation of the substrate holding mechanism about the substrate axis. Thus, contact area between a small area on the substrate and the polishing pad is increased, bias wear of abrasive grains on the polishing pad is prevented, clogging of the polishing pad is suppressed, and new abrasive grains and new chemicals can be supplied with high efficiency to each area of the substrate. Thus, polishing rate is improved.

Abstract: The present invention provides a method of fabricating an electronic component, using a tool for pressing a chip against a substrate and heating the same, connecting a chip electrode and a substrate electrode together via a bump, placing the substrate in alignment with a die alignment plane for an upper die and a lower die, clamping the upper die and the lower die to form a cavity and exhausting the cavity via an exhaust hole to evacuate the same, and injecting melted resin into the cavity and curing the melted resin to provide sealing resin. Then, in a predetermined ambient at a predetermined temperature the substrate is pressed against a test board and a predetermined electrical signal is applied from the test board via an external electrode to the chip to test an operation of an electronic component configured on a unit region of the substrate and the chip. Thereafter, cutting along a virtual line completes the electronic component.

Abstract: In a method of coating a semiconductor wafer with a resin of the present invention, first, a semiconductor wafer is placed on a bottom surface of a cavity provided in a molding surface of a lower mold of a mold with its surface having a bump facing upward. Thereafter, a required amount of resin material is supplied to cavity, and a film for exposing the bump is applied to a molding surface of the upper one of the molds. In this state, molds are closed together. Resin material is heated to melt in cavity. Then, film is pressed against the bottom surface of cavity by a pressing member provided on the molding surface of the upper mold, so that film is abutted against a leading edge of bump in cavity. A pressure is applied to the resin in cavity through film, and the surface having the bump of semiconductor wafer is coated with resin. According to the method, pressing member is provided on the upper mold, so that melted resin does not enter a sliding portion.

Abstract: Resin sealed lead frames are processed by modular processing work stations related in number to a plurality of steps used in processing the lead or leads of the resin sealed lead frame. The work stations are separate modules which are detachably interconnected, whereby the number of modules can be exactly correlated to the number of steps actually required for processing the lead or leads of the resin sealed lead frame. As required, modules can be added or omitted. The resin sealed lead frame is sequentially advanced through the modules in steps corresponding to at least two pitches, whereby one pitch is defined as the on-center spacing between two neighboring products on the lead frame. Such feed advance permits performing at least two processing steps simultaneously. Thus, the method for processing the resin sealed lead frame and the apparatus therefore are adaptable to a change in the type of processing and to the production volume.

Abstract: Resin sealed lead frames are processed by modular processing work stations related in number to a plurality of steps used in processing the lead or leads of the resin sealed lead frame. The work stations are separate modules which are detachably interconnected, whereby the number of modules can be exactly correlated to the number of steps actually required for processing the lead or leads of the resin sealed lead frame. As required, modules can be added or omitted. The resin sealed lead frame is sequentially advanced through the modules in steps corresponding to at least two pitches, whereby one pitch is defined as the on-center spacing between two neighboring products on the lead frame. Such feed advance permits performing at least two processing steps simultaneously. Thus, the method for processing the resin sealed lead frame and the apparatus therefore are adaptable to a change in the type of processing and to the production volume.

Abstract: A nest mechanism which is arranged to support a substrate during a dicing process, and methods for using such a nest mechanism, are disclosed. According to one aspect of the present invention, a nest apparatus supports a substrate, which includes a chip, a first side, and a second side, during a dicing process, includes an alignment mechanism that positions the substrate with respect to the nest apparatus. The nest apparatus also includes a grid arrangement that defines an opening which receives a contact which is included on the second side of the substrate. In one embodiment, the alignment mechanism is an alignment pin that engages the substrate, as for example through an opening in the substrate, to hold the substrate.

Abstract: A method of and an apparatus for molding resin to seal electronic parts are adapted to use molding units to seal with molded resin materials electronic parts that are mounted on lead frames. Additional molding units are detachably mounted with respect to an already provided first molding unit in the molding apparatus, so that the number of the molding units can be arbitrarily adjusted. In this manner, the method and apparatus can be easily reconfigured or rearranged to be adapted to mass production or small production runs of the same or different types of molded parts. By simultaneously carrying out various process steps, the overall process time is reduced.